DIE Analog-to-Digital Converters 186

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX121C/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

17

DIE

Rectangular

1

Yes

5 V

308 kHz

1

BICMOS

14

20 mA

5 V

2's Complement Binary

5,-12/-15 V

-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-5 V

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

2.91 µs

R-XUUC-N17

1

No

e0

MAX1112C/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

20

DIE

8

Yes

2.048 V

50 kHz

1

CMOS

8

0.1953 %

5 V

Binary, 2's Complement Binary

Uncased Chip

70 °C (158 °F)

-2.048 V

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

55 µs

X-XUUC-N

1

No

e0

MAX195BC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

16

DIE

1

Yes

5 V

85 kHz

1

16

5 V

Binary, Offset Binary

-5 V

Uncased Chip

70 °C (158 °F)

-5 V

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

2 µs

X-XUUC-N16

1

No

e0

MAX122C/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

24

DIE

Rectangular

1

Yes

5 V

500 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

-15 V

Uncased Chip

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Upper

2.6 µs

R-XUUC-N24

No

e0

ADC0820CC/D

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

No Lead

20

DIE

Rectangular

1

Yes

5.1 V

1

CMOS

8

10 mA

5 V

Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

1.6 µs

R-XUUC-N20

No

e0

MX7581JC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

28

DIE

Rectangular

8

Yes

5 V

1

CMOS

8

8 mA

0.7324 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Upper

R-XUUC-N28

1

No

ICL7126C/D

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

1

Yes

2 V

1

CMOS

16

0.0015 %

9 V

Binary

9 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

X-XUUC-N40

2

No

e0

MAX108C/D

Maxim Integrated

Analog To Digital Converter, Flash Method

No Lead

40

DIE

1

Yes

525 mV

1500 MHz

1

Bipolar

8

0.1953 %

5 V

Offset Binary

-5 V

Uncased Chip

475 mV

Parallel, 8 Bits

Tin Lead

Track

Upper

X-XUUC-N40

No

e0

MAX151BC/D

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

No Lead

24

DIE

Rectangular

1

Yes

5 V

300 kHz

1

10

45 mA

0.098 %

5 V

Offset Binary

±5 V

-5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

2.5 µs

R-XUUC-N24

1

No

e0

MX7575J/D-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

20

DIE

Rectangular

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

Uncased Chip

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

15 µs

R-XUUC-N20

No

e0

MAX117C/D

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

No Lead

28

DIE

Rectangular

8

Yes

3 V

400 kHz

1

CMOS

8

3.6 V

Binary

Uncased Chip

70 °C (158 °F)

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

2 µs

R-XUUC-N28

1

No

e0

MAX133C/D

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

DIE

Rectangular

1

Yes

3.3 V

1

Bipolar

4

1 %

5 V

9's Complement Binary Coded Decimal

9 V

-5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

2.8 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N40

1

No

e0

MX7574J/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

18

DIE

Rectangular

1

Yes

10 V

1

CMOS

8

5 V

Binary, Offset Binary, Complementary Offset Binary

Uncased Chip

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

MAX166DC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

20

DIE

Rectangular

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.39 %

5 V

Binary, Offset Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

15 µs

R-XUUC-N20

1

No

e0

MAX1110C/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

20

DIE

8

Yes

5.55 V

50 kHz

1

CMOS

8

0.1953 %

2.7 V

Binary, 2's Complement Binary

Uncased Chip

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

55 µs

X-XUUC-N

1

No

e0

MAX165BC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

20

DIE

Rectangular

1

Yes

2.58 V

200 kHz

1

CMOS

8

0.3906 %

5 V

Binary, Offset Binary

Uncased Chip

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

15 µs

R-XUUC-N20

1

No

e0

MAX160C/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

18

DIE

Rectangular

1

Yes

10 V

1

CMOS

8

5 V

Binary, Offset Binary, Complementary Offset Binary

Uncased Chip

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

1

No

e0

MAX7129C/D

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

Square

1

Yes

2 V

1

CMOS

4

9 V

Binary

9 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

S-XUUC-N40

1

No

e0

ICL7135C/D

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

28

DIE

Rectangular

1

Yes

2 V

1

CMOS

4

0.005 %

5 V

Binary, Binary Coded Decimal

±5 V

-5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-2 V

Parallel, 4 Bits

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N28

2

No

e0

MX7578K/D-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

22

DIE

Rectangular

1

Yes

5 V

1

12

5 V

Binary

-5 V

Uncased Chip

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Upper

150 µs

R-XUUC-N22

No

e0

MAX1198E/D

Maxim Integrated

Analog To Digital Converter, Flash Method

No Lead

48

DIE

2

Yes

1 V

100 MHz

1

CMOS

8

0.3906 %

3.3 V

Offset Binary, 2's Complement Binary

Uncased Chip

-1 V

Parallel, 8 Bits

Tin Lead

Track

Upper

X-XUUC-N48

No

e0

MAX177C/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

24

DIE

Rectangular

1

Yes

2.5 V

1

CMOS

10

0.05 %

5 V

Binary

5,-12/-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Upper

8.67 µs

R-XUUC-N24

1

No

e0

MAX113C/D

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

No Lead

24

DIE

Rectangular

4

Yes

3 V

400 kHz

1

CMOS

8

3.6 V

Binary

Uncased Chip

70 °C (158 °F)

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

2 µs

R-XUUC-N24

3

No

e0

MX7821KC/D

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

No Lead

20

DIE

Rectangular

1

Yes

5 V

100 kHz

1

CMOS

8

5 V

Offset Binary

5,GND/-5 V

-5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

400 ns

R-XUUC-N20

No

e0

MAX190BC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

24

DIE

Rectangular

1

Yes

5.25 V

76 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

0 mV

Serial, Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

18 µs

R-XUUC-N24

1

No

e0

MAX1245BC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

20

DIE

Rectangular

8

Yes

1.024 V

100 kHz

1

CMOS

12

1.3 mA

0.0244 %

2.375 V

Binary, 2's Complement Binary

Uncased Chip

70 °C (158 °F)

-1.024 V

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

65 µs

R-XUUC-N20

No

e0

MAX164CC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

24

DIE

Rectangular

1

Yes

5 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

8.13 µs

R-XUUC-N24

1

No

e0

MAX167CC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

24

DIE

Rectangular

1

Yes

2.5 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-2.5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

8.13 µs

R-XUUC-N24

1

No

e0

MAX126CC/D+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

DIE

Rectangular

4

Yes

2.5 V

250 kHz

1

14

0.0244 %

5 V

2's Complement Binary

-5 V

Uncased Chip

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Track

Upper

12 µs

R-XUUC-N

No

e3

MAX148BC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

DIE

Rectangular

8

Yes

1.25 V

133 kHz

1

CMOS

10

3 V

Binary, 2's Complement Binary

Uncased Chip

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

R-XUUC-N

No

e0

MAX1243BC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

DIE

Rectangular

1

Yes

2.5 V

1

CMOS

10

5.25 V

Binary

Uncased Chip

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Upper

R-XUUC-N

No

e0

MAX122BC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

24

DIE

Rectangular

1

Yes

5 V

333 kHz

1

BICMOS

12

0.0244 %

5 V

2's Complement Binary

5,-12/-15 V

-12 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Upper

2.6 µs

R-XUUC-N24

1

No

e0

MAX161AC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

28

DIE

Rectangular

8

Yes

5 V

1

CMOS

8

5 V

Binary, Offset Binary, Complementary Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N28

No

e0

MAX153C/D

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

No Lead

20

DIE

Rectangular

2

Yes

2.5 V

1 MHz

1

CMOS

8

0.39 %

5 V

Binary

5,GND/-5 V

-5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-2.5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

875 ns

R-XUUC-N20

1

No

e0

ICL7129AC/D

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

Square

1

Yes

4 V

1

CMOS

4

9 V

Binary

9 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

S-XUUC-N40

2

No

e0

MAX172CC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

24

DIE

Rectangular

1

Yes

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Binary

5,-12/-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin/Lead

Upper

10.4 µs

R-XUUC-N24

No

e0

ICL7107C/D

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

Rectangular

1

Yes

3.5 V

1

CMOS

3

0.05 %

5 V

Binary

±5 V

-5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-3.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N40

2

No

e0

MAX182BC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

28

DIE

Rectangular

4

Yes

5 V

1

CMOS

12

10 mA

1 %

15 V

Binary, Offset Binary

±5,15 V

-5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Upper

140 µs

R-XUUC-N28

1

No

e0

MAX118C/D

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

No Lead

28

DIE

8

Yes

5.25 V

1 MHz

1

BICMOS

8

5 V

Binary

Uncased Chip

70 °C (158 °F)

-5.25 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Upper

865 ns

X-XUUC-N

1

No

e0

5962F9669601V9X

Renesas Electronics

Analog To Digital Converter, Flash Method

Military

No Lead

28

DIE

Rectangular

1

Yes

20 MHz

1

CMOS

8

0.3906 %

5 V

Binary

Uncased Chip

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Upper

R-XUUC-N28

Yes

e0

5962F9669601V9A

Renesas Electronics

Analog To Digital Converter, Flash Method

Military

No Lead

28

DIE

Rectangular

300k Rad(Si)

1

Yes

5 V

20 MHz

1

CMOS

MIL-PRF-38535 Class V

8

135 mA

0.3906 %

5 V

Binary

Uncased Chip

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Upper

50 ns

R-XUUC-N28

Yes

HS0-9008RH-Q

Renesas Electronics

Analog To Digital Converter, Flash Method

No Lead

28

DIE

Rectangular

300k Rad(Si)

1

Yes

20 MHz

1

CMOS

MIL-PRF-38535 Class V

8

Binary

Uncased Chip

Parallel, 8 Bits

Upper

R-XUUC-N28

No

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.