Xilinx - XQ7Z100-L2RF900I

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XQ7Z100-L2RF900I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ7Z100-L2RF900I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ7Z100-L2RF900I Datasheet
In Stock409
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 3.44 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 900
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 31 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: BGA
Width: 31 mm
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
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