Xilinx - XQZU29DR-L1FFRF1760I

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XQZU29DR-L1FFRF1760I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQZU29DR-L1FFRF1760I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQZU29DR-L1FFRF1760I Datasheet
In Stock485
NAME DESCRIPTION
Minimum Supply Voltage: .808 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .85 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Supply Voltage: .892 V
Surface Mount: YES
Terminal Finish: Tin/Lead (Sn/Pb)
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
No. of Terminals: 1760
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Screening Level: MIL-PRF-38535
Technology: CMOS
JESD-30 Code: S-PBGA-B1760
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Peak Reflow Temperature (C): 245
Package Code: BGA
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 4
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