Xilinx - XQZU19EG-1FFRC1760M

XQZU19EG-1FFRC1760M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQZU19EG-1FFRC1760M
Description FPGA SOC; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1760;
Datasheet XQZU19EG-1FFRC1760M Datasheet
In Stock403
NAME DESCRIPTION
Minimum Supply Voltage: .825 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 40 s
Maximum Seated Height: 3.71 mm
No. of Inputs: 512
Surface Mount: Yes
No. of Outputs: 512
Position Of Terminal: Bottom
No. of Terminals: 1760
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1760
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA SOC
Maximum Supply Voltage: .876 V
Nominal Supply Voltage (V): 0.85
No. of Logic Cells: 1143450
No. of CLBs: 65340
JESD-609 Code: e0
Minimum Operating Temperature: -55 °C (-67 °F)
Package Equivalence Code: BGA1760,42.5X42.5,40
Finishing Of Terminal Used: Tin/Lead
Length: 42.5 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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