Xilinx - XQR18V04VQ44N

XQR18V04VQ44N by Xilinx

Image shown is a representation only.

Manufacturer Xilinx
Manufacturer's Part Number XQR18V04VQ44N
Description CONFIGURATION MEMORY; Temperature Grade: OTHER; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE; Terminal Finish: Tin/Lead (Sn85Pb15);
Datasheet XQR18V04VQ44N Datasheet
In Stock365
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .02 Amp
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 50 mA
Terminal Finish: Tin/Lead (Sn85Pb15)
No. of Terminals: 44
Maximum Clock Frequency (fCLK): 20 MHz
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: S-PQFP-G44
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 100 Cel
Endurance: 2000 Write/Erase Cycles
Package Code: QFP
Moisture Sensitivity Level (MSL): 3
Memory Density: 4194304 bit
Memory IC Type: CONFIGURATION MEMORY
JESD-609 Code: e0
Minimum Operating Temperature: -55 Cel
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: TQFP44,.47SQ,32
Minimum Data Retention Time: 10
Peak Reflow Temperature (C): 240
Parallel or Serial: SERIAL
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Power Supplies (V): 2.5/3.3,3.3
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
365 - -

Popular Products

Category Top Products