Through-Hole Buffer Amplifiers 121
| Part | RoHS | Manufacturer | Amplifier Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Nominal Unity Gain Bandwidth | Maximum Negative Supply Voltage Limit | Low-Bias | Maximum Input Offset Voltage | Maximum Average Bias Current (IIB) | Surface Mount | No. of Functions | Minimum Common Mode Reject Ratio | Technology | Screening Level | Nominal Common Mode Reject Ratio | Maximum Supply Current | Nominal Negative Supply Voltage (Vsup) | Architecture | Programmable Power | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Slew Rate | Sub-Category | Nominal Slow Rate | Maximum Supply Voltage Limit | Terminal Pitch | Maximum Operating Temperature | Maximum Bias Current (IIB) @25C | Frequency Compensation | Minimum Voltage Gain | Minimum Operating Temperature | Terminal Finish | Terminal Position | Low-Offset | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Minimum Output Current | Nominal Bandwidth (3dB) | Micropower | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Wideband | Power |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
-7 V |
8 mV |
25 uA |
No |
1 |
Bipolar |
26 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
0.7 V/us |
Buffer Amplifiers |
1.2 V/us |
7 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
25 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
50 mA |
550 MHz |
e0 |
|||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
-18 V |
2 mV |
5 uA |
No |
1 |
Bipolar |
MIL-STD-883 |
8.5 mA |
-5 V |
5 V |
±5/±15 V |
In-Line |
DIP8,.3 |
2000 V/us |
Buffer Amplifiers |
18 V |
0.1 in (2.54 mm) |
125 °C (257 °F) |
5 uA |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T8 |
No |
e0 |
|||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
12 |
QIP |
Square |
Metal |
18 mV |
No |
1 |
Hybrid |
MIL-STD-883 Class B (Modified) |
20 mA |
-5 V |
5 V |
±5 V |
In-Line |
QUAD12,.4SQ |
1000 V/us |
Buffer Amplifiers |
0.1 in (2.54 mm) |
125 °C (257 °F) |
20 uA |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-MQIP-T12 |
No |
200 MHz |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Other |
Through-Hole |
12 |
QIP |
Square |
Metal |
25 mV |
No |
1 |
Hybrid |
16 mA |
-5 V |
5 V |
±5 V |
In-Line |
QUAD12,.4SQ |
1000 V/us |
Buffer Amplifiers |
0.1 in (2.54 mm) |
85 °C (185 °F) |
25 uA |
-25 °C (-13 °F) |
Tin/Lead |
Quad |
S-MQIP-T12 |
No |
200 MHz |
e0 |
||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-18 V |
4 mV |
10 uA |
No |
1 |
Bipolar |
8.5 mA |
-15 V |
15 V |
±5/±15 V |
In-Line |
DIP8,.3 |
2000 V/us |
Buffer Amplifiers |
3000 V/us |
18 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
5 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
50 mA |
110 MHz |
e0 |
0.389 in (9.88 mm) |
||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
12 |
QIP |
Square |
Metal |
15 mV |
No |
1 |
Hybrid |
MIL-STD-883 Class B (Modified) |
25 mA |
-15 V |
15 V |
±15 V |
In-Line |
QUAD12,.4SQ |
1000 V/us |
Buffer Amplifiers |
0.1 in (2.54 mm) |
125 °C (257 °F) |
150 pA |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-MQIP-T12 |
No |
100 MHz |
e0 |
|||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Other |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
Tape And Reel |
10 V |
In-Line |
DIP8,.3 |
75 V/us |
Buffer Amplifiers |
22 V |
0.1 in (2.54 mm) |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T8 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.4 in (10.16 mm) |
|||||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
-7 V |
8 mV |
35 uA |
No |
1 |
Bipolar |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
1500 V/us |
Buffer Amplifiers |
2200 V/us |
7 V |
0.1 in (2.54 mm) |
125 °C (257 °F) |
35 uA |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T8 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
40 mA |
80 MHz |
e0 |
0.52 in (13.21 mm) |
|||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
-18 V |
1 mV |
5 uA |
No |
1 |
Bipolar |
38535Q/M;38534H;883B |
8.5 mA |
-15 V |
15 V |
±5/±15 V |
In-Line |
DIP8,.3 |
2000 V/us |
Buffer Amplifiers |
3000 V/us |
18 V |
0.1 in (2.54 mm) |
125 °C (257 °F) |
5 uA |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
50 mA |
110 MHz |
e0 |
||||||||||||||||||||
|
Analog Devices |
Buffer |
Other |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
10 V |
In-Line |
DIP8,.3 |
75 V/us |
Buffer Amplifiers |
22 V |
0.1 in (2.54 mm) |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.4 in (10.16 mm) |
||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
12 |
QIP |
Square |
Metal |
15 mV |
No |
1 |
Hybrid |
38535Q/M;38534H;883B |
22 mA |
-15 V |
15 V |
±15 V |
In-Line |
QUAD12,.4SQ |
1000 V/us |
Buffer Amplifiers |
0.1 in (2.54 mm) |
125 °C (257 °F) |
150 pA |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-MQIP-T12 |
No |
e0 |
||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
-7 V |
8 mV |
No |
1 |
Bipolar |
38535Q/M;38534H;883B |
26 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
700 V/us |
Buffer Amplifiers |
7 V |
0.1 in (2.54 mm) |
125 °C (257 °F) |
25 uA |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
50 mA |
750 MHz |
e0 |
||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
-7 V |
8 mV |
35 uA |
No |
1 |
Bipolar |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
1500 V/us |
Buffer Amplifiers |
2200 V/us |
7 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
35 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-CDIP-T8 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
40 mA |
80 MHz |
e0 |
0.52 in (13.21 mm) |
|||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
12 |
QIP |
Square |
Metal |
25 mV |
No |
1 |
Hybrid |
38535Q/M;38534H;883B |
16 mA |
-15 V |
15 V |
±15 V |
In-Line |
QUAD12,.4SQ |
1000 V/us |
Buffer Amplifiers |
0.1 in (2.54 mm) |
125 °C (257 °F) |
20 uA |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-MQIP-T12 |
No |
125 MHz |
e0 |
|||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Other |
Through-Hole |
5 |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
Tape And Reel |
10 V |
Flange Mount |
ZIP5,.15,.17,67TB |
75 V/us |
Buffer Amplifiers |
22 V |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Matte Tin - annealed |
Zig-Zag |
R-PZFM-T5 |
No |
e3 |
||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Other |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
Tape And Reel |
10 V |
In-Line |
DIP8,.3 |
75 V/us |
Buffer Amplifiers |
22 V |
0.1 in (2.54 mm) |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T8 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.4 in (10.16 mm) |
||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Other |
Through-Hole |
5 |
Rectangular |
Plastic/Epoxy |
-22 V |
800 uA |
No |
1 |
Bipolar |
10 mA |
-10 V |
10 V |
Flange Mount |
ZIP5,.15,.17,67TB |
75 V/us |
22 V |
100 °C (212 °F) |
500 uA |
0 °C (32 °F) |
Matte Tin - annealed |
Zig-Zag |
R-PZFM-T5 |
e3 |
|||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-7 V |
8 mV |
25 uA |
No |
1 |
Bipolar |
26 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
0.7 V/us |
Buffer Amplifiers |
1200 V/us |
7 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
25 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
50 mA |
120 MHz |
e0 |
0.389 in (9.88 mm) |
||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
-18 V |
2 mV |
5 uA |
No |
1 |
Bipolar |
-5 V |
5 V |
In-Line |
18 V |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-CDIP-T8 |
No |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
-5 V |
5 V |
In-Line |
1500 V/us |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
100 mA |
350 MHz |
e0 |
245 °C (473 °F) |
0.369 in (9.375 mm) |
|||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
-5 V |
5 V |
In-Line |
1300 V/us |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
70 mA |
330 MHz |
e0 |
245 °C (473 °F) |
0.369 in (9.375 mm) |
||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
-5 V |
5 V |
In-Line |
1600 V/us |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
70 mA |
310 MHz |
e0 |
245 °C (473 °F) |
|||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
-5 V |
5 V |
In-Line |
1800 V/us |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
100 mA |
380 MHz |
e0 |
245 °C (473 °F) |
0.369 in (9.375 mm) |
|||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
-5 V |
5 V |
In-Line |
1300 V/us |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
70 mA |
330 MHz |
e0 |
245 °C (473 °F) |
|||||||||||||||||||||||||||||
|
Analog Devices |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
-5 V |
5 V |
In-Line |
1600 V/us |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
70 mA |
310 MHz |
e0 |
245 °C (473 °F) |
0.369 in (9.375 mm) |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
Bipolar |
5 V |
In-Line |
DIP8,.3 |
12 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-PDIP-T8 |
0.165 in (4.2 mm) |
0.3 in (7.62 mm) |
0.374 in (9.5 mm) |
|||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
8 mV |
No |
1 |
Bipolar |
43 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
350 V/us |
Buffer Amplifiers |
0.1 in (2.54 mm) |
85 °C (185 °F) |
2 nA |
-40 °C (-40 °F) |
Tin/Lead |
Dual |
R-PDIP-T8 |
No |
110 MHz |
e0 |
||||||||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
5 uA |
No |
4 |
Bipolar |
120 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP16,.3 |
Buffer Amplifiers |
200 V/us |
6 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
3 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
20 mA |
100 MHz |
e0 |
0.755 in (19.175 mm) |
||||||||||||||||||||
|
|
Maxim Integrated |
Buffer |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
3 mV |
5 uA |
No |
4 |
CMOS |
-5 V |
5 V |
In-Line |
1100 V/us |
Buffer Amplifiers |
1500 V/us |
6 V |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
66 mA |
275 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.755 in (19.175 mm) |
||||||||||||||||||||
|
|
Maxim Integrated |
Buffer |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
3 mV |
5 uA |
No |
4 |
CMOS |
-5 V |
5 V |
In-Line |
1150 V/us |
Buffer Amplifiers |
1600 V/us |
6 V |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
66 mA |
375 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.755 in (19.175 mm) |
||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Military |
Through-Hole |
12 |
QIP |
Square |
Metal |
15 mV |
No |
1 |
Hybrid |
MIL-STD-883 Class B (Modified) |
22 mA |
-15 V |
15 V |
±15 V |
In-Line |
QUAD12,.4SQ |
1000 V/us |
Buffer Amplifiers |
0.1 in (2.54 mm) |
125 °C (257 °F) |
2.5 nA |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-MQIP-T12 |
No |
100 MHz |
e0 |
|||||||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
5 uA |
No |
3 |
Bipolar |
100 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP16,.3 |
Buffer Amplifiers |
200 V/us |
6 V |
0.1 in (2.54 mm) |
70 °C (158 °F) |
3 uA |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
20 mA |
100 MHz |
e0 |
0.755 in (19.175 mm) |
||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
5 uA |
No |
3 |
Bipolar |
100 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP16,.3 |
Buffer Amplifiers |
300 V/us |
6 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
3 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
20 mA |
90 MHz |
e0 |
0.755 in (19.175 mm) |
||||||||||||||||||||
|
|
Maxim Integrated |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
3 mV |
5 uA |
No |
1 |
CMOS |
12 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
800 V/us |
Buffer Amplifiers |
1300 V/us |
6 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
3 uA |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
100 mA |
330 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.369 in (9.375 mm) |
||||||||||||||||
|
Maxim Integrated |
Buffer |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
3 mV |
5 uA |
No |
4 |
CMOS |
45 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP16,.3 |
1150 V/us |
Buffer Amplifiers |
1600 V/us |
6 V |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
66 mA |
375 MHz |
e0 |
245 °C (473 °F) |
0.755 in (19.175 mm) |
||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
5 uA |
No |
4 |
Bipolar |
120 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP16,.3 |
Buffer Amplifiers |
300 V/us |
6 V |
0.1 in (2.54 mm) |
70 °C (158 °F) |
3 uA |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
20 mA |
90 MHz |
e0 |
0.755 in (19.175 mm) |
||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
5 uA |
No |
4 |
Bipolar |
120 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP16,.3 |
Buffer Amplifiers |
200 V/us |
6 V |
0.1 in (2.54 mm) |
70 °C (158 °F) |
3 uA |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
20 mA |
100 MHz |
e0 |
0.755 in (19.175 mm) |
||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
3 mV |
5 uA |
No |
1 |
CMOS |
12 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
800 V/us |
Buffer Amplifiers |
1300 V/us |
6 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
3 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
100 mA |
330 MHz |
e0 |
0.369 in (9.375 mm) |
|||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
3 mV |
5 uA |
No |
1 |
CMOS |
12 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
900 V/us |
Buffer Amplifiers |
1600 V/us |
6 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
3 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
100 mA |
310 MHz |
e0 |
0.369 in (9.375 mm) |
|||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
8 mV |
4 uA |
No |
1 |
Bipolar |
43 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
350 V/us |
Buffer Amplifiers |
650 V/us |
6 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
2 nA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
60 mA |
180 MHz |
e0 |
0.369 in (9.375 mm) |
|||||||||||||||||||
|
Maxim Integrated |
Buffer |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
5 uA |
No |
3 |
Bipolar |
100 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP16,.3 |
Buffer Amplifiers |
300 V/us |
6 V |
0.1 in (2.54 mm) |
70 °C (158 °F) |
3 uA |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
20 mA |
90 MHz |
e0 |
0.755 in (19.175 mm) |
||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Military |
Through-Hole |
12 |
QIP |
Square |
Metal |
15 mV |
No |
1 |
Hybrid |
MIL-STD-883 Class B (Modified) |
22 mA |
±5/±15 V |
In-Line |
QUAD12,.4SQ |
1000 V/us |
Buffer Amplifiers |
0.1 in (2.54 mm) |
125 °C (257 °F) |
1.5 nA |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-MQIP-T12 |
No |
100 MHz |
e0 |
|||||||||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
-6 V |
3 mV |
5 uA |
No |
1 |
CMOS |
14 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
800 V/us |
Buffer Amplifiers |
1300 V/us |
6 V |
0.1 in (2.54 mm) |
125 °C (257 °F) |
3 uA |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
100 mA |
330 MHz |
e0 |
||||||||||||||||||||
|
|
Maxim Integrated |
Buffer |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
3 mV |
5 uA |
No |
1 |
CMOS |
-5 V |
5 V |
In-Line |
1600 V/us |
6 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
100 mA |
310 MHz |
e3 |
30 s |
260 °C (500 °F) |
0.369 in (9.375 mm) |
||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
6.5 mV |
4 uA |
No |
1 |
Bipolar |
43 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
350 V/us |
Buffer Amplifiers |
650 V/us |
6 V |
0.1 in (2.54 mm) |
70 °C (158 °F) |
2 nA |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
60 mA |
180 MHz |
e0 |
0.369 in (9.375 mm) |
|||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
5 uA |
No |
4 |
Bipolar |
120 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP16,.3 |
Buffer Amplifiers |
300 V/us |
6 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
3 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
20 mA |
90 MHz |
e0 |
0.755 in (19.175 mm) |
||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
-6 V |
3 mV |
5 uA |
No |
4 |
CMOS |
45 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP16,.3 |
1100 V/us |
Buffer Amplifiers |
1500 V/us |
6 V |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
66 mA |
275 MHz |
e0 |
245 °C (473 °F) |
0.755 in (19.175 mm) |
||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
-6 V |
3 mV |
5 uA |
No |
1 |
CMOS |
14 mA |
-5 V |
5 V |
±5 V |
In-Line |
DIP8,.3 |
900 V/us |
Buffer Amplifiers |
1600 V/us |
6 V |
0.1 in (2.54 mm) |
125 °C (257 °F) |
3 uA |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
100 mA |
310 MHz |
e0 |
Buffer amplifiers are electronic circuits that are designed to provide a high input impedance and a low output impedance. They are used to isolate one part of a circuit from another, preventing changes in one part of the circuit from affecting the other.
The primary function of a buffer amplifier is to prevent loading effects, which occur when a device with a low input impedance is connected to a device with a high output impedance. In this scenario, the high output impedance of the first device may cause a decrease in signal strength or distortion in the second device.
By using a buffer amplifier, the high output impedance of the first device is isolated from the second device, ensuring that the signal is transferred with minimal distortion. The buffer amplifier acts as a bridge between the two devices, allowing them to operate independently.
Buffer amplifiers are commonly used in audio applications, such as preamplifiers, where they can be used to isolate a sensitive input signal from a power amplifier that requires a low impedance input. They are also used in other applications, such as instrumentation, signal conditioning, and data acquisition, where signal integrity is critical.