Xilinx - XQZU3EG-L1SFRC784I

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XQZU3EG-L1SFRC784I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQZU3EG-L1SFRC784I
Description PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;
Datasheet XQZU3EG-L1SFRC784I Datasheet
In Stock483
NAME DESCRIPTION
Minimum Supply Voltage: .808 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .85 V
Maximum Time At Peak Reflow Temperature (s): 20
Maximum Seated Height: 3.52 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 784
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B784
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: FBGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: PROGRAMMABLE SoC
Maximum Supply Voltage: .892 V
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA784,28X28,32
Length: 23 mm
Peak Reflow Temperature (C): 220
Terminal Pitch: .8 mm
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