DIP Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC1272ACN-3#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

250 kHz

1

CMOS

12

0.0122 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

3.25 µs

R-PDIP-T24

0.3 in (7.62 mm)

e3

1.28 in (32.512 mm)

ADC910BT

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

15 V

1

Bipolar

10

60 mA

0.098 %

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

12 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

LTC1093ACN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

6

No

5.05 V

1

10

0.0488 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Dual

20 µs

R-PDIP-T16

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

ADC910AT/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

10

60 mA

0.0732 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

12 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7572BQ12/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Sample

Dual

12.5 µs

R-CDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

1.29 in (32.77 mm)

AD1779JN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

100 kHz

1

BICMOS

14

32 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

8.5 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.425 in (36.205 mm)

LTC1286IN8

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5.05 V

12.5 kHz

1

CMOS

12

500 μA

0.0488 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

AD9011SMB

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Pin/Peg

24

DIP

Rectangular

Metal

1

No

1 V

100 MHz

1

Bipolar

MIL-STD-883 Class B (Modified)

8

303 mA

0.4688 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-P24

0.6 in (15.24 mm)

No

e0

1.272 in (32.3205 mm)

ADC912BIHP

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

12

7 mA

0.0244 %

5 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

13.5 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD976CN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

100 kHz

1

BICMOS

16

0.0046 %

5 V

2's Complement Binary

5 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

8 µs

R-PDIP-T28

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.405 in (35.687 mm)

5962-9050801MXX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

125 MHz

1

Bipolar

8

0.3906 %

Binary

-5.2 V

In-Line

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

5962-9092702MXX

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

35 MHz

1

MIL-STD-883

8

0.3906 %

5 V

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

AD574AUD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

12

40 mA

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

35 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD7578BQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

15 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Dual

100 µs

R-GDIP-T24

0.25 in (6.35 mm)

0.3 in (7.62 mm)

1.29 in (32.77 mm)

LTC1096ACN8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

9.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

32 µs

R-PDIP-T8

1

0.15 in (3.809 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

5962-8876403XC

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

BICMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Track

Dual

2 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD1378SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

25 V

63 kHz

1

Hybrid

16

40 mA

0.006 %

15 V

Complementary Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-25 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

17 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

ADC912AFP

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

12

0.0244 %

5 V

Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

11.2 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD9048SQ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

0 mV

35 MHz

1

Bipolar

38535Q/M;38534H;883B

8

110 mA

0.3906 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

ADADC72BM

Analog Devices

Analog To Digital Converter

Other

Through-Hole

32

DIP

Rectangular

Metal

1

No

20 V

1

Bipolar

16

0.003 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

ADC170FN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

179 kHz

1

CMOS

12

11 mA

0.024 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

5962-8965504LB

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC80-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

12

0.048 %

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

21 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

5962-9092701MXX

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

35 MHz

1

MIL-STD-883

8

0.293 %

5 V

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

5962-9475502MPA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

BICMOS

MIL-STD-883

12

0.024 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

6 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

5962-8876403XA

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

MIL-STD-883

8

20 mA

0.3906 %

5 V

Binary, Complementary Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.8 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

5962-9756301HXA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

512 mV

100 MHz

1

Bipolar

MIL-STD-883

10

0.2197 %

2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-512 mV

Parallel, Word

-55 °C (-67 °F)

Gold

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e4

1.4 in (35.56 mm)

AD574LD

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

Bipolar

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD7871TQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

83 kHz

1

CMOS

MIL-STD-883 Class B

14

0.0061 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

11 µs

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

No

e0

AD7572AJNZ10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

9 mA

0.024 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

10.4 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.199 in (30.45 mm)

AD578ZKN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

12

0.0122 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

4.5 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

5962-0253801VXA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

41 MHz

1

Bipolar

MIL-PRF-38535 Class V

12

0.11 %

5 V

2's Complement Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

No

e0

AD773AJD

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

250 mV

20 MHz

1

BICMOS

10

5 V

Offset Binary, 2's Complement Binary

5,5,5,-5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-250 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD779JDZ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

128 kHz

1

BIMOS

14

12 V

Binary, 2's Complement Binary

-12 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Sample

Dual

6.3 µs

R-CDIP-T28

0.165 in (4.191 mm)

0.6 in (15.24 mm)

1.41 in (35.815 mm)

AD376TD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

1

No

20 V

1

Hybrid

38535Q/M;38534H;883B

16

0.003 %

Complementary Binary, Complementary Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T32

No

e0

AD675N

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

100 kHz

1

BIMOS

16

12 mA

0.0015 %

12 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Sample

Dual

10 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

1.199 in (30.45 mm)

5962-9317901MLX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

CMOS

12

0.0244 %

5 V

Binary

-5 V

In-Line

125 °C (257 °F)

-10 V

Serial, Parallel, 8 Bits, Parallel, Word

-55 °C (-67 °F)

Track

Dual

9 µs

R-CDIP-T24

Yes

AD7872TQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

83 kHz

1

CMOS

14

0.0061 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

11 µs

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.768 in (19.495 mm)

AD671SD-750/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

56 mA

0.061 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

750 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD679JD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

6.3 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD679KNZ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

0.0122 %

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

6.3 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.473 in (37.425 mm)

AD5204SD

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

Hybrid

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

AD7870JNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

1

CMOS

12

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Track

Dual

9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.25 in (31.75 mm)

AD7703BNZ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

16 kHz

1

CMOS

20

0.0015 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDIP-T20

0.18 in (4.57 mm)

0.3 in (7.62 mm)

No

e3

0.965 in (24.51 mm)

LTC1288CN8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

3.05 V

6.6 kHz

1

CMOS

12

390 μA

0.0488 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

100 µs

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

AS773AKD

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

1 V

1

20

0.0002 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

AD7571SD

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

1

CMOS

10

Offset Binary

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD7890ANZ-2

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

2.5 V

117 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

5.9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.25 in (31.75 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.