DIP Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

5962-8965501LA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

38535Q/M;38534H;883B

12

12 mA

0.0244 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7880BNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

66 kHz

1

BICMOS

12

10 mA

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

12 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.2 in (30.485 mm)

AD676KDZ

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

100 kHz

1

BICMOS

MIL-STD-883

16

0.002 %

12 V

2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

1 ms

R-PDIP-T28

No

e4

ADADC72BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

16

0.003 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD7869JNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

83 kHz

1

CMOS

14

22 mA

0.0122 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

10 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.2 in (30.485 mm)

AD7578TD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

17.3 V

1

CMOS

12

7.5 mA

15 V

Binary

±5,15 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-300 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

150 µs

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD5201TD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

AD7581JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

17 V

1

CMOS

8

8 mA

0.731 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-17 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD579ZBD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

32

DIP

Rectangular

Ceramic

1

No

20 V

1

Hybrid

10

Binary, Complementary Binary, Offset 2's Complement, Offset Binary, Complementary Offset Binary, 2's Complement

5,±12/±15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T32

No

e0

AD674ATD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

16.5 V

83 kHz

1

BIMOS

12

40 mA

0.024 %

Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-16.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

15 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

LTC1283ACN#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

3.05 V

15 kHz

1

CMOS

10

0.0488 %

3 V

Binary, 2's Complement Binary

-3 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-3.05 V

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

R-PDIP-T20

0.3 in (7.62 mm)

No

e0

AD7824CQ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

100 kHz

1

CMOS

8

0.1953 %

5 V

Binary, Complementary Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

2.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

LTC1278-4CN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

400 kHz

1

CMOS

12

29.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

2.3 µs

R-PDIP-T24

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

AD9034BD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

20.48 MHz

1

CMOS

12

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

49 ns

R-CDIP-T40

0.225 in (5.715 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

5962-9684601QJX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

CMOS

MIL-PRF-38535 Class Q

12

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

LTC1297CCN8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5.05 V

1

CMOS

12

0.0122 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

12 µs

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

5962R0253801VXA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

No

41 MHz

1

Bipolar

MIL-PRF-38535 Class V

12

0.085 %

5 V

2's Complement Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

Yes

e0

ADC910BIFT

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

10

60 mA

0.0977 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD1671SQ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1.25 MHz

1

BICMOS

38535Q/M;38534H;883B

12

68 mA

0.061 %

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

800 ns

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7572AAQ03

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

15 V

1

CMOS

12

9 mA

0.024 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

3.25 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC922ET

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

Bipolar

12

45 mA

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7890SD

Analog Devices

Analog To Digital Converter Subsystem

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

12

10 mA

0.024 %

5 V

2's Complement Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9152101MXA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

10 V

29 kHz

1

BICMOS

MIL-STD-883

12

18 mA

0.024 %

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

35 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

AD7824UQ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

100 kHz

1

CMOS

MIL-STD-883 Class B

8

0.1953 %

5 V

Binary, Complementary Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.8 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-01-370-4581

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

48

DIP

Rectangular

Ceramic

No

2 V

2

CMOS

8

0.49 %

5 V

Offset Binary

±5 V

-5 V

In-Line

DIP48,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T48

1

No

AD364KD

Analog Devices

Digital To Analog Converter

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic

16

No

10 V

12

0.012 %

Binary, Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T32

No

AD779KNZ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

128 kHz

1

BIMOS

14

0.0122 %

12 V

Binary, 2's Complement Binary

-12 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Sample

Dual

6.3 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

1.445 in (36.703 mm)

AD7875LNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Track

Dual

9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.25 in (31.75 mm)

AD7892ANZ-3

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

600 kHz

1

CMOS

12

0.0366 %

5 V

2's Complement Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

1.47 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e3

1.227 in (31.165 mm)

AD7721AN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

1.25 V

468 kHz

1

CMOS

16

28.5 mA

0.1953 %

5 V

Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.25 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD7730BN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

2

No

800 mV

1

CMOS

19

0.0018 %

5 V

Binary

3/5,5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD676TD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

100 kHz

1

BIMOS

16

12 mA

0.003 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

1 ms

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9040TQ

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

7 V

1

10

0.098 %

5 V

Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-7 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

25 ns

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD678JD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

200 kHz

1

BIMOS

12

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

4.4 µs

R-CDIP-T28

0.165 in (4.191 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

HAS-1201SM

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

46

DIP

Rectangular

1

No

15 V

1 MHz

1

Hybrid

12

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,-5.2,±15 V

-15 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

1 µs

R-XDIP-T46

0.231 in (5.86 mm)

1.3 in (33.02 mm)

No

e0

AD1678JD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

200 kHz

1

BICMOS

12

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

4.47 µs

R-CDIP-T28

0.175 in (4.45 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD674BKN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

BICMOS

12

0.0122 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

15 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD7876TQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

100 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, 8 Bits, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

LTC1278-4IN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

400 kHz

1

CMOS

12

29.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

2.3 µs

R-PDIP-T24

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

5962-8865001RX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

AD7892BNZ-2

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

500 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

1.6 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e3

1.227 in (31.165 mm)

AD7858ANZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

5.5 V

200 kHz

1

CMOS

12

0.0244 %

3 V

Binary

3.3/5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

4.6 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e3

1.227 in (31.165 mm)

AD7572ALNZ10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

9 mA

0.012 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

10.4 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.199 in (30.45 mm)

ADC912BW/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

12

7 mA

0.0122 %

5 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13.5 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9002BD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

0 mV

150 MHz

1

Bipolar

8

0.4688 %

Binary

-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD1378TD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

16

40 mA

0.003 %

15 V

Complementary Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

17 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

ADC908AX/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

2.5 mA

0.1953 %

5 V

Binary, Offset Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

7 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD363RKD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

64

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

16

No

10 V

30 kHz

1

Hybrid

12

0.0244 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

25 µs

R-CDIP-T64

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.