Part | RoHS | Manufacturer | Amplifier Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Nominal Unity Gain Bandwidth | Maximum Negative Supply Voltage Limit | Low-Bias | Maximum Input Offset Voltage | Maximum Average Bias Current (IIB) | Surface Mount | No. of Functions | Minimum Common Mode Reject Ratio | Technology | Screening Level | Nominal Common Mode Reject Ratio | Maximum Supply Current | Nominal Negative Supply Voltage (Vsup) | Architecture | Programmable Power | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Slew Rate | Sub-Category | Nominal Slow Rate | Maximum Supply Voltage Limit | Terminal Pitch | Maximum Operating Temperature | Maximum Bias Current (IIB) @25C | Frequency Compensation | Minimum Voltage Gain | Minimum Operating Temperature | Terminal Finish | Terminal Position | Low-Offset | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Minimum Output Current | Nominal Bandwidth (3dB) | Micropower | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Wideband | Power |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
-7 V |
8 mV |
25 uA |
No |
1 |
Bipolar |
26 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
0.7 V/us |
Buffer Amplifiers |
1.2 V/us |
7 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
25 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
50 mA |
550 MHz |
e0 |
|||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 mV |
800 nA |
Yes |
2 |
BICMOS |
1 mA |
4.5 V |
4.5/16 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
4 V/us |
Buffer Amplifiers |
6 V/us |
18 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
600 nA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
0.057 in (1.45 mm) |
0.065 in (1.65 mm) |
No |
6 MHz |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
-18 V |
2 mV |
5 uA |
No |
1 |
Bipolar |
MIL-STD-883 |
8.5 mA |
-5 V |
5 V |
±5/±15 V |
In-Line |
DIP8,.3 |
2000 V/us |
Buffer Amplifiers |
18 V |
0.1 in (2.54 mm) |
125 °C (257 °F) |
5 uA |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T8 |
No |
e0 |
|||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
40 mV |
10 uA |
Yes |
3 |
30 mA |
-5 V |
Tape And Reel |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Buffer Amplifiers |
1350 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
550 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
12 mV |
1.5 μA |
Yes |
1 |
CMOS |
16 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
8 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
10 mA |
5 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
|||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
5 |
CMOS |
Tape And Reel |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0.256 in (6.5 mm) |
|||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
4 |
CMOS |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
70 mV |
Yes |
3 |
Bipolar |
-5 V |
Tape And Reel |
5 V |
Small Outline, Shrink Pitch |
Buffer Amplifiers |
2500 V/us |
6.6 V |
0.025 in (0.635 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.068 in (1.727 mm) |
0.154 in (3.899 mm) |
No |
650 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.89 mm) |
|||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
27 mV |
9.5 uA |
Yes |
3 |
30 mA |
-5 V |
Tape And Reel |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Buffer Amplifiers |
1600 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
9.5 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
600 MHz |
e0 |
240 °C (464 °F) |
0.197 in (5 mm) |
||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-18 V |
4 mV |
10 uA |
No |
1 |
Bipolar |
8.5 mA |
-15 V |
15 V |
±5/±15 V |
In-Line |
DIP8,.3 |
2000 V/us |
Buffer Amplifiers |
3000 V/us |
18 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
5 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
50 mA |
110 MHz |
e0 |
0.389 in (9.88 mm) |
||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
40 mV |
10 uA |
Yes |
3 |
30 mA |
-5 V |
Tape And Reel |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Buffer Amplifiers |
1350 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
550 MHz |
e0 |
240 °C (464 °F) |
0.197 in (5 mm) |
||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
6 |
CMOS |
Tape And Reel, 7 inch |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.307 in (7.8 mm) |
||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Other |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
Tape And Reel |
10 V |
In-Line |
DIP8,.3 |
75 V/us |
Buffer Amplifiers |
22 V |
0.1 in (2.54 mm) |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T8 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.4 in (10.16 mm) |
|||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 mV |
800 nA |
Yes |
2 |
BICMOS |
1 mA |
4.5 V |
4.5/16 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
4 V/us |
Buffer Amplifiers |
6 V/us |
18 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
600 nA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
6 MHz |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
20 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
3.2 mV |
Yes |
1 |
145 mA |
Tape And Reel |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.12X.16,20 |
10 V/us |
5.25 V |
0.02 in (0.5 mm) |
105 °C (221 °F) |
13 uA |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
100 mA |
1600 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
5 |
CMOS |
Tape And Reel, 7 inch |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0.256 in (6.5 mm) |
|||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
27 mV |
9.5 uA |
Yes |
3 |
30 mA |
-5 V |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Buffer Amplifiers |
1600 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
9.5 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
600 MHz |
e0 |
240 °C (464 °F) |
0.197 in (5 mm) |
|||||||||||||||||||||
Analog Devices |
Buffer |
No Lead |
6 |
DIE |
Rectangular |
-18 V |
15 mV |
Yes |
1 |
FET |
25 mA |
-15 V |
15 V |
Uncased Chip |
180 V/us |
18 V |
Tin Lead |
Upper |
R-XUUC-N6 |
No |
e0 |
||||||||||||||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
10 mV |
800 nA |
Yes |
8 |
BICMOS |
8 mA |
4.5 V |
4.5/16 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
4 V/us |
Buffer Amplifiers |
6 V/us |
18 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
600 nA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
6 MHz |
e0 |
0.256 in (6.5 mm) |
|||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
27 mV |
9.5 uA |
Yes |
3 |
30 mA |
-5 V |
Tape And Reel, 7 inch |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Buffer Amplifiers |
1600 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
9.5 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
600 MHz |
e0 |
240 °C (464 °F) |
0.197 in (5 mm) |
||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
5 |
CMOS |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0.256 in (6.5 mm) |
||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
-6.3 V |
20 mV |
10 uA |
Yes |
2 |
-5 V |
Tape And Reel |
5 V |
Small Outline |
Buffer Amplifiers |
800 V/us |
6.3 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
260 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
6 |
CMOS |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
0.307 in (7.8 mm) |
|||||||||||||||||||||||||||
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
-7 V |
8 mV |
35 uA |
No |
1 |
Bipolar |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
1500 V/us |
Buffer Amplifiers |
2200 V/us |
7 V |
0.1 in (2.54 mm) |
125 °C (257 °F) |
35 uA |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T8 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
40 mA |
80 MHz |
e0 |
0.52 in (13.21 mm) |
|||||||||||||||||||||
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
-18 V |
1 mV |
5 uA |
No |
1 |
Bipolar |
38535Q/M;38534H;883B |
8.5 mA |
-15 V |
15 V |
±5/±15 V |
In-Line |
DIP8,.3 |
2000 V/us |
Buffer Amplifiers |
3000 V/us |
18 V |
0.1 in (2.54 mm) |
125 °C (257 °F) |
5 uA |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
50 mA |
110 MHz |
e0 |
||||||||||||||||||||
Analog Devices |
Buffer |
Other |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
10 V |
In-Line |
DIP8,.3 |
75 V/us |
Buffer Amplifiers |
22 V |
0.1 in (2.54 mm) |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.4 in (10.16 mm) |
||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
4 |
CMOS |
Tape And Reel |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||||||||||||
Analog Devices |
Buffer |
Military |
Flat |
16 |
DFP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
MIL-PRF-38535 Class V |
3.3 V |
Flatpack |
Buffer Amplifiers |
6 V |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-CDFP-F16 |
Yes |
|||||||||||||||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
70 mV |
Yes |
3 |
Bipolar |
-5 V |
5 V |
Small Outline, Shrink Pitch |
Buffer Amplifiers |
2500 V/us |
6.6 V |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.068 in (1.727 mm) |
0.154 in (3.899 mm) |
No |
650 MHz |
e0 |
0.193 in (4.89 mm) |
|||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
27 mV |
9.5 uA |
Yes |
3 |
30 mA |
-5 V |
Tape And Reel |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Buffer Amplifiers |
1600 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
9.5 uA |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
600 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
6 |
DIE |
Rectangular |
41 mV |
Yes |
1 |
1.8 mA |
15 V |
Uncased Chip |
DIE OR CHIP |
415 V/us |
18 V |
85 °C (185 °F) |
-40 °C (-40 °F) |
Upper |
R-XUUC-N6 |
0.019 in (0.4826 mm) |
0.018 in (0.46 mm) |
182 MHz |
0.021 in (0.525 mm) |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
70 mV |
Yes |
3 |
Bipolar |
-5 V |
5 V |
Small Outline, Shrink Pitch |
Buffer Amplifiers |
2500 V/us |
6.6 V |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.068 in (1.727 mm) |
0.154 in (3.899 mm) |
No |
650 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.89 mm) |
||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Commercial |
No Lead |
20 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
3.2 mV |
Yes |
1 |
145 mA |
Tape And Reel |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.12X.16,20 |
10 V/us |
5.25 V |
0.02 in (0.5 mm) |
70 °C (158 °F) |
13 uA |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
100 mA |
1600 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||||||||||||
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
-7 V |
8 mV |
No |
1 |
Bipolar |
38535Q/M;38534H;883B |
26 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
700 V/us |
Buffer Amplifiers |
7 V |
0.1 in (2.54 mm) |
125 °C (257 °F) |
25 uA |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
50 mA |
750 MHz |
e0 |
||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
-6.3 V |
20 mV |
10 uA |
Yes |
2 |
11.5 mA |
-5 V |
5 V |
±3/±5 V |
Small Outline |
SOP8,.25 |
Buffer Amplifiers |
800 V/us |
6.3 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
6 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
260 MHz |
e0 |
240 °C (464 °F) |
0.193 in (4.9 mm) |
|||||||||||||||||||||
Analog Devices |
Buffer |
Military |
Flat |
16 |
DFP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
MIL-PRF-38535 Class V |
0 V |
3.3 V |
Flatpack |
Buffer Amplifiers |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-CDFP-F16 |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
20 mV |
50 nA |
Yes |
6 |
CMOS |
Tape And Reel |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
7 V/us |
7 V |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0.307 in (7.8 mm) |
||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
48 |
HVQCCN |
Rectangular |
15 mV |
1.5 μA |
Yes |
18 |
16 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
6 V/us |
18 V |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
150 mA |
4.5 MHz |
e3 |
0.276 in (7 mm) |
||||||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
-7 V |
8 mV |
35 uA |
No |
1 |
Bipolar |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
1500 V/us |
Buffer Amplifiers |
2200 V/us |
7 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
35 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-CDIP-T8 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
40 mA |
80 MHz |
e0 |
0.52 in (13.21 mm) |
|||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Gull Wing |
48 |
LFQFP |
Rectangular |
Plastic/Epoxy |
15 mV |
1.5 μA |
Yes |
18 |
Tape And Reel |
16 V |
Flatpack, Low Profile, Fine Pitch |
6 V/us |
18 V |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
150 mA |
4.5 MHz |
e3 |
0.276 in (7 mm) |
||||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
-18 V |
4 mV |
10 uA |
Yes |
1 |
Bipolar |
8.5 mA |
-15 V |
Tape And Reel, 7 inch |
15 V |
Small Outline |
2000 V/us |
3000 V/us |
18 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
50 mA |
110 MHz |
e0 |
0.193 in (4.9 mm) |
|||||||||||||||||||||||
Analog Devices |
Buffer |
No Lead |
6 |
DIE |
Rectangular |
-18 V |
6 mV |
Yes |
1 |
FET |
25 mA |
-15 V |
15 V |
Uncased Chip |
220 V/us |
18 V |
Tin Lead |
Upper |
R-XUUC-N6 |
No |
e0 |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
No Lead |
48 |
HVQCCN |
Rectangular |
15 mV |
1.5 μA |
Yes |
12 |
15 mA |
16 V |
16 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Buffer Amplifiers |
6 V/us |
18 V |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
R-XQCC-N48 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
250 mA |
4.5 MHz |
0.276 in (7 mm) |
|||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Other |
Through-Hole |
5 |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
Tape And Reel |
10 V |
Flange Mount |
ZIP5,.15,.17,67TB |
75 V/us |
Buffer Amplifiers |
22 V |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Matte Tin - annealed |
Zig-Zag |
R-PZFM-T5 |
No |
e3 |
||||||||||||||||||||||||||||
Analog Devices |
Buffer |
Other |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
Tape And Reel |
10 V |
In-Line |
DIP8,.3 |
75 V/us |
Buffer Amplifiers |
22 V |
0.1 in (2.54 mm) |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T8 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.4 in (10.16 mm) |
||||||||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
-18 V |
4 mV |
10 uA |
Yes |
1 |
Bipolar |
8.5 mA |
-15 V |
15 V |
±5/±15 V |
Small Outline |
SOP8,.25 |
2000 V/us |
Buffer Amplifiers |
3000 V/us |
18 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
5 uA |
-40 °C (-40 °F) |
Tin/Lead |
Dual |
R-PDSO-G8 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
50 mA |
110 MHz |
e0 |
20 s |
235 °C (455 °F) |
0.193 in (4.9 mm) |
||||||||||||||||||
Analog Devices |
Buffer |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
-7 V |
8 mV |
25 uA |
Yes |
1 |
Bipolar |
26 mA |
-5 V |
Tape And Reel |
5 V |
±5 V |
Small Outline |
SOP8,.25 |
0.7 V/us |
Buffer Amplifiers |
1200 V/us |
7 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
25 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
50 mA |
120 MHz |
e0 |
0.193 in (4.9 mm) |
|||||||||||||||||||
|
Analog Devices |
Buffer |
Other |
Through-Hole |
5 |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
10 V |
Flange Mount |
ZIP5,.15,.17,67TB |
75 V/us |
22 V |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Matte Tin - annealed |
Zig-Zag |
R-PZFM-T5 |
e3 |
Buffer amplifiers are electronic circuits that are designed to provide a high input impedance and a low output impedance. They are used to isolate one part of a circuit from another, preventing changes in one part of the circuit from affecting the other.
The primary function of a buffer amplifier is to prevent loading effects, which occur when a device with a low input impedance is connected to a device with a high output impedance. In this scenario, the high output impedance of the first device may cause a decrease in signal strength or distortion in the second device.
By using a buffer amplifier, the high output impedance of the first device is isolated from the second device, ensuring that the signal is transferred with minimal distortion. The buffer amplifier acts as a bridge between the two devices, allowing them to operate independently.
Buffer amplifiers are commonly used in audio applications, such as preamplifiers, where they can be used to isolate a sensitive input signal from a power amplifier that requires a low impedance input. They are also used in other applications, such as instrumentation, signal conditioning, and data acquisition, where signal integrity is critical.