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Manufacturer | Xilinx |
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Manufacturer's Part Number | XQZU15EG-L1FFRC900I |
Description | PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: Tin/Lead (Sn/Pb); |
Datasheet | XQZU15EG-L1FFRC900I Datasheet |
In Stock | 155 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .808 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | .85 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 3.62 mm |
Surface Mount: | YES |
Terminal Finish: | Tin/Lead (Sn/Pb) |
No. of Terminals: | 900 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B900 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 100 Cel |
Package Code: | BGA |
Width: | 31 mm |
Moisture Sensitivity Level (MSL): | 4 |
Peripheral IC Type: | PROGRAMMABLE SoC |
Maximum Supply Voltage: | .892 V |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA900,30X30,40 |
Length: | 31 mm |
Peak Reflow Temperature (C): | 245 |
Terminal Pitch: | 1 mm |