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Manufacturer | Xilinx |
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Manufacturer's Part Number | XQR18V04VQ44N |
Description | CONFIGURATION MEMORY; Temperature Grade: OTHER; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE; Terminal Finish: Tin/Lead (Sn85Pb15); |
Datasheet | XQR18V04VQ44N Datasheet |
In Stock | 365 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .02 Amp |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Maximum Supply Current: | 50 mA |
Terminal Finish: | Tin/Lead (Sn85Pb15) |
No. of Terminals: | 44 |
Maximum Clock Frequency (fCLK): | 20 MHz |
Terminal Position: | QUAD |
Package Style (Meter): | FLATPACK |
Technology: | CMOS |
JESD-30 Code: | S-PQFP-G44 |
Package Shape: | SQUARE |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 100 Cel |
Endurance: | 2000 Write/Erase Cycles |
Package Code: | QFP |
Moisture Sensitivity Level (MSL): | 3 |
Memory Density: | 4194304 bit |
Memory IC Type: | CONFIGURATION MEMORY |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -55 Cel |
Type: | NOR TYPE |
Qualification: | Not Qualified |
Package Equivalence Code: | TQFP44,.47SQ,32 |
Minimum Data Retention Time: | 10 |
Peak Reflow Temperature (C): | 240 |
Parallel or Serial: | SERIAL |
Terminal Pitch: | .8 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 2.5/3.3,3.3 |