Xilinx - XQZU5EV-1FFRB900M

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XQZU5EV-1FFRB900M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQZU5EV-1FFRB900M
Description PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Width: 31 mm;
Datasheet XQZU5EV-1FFRB900M Datasheet
In Stock270
NAME DESCRIPTION
Minimum Supply Voltage: .808 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .85 V
Maximum Seated Height: 3.71 mm
Surface Mount: YES
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 900
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: PROGRAMMABLE SoC
Maximum Supply Voltage: .892 V
JESD-609 Code: e0
Minimum Operating Temperature: -55 Cel
Package Equivalence Code: BGA900,30X30,40
Length: 31 mm
Peak Reflow Temperature (C): 225
Terminal Pitch: 1 mm
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