DIE Analog-to-Digital Converters 186

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7576ACHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

18

DIE

1

Yes

2.46 V

1

CMOS

8

5 V

Binary

Uncased Chip

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Upper

20 µs

X-XUUC-N18

No

e0

AD7891ACHIPS-1

Analog Devices

Analog To Digital Converter, Proprietary Method

No Lead

DIE

8

Yes

10 V

454.5 kHz

1

12

0.0244 %

5 V

Binary, 2's Complement Binary

Uncased Chip

-10 V

Serial, Parallel, Word

Track

Upper

1.6 µs

X-XUUC-N

No

AD7418ACHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

No Lead

DIE

1

Yes

2.625 V

1

10

0.0977 %

3 V

2's Complement Binary

Uncased Chip

0 mV

Serial

Track

Upper

15 µs

X-XUUC-N

No

AD7417-WAFER

Analog Devices

Analog To Digital Converter, Successive Approximation

No Lead

DIE

4

Yes

2.625 V

1

10

0.0977 %

3 V

2's Complement Binary

Uncased Chip

0 mV

Serial

Track

Upper

15 µs

X-XUUC-N

No

AD7821TCHIPS

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

20

DIE

1

Yes

2.5 V

1 MHz

1

BICMOS

8

0.3906 %

5 V

Binary, Offset Binary

-5 V

Uncased Chip

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Upper

660 ns

X-XUUC-N20

No

AD4003-KGD-WP

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

15

DIE

Rectangular

1

Yes

5.1 V

2 MHz

1

18

0.0004 %

1.8 V

2's Complement Binary

Uncased Chip

125 °C (257 °F)

-2.4 V

Serial

-40 °C (-40 °F)

Upper

320 ns

R-XUUC-N15

0.016 in (0.41 mm)

0.067 in (1.695 mm)

0.09 in (2.285 mm)

AD7466-KGD-DF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

6

DIE

Rectangular

1

Yes

3.6 V

100 kHz

1

CMOS

12

0.0366 %

2.5 V

Binary

1.8/3.3 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Track

Upper

4.7 ms

R-XUUC-N6

0.035 in (0.88 mm)

No

0.086 in (2.18 mm)

AD7810YCHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

8

DIE

1

Yes

5.5 V

350 kHz

1

10

0.0977 %

3 V

Binary

Uncased Chip

105 °C (221 °F)

0 mV

Serial

-40 °C (-40 °F)

Track

Upper

2.3 µs

X-XUUC-N8

No

AD7689-KGD-PT

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

20

DIE

Square

8

Yes

2.9 V

250 kHz

1

16

0.0038 %

2.5 V

Binary, 2's Complement Binary

Uncased Chip

DIE OR CHIP

125 °C (257 °F)

-250 mV

Serial

-40 °C (-40 °F)

Upper

3.6 µs

S-XUUC-N20

0.01 in (0.25 mm)

0.096 in (2.43 mm)

0.096 in (2.43 mm)

ADC-912G

Analog Devices

Analog To Digital Converter, Successive Approximation

No Lead

24

DIE

Rectangular

1

Yes

15 V

1

CMOS

12

7 mA

0.024 %

5 V

Binary, Offset Binary

Uncased Chip

-15 V

Parallel, Word

Tin Lead

Upper

13.5 µs

R-XUUC-N24

No

e0

AD7766-2-KGD-WP

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

23

DIE

Rectangular

1

Yes

5.25 V

32 kHz

1

24

0.0015 %

2.5 V

2's Complement Binary

Uncased Chip

105 °C (221 °F)

-5.25 V

Serial

-40 °C (-40 °F)

Upper

R-XUUC-N23

0.01 in (0.25 mm)

0.074 in (1.87 mm)

0.116 in (2.95 mm)

AD7892ACHIPS-3

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

DIE

1

Yes

2.5 V

600 kHz

1

CMOS

12

0.0366 %

5 V

2's Complement Binary

Uncased Chip

85 °C (185 °F)

-2.5 V

Serial, Parallel, Word

-40 °C (-40 °F)

Track

Upper

1.47 µs

X-XUUC-N

No

AD9026CHIPS

Analog Devices

Analog To Digital Converter, Flash Method

No Lead

28

DIE

Rectangular

1

Yes

31 MHz

1

Bipolar

12

246 mA

5 V

Offset Binary

-5.2 V

Uncased Chip

Parallel, Word

Tin Lead

Track

Upper

R-XUUC-N28

No

e0

AD9042CHIPS

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

31

DIE

Rectangular

1

Yes

2.9 V

41 MHz

1

Bipolar

12

5 V

2's Complement Binary

Uncased Chip

85 °C (185 °F)

1.9 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Upper

20 ns

R-XUUC-N31

No

e0

ADC910G

Analog Devices

Analog To Digital Converter, Successive Approximation

No Lead

28

DIE

Rectangular

1

Yes

15 V

1

10

60 mA

0.098 %

5 V

Offset Binary

-5 V

Uncased Chip

0 mV

Parallel, Word

Tin Lead

Upper

12 µs

R-XUUC-N28

No

e0

ADC-908

Analog Devices

Analog To Digital Converter, Successive Approximation

No Lead

18

DIE

1

Yes

20 V

1

CMOS

8

0.29 %

5 V

Binary, Offset Binary

Uncased Chip

-20 V

Parallel, 8 Bits

Tin Lead

Upper

6 µs

X-XUUC-N18

No

e0

AD7894ACHIPS-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

DIE

1

Yes

10 V

1

14

5 V

2's Complement Binary

Uncased Chip

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Track

Upper

5 µs

X-XUUC-N

AD7880BCHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

No Lead

24

DIE

1

Yes

5 V

66 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

Uncased Chip

-5 V

Parallel, Word

Track

Upper

12 µs

X-XUUC-N24

No

AD7862ACHIPS-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

DIE

2

Yes

10 V

250 kHz

1

CMOS

12

0.0244 %

5 V

2's Complement Binary

Uncased Chip

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Track

Upper

3.6 µs

X-XUUC-N

No

AD7575BCHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

18

DIE

1

Yes

2.46 V

1

CMOS

8

0.1953 %

5 V

Offset Binary

Uncased Chip

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Track

Upper

15 µs

X-XUUC-N18

No

AD7893ACHIPS-2

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

DIE

1

Yes

2.5 V

1

BICMOS

12

5 V

Binary

Uncased Chip

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Track

Upper

6 µs

X-XUUC-N

No

AD7820TCHIPS

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

20

DIE

1

Yes

5 V

1

CMOS

8

0.3906 %

5 V

Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Upper

1.36 µs

X-XUUC-N20

No

AD7710ACHIPS

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

No Lead

DIE

2

Yes

2.5 V

1

CMOS

24

0.003 %

5 V

Binary, Offset Binary

-5 V

Uncased Chip

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Upper

X-XUUC-N

1

No

e3

AD7893ACHIPS-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

DIE

1

Yes

10 V

1

BICMOS

12

5 V

2's Complement Binary

Uncased Chip

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Track

Upper

6 µs

X-XUUC-N

No

MAX131C/D

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

Rectangular

1

Yes

2 V

1

CMOS

16

120 μA

0.0015 %

9 V

Binary

9 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

200 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N40

No

e0

ICL7136C/D

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

1

Yes

2 V

1

CMOS

16

0.0015 %

9 V

Binary

9 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

X-XUUC-N40

2

No

e0

MAX144BC/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

DIE

2

Yes

5.3 V

108 kHz

1

12

0.0244 %

3 V

Binary

Uncased Chip

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

7 µs

X-XUUC-N

No

e0

MAX1241BC/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

8

DIE

1

Yes

5.3 V

73 kHz

1

BICMOS

12

0.0244 %

3 V

Binary

Uncased Chip

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

7.5 µs

X-XUUC-N

No

e0

MAX145BC/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

DIE

2

Yes

5.3 V

108 kHz

1

12

0.0244 %

3 V

Binary

Uncased Chip

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

7 µs

X-XUUC-N

No

e0

MAX150BC/D

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

No Lead

20

DIE

Rectangular

1

Yes

5 V

1

CMOS

8

5 V

Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

R-XUUC-N20

No

e0

MAX146BC/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

20

DIE

Rectangular

8

Yes

2.5 V

133 kHz

1

12

0.0244 %

3 V

Binary

Uncased Chip

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

65 µs

R-XUUC-N20

No

e0

MAX136C/D

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

Rectangular

1

Yes

200 mV

1

CMOS

16

200 μA

0.0015 %

9 V

Binary

9 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N40

2

No

e0

MAX174BC/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

28

DIE

Rectangular

1

Yes

10 V

1

BICMOS

12

0.0122 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Upper

8 µs

R-XUUC-N28

1

No

e0

MAX176BC/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

8

DIE

Rectangular

1

Yes

5 V

250 kHz

1

CMOS

12

0.0183 %

5 V

Binary

5,-12/-15 V

-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-5 V

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

R-XUUC-N8

1

No

e0

MAX140C/D

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

Rectangular

1

Yes

200 mV

1

CMOS

24

0.0015 %

5 V

Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N40

1

No

e0

MAX166BC/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

20

DIE

Rectangular

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.39 %

5 V

Binary, Offset Binary

Uncased Chip

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

15 µs

R-XUUC-N20

No

e0

MX674AK/D-T

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

28

DIE

Rectangular

1

Yes

10 V

1

BICMOS

12

0.0122 %

15 V

Binary, Offset Binary

-15 V

Uncased Chip

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Upper

15 µs

R-XUUC-N28

No

e0

MX674AK/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

28

DIE

Rectangular

1

Yes

10 V

1

BICMOS

12

0.0122 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Upper

15 µs

R-XUUC-N28

1

No

e0

MAX183BC/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

24

DIE

Rectangular

1

Yes

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

3.25 s

R-XUUC-N24

1

No

e0

MAX184BC/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

24

DIE

Rectangular

1

Yes

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

5.2 s

R-XUUC-N24

1

No

e0

MAX138C/D

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

Rectangular

1

Yes

200 mV

1

CMOS

24

0.0015 %

5 V

Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N40

1

No

e0

MAX185BC/D

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

24

DIE

Rectangular

1

Yes

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

10.4 s

R-XUUC-N24

1

No

e0

5962F1820401V9A

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

No Lead

21

DIE

Rectangular

300k Rad(Si)

8

Yes

3.6 V

1 MHz

2

CMOS

MIL-PRF-38535 Class V

12

0.0269 %

3.3 V

Binary

Uncased Chip

125 °C (257 °F)

-3.6 V

Serial

-55 °C (-67 °F)

Track

Upper

R-XUUC-N21

Yes

MAX132C/D

Maxim Integrated

Analog To Digital Converter, Multi-Slope

Commercial

No Lead

24

DIE

Rectangular

1

Yes

6 V

1

CMOS

18

125 μA

0.006 %

5 V

2's Complement Binary

±5 V

-5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-9 V

Serial

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N24

1

No

e0

MAX172BC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

24

DIE

1

Yes

5 V

1

CMOS

12

0.018 %

5 V

Binary

5,-12/-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Upper

10.4 µs

X-XUUC-N24

No

e0

ICL7116C/D

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

Rectangular

1

Yes

2 V

1

CMOS

16

0.0015 %

9 V

Binary

9 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N40

1

No

e0

MAX135C/D

Maxim Integrated

Analog To Digital Converter, Multi-Slope

Commercial

No Lead

28

DIE

Rectangular

1

Yes

6 V

1

CMOS

15

125 μA

0.006 %

5 V

2's Complement Binary

±5 V

-5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-9 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N28

No

e0

ICL7137C/D

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

24

DIE

1

Yes

3.2 V

1

CMOS

23

0 %

9 V

Binary

±5 V

-5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

2.6 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

X-XUUC-N24

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.