DIP Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD1385TD

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

48

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

500 kHz

1

Hybrid

16

15 V

Complementary 2's Complement, Complementary Offset Binary

±5,±15 V

-15 V

In-Line

DIP48,1.0

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T48

0.233 in (5.91 mm)

0.6 in (15.24 mm)

No

e0

2.475 in (62.865 mm)

AD7893SN

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

BIMOS

12

10 mA

0.024 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

5.5 µs

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

5962-8961602VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

CMOS

MIL-STD-883

8

0.293 %

5 V

Binary, Offset Binary

In-Line

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead

Dual

6 µs

R-GDIP-T18

No

e0

5962-9066601HXA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

46

DIP

Rectangular

0

No

1.024 V

10 MHz

1

Hybrid

12

0.0549 %

5 V

Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-1.024 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T46

0.231 in (5.87 mm)

1.45 in (36.83 mm)

No

e0

AD7703BN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

16 kHz

1

CMOS

20

0.0015 %

5 V

Binary, Offset Binary

±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDIP-T20

0.18 in (4.57 mm)

0.3 in (7.62 mm)

No

e0

0.965 in (24.51 mm)

AD7572SQ05/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

5.2 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

AD7886TD

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1.1 MHz

1

BICMOS

12

35 mA

0.0488 %

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

100 ns

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

5962-01-358-0250

Analog Devices

Analog To Digital Converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic

No

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T24

No

ADC170FD

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

179 kHz

1

CMOS

12

11 mA

0.024 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD977AAN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

3

No

10 V

200 kHz

1

BICMOS

16

0.0046 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

4 µs

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

HAS-1202A

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

641 kHz

1

Hybrid

12

232 mA

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5.12 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

1.56 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

AD9048JQ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

100 mV

38 MHz

1

Bipolar

8

0.3906 %

5 V

Binary, Offset 2's Complement

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.1 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

29 ns

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD578ZJN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

12

0.0122 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

6 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

AD7706BNZ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

3

No

2.5 V

19.2 kHz

1

CMOS

16

0.003 %

3 V

Binary, Offset Binary

3/5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.79 in (20.07 mm)

AD5202TD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

AD7572AJN03

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

9 mA

0.024 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

3.25 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7811YN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

4

No

3.6 V

350 kHz

1

CMOS

10

0.0977 %

3 V

Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

105 °C (221 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

2.3 µs

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.793 in (20.13 mm)

ADADC-816BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

10

0.0488 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

800 ns

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

AD1671-703D

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1.25 MHz

1

BICMOS

38535V;38534K;883S

12

0.061 %

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

800 ns

R-CDIP-T28

No

5962-01-064-1845

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Ceramic

No

2 V

1

CMOS

13

0.012 %

Offset Binary

±5,12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T40

No

AD1334BD

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

4

No

5 V

28 kHz

1

CMOS

12

0.0244 %

15 V

Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-CDIP-T40

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD574AJDZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

12

40 mA

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

35 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e4

1.41 in (35.815 mm)

AD1377JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

16

0.006 %

15 V

Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e4

AD7572ALNZ03

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

9 mA

0.012 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

3.25 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.199 in (30.45 mm)

AD578ZLN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

12

0.0122 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

3 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

AD7578TQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

15 V

Offset Binary

±5,15 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

100 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

AD9005ATM

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

46

DIP

Rectangular

Metal

1

No

3 V

10 MHz

1

Bipolar

12

55 mA

0.03 %

15 V

Offset Binary

5,-5.2,±15 V

-15 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

100 ns

R-MDIP-T46

0.231 in (5.86 mm)

1.3 in (33.02 mm)

No

e0

5962-01-085-7614

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T32

No

AD7572JN05/883B

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Sample

Dual

5 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

1.227 in (31.165 mm)

LTC1278-4CN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

400 kHz

1

CMOS

12

29.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.3 µs

R-PDIP-T24

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

AD7896SQZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.5 V

100 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Track

Dual

8.5 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7820LN/+

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

8

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T20

e0

AD7586JN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

7.3 V

1

CMOS

12

30 mA

0.048 %

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-7.3 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

1 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD7672TQ05/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

38535Q/M;38534H;883B

12

12 mA

0.0244 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8965503LA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD572SD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.012 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Dual

25 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e4

5962-01-392-1748

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic

No

10 V

1

BICMOS

12

0.024 %

Offset Binary

5,±12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T28

No

AD574AKN/+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

Bipolar

12

0.0122 %

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

35 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

5962-8759104LB

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

BICMOS

12

12 mA

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7862ANZ-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

2

No

10 V

250 kHz

1

CMOS

12

0.0244 %

5 V

2's Complement Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

3.6 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.472 in (37.4 mm)

AD7820KN

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

7.3 V

1

CMOS

8

15 mA

0.39 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-300 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

1.36 µs

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

AD571KD/+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Bipolar

10

0.049 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.14 in (3.55 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

AD7828KN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5 V

50 kHz

1

CMOS

8

0.3906 %

5 V

Binary, Complementary Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

2.4 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD7572JNZ12

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

13 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e3

1.227 in (31.165 mm)

AD670AD/+

Analog Devices

Analog To Digital Converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic

1

No

2.55 V

1

Bipolar

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-XDIP-T20

e0

AD7893AN-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

BICMOS

12

0.0244 %

5 V

2's Complement Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

6 µs

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

AD2020

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

1

Bipolar

Binary

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T16

No

e0

AD7824TQ

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

100 kHz

1

CMOS

MIL-STD-883 Class B

8

0.3906 %

5 V

Binary, Complementary Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.8 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.