Xilinx - XQZU19EG-1FFRB1517M

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XQZU19EG-1FFRB1517M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQZU19EG-1FFRB1517M
Description FPGA SOC; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;
Datasheet XQZU19EG-1FFRB1517M Datasheet
In Stock394
NAME DESCRIPTION
Minimum Supply Voltage: .825 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 40 s
Maximum Seated Height: 3.71 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 1517
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1517
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 40 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA SOC
Maximum Supply Voltage: .876 V
Nominal Supply Voltage (V): 0.85
No. of Logic Cells: 1143450
No. of CLBs: 65340
JESD-609 Code: e0
Minimum Operating Temperature: -55 °C (-67 °F)
Package Equivalence Code: BGA1517,40X40,40
Finishing Of Terminal Used: Tin/Lead
Length: 40 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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