DIP Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

ADC85S-12

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

12

140 mA

0.012 %

15 V

Complementary Offset Binary, Complementary Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.23 in (5.84 mm)

0.9 in (22.86 mm)

No

e0

1.612 in (40.945 mm)

LTC1292BIN8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5.05 V

60 kHz

1

CMOS

12

0.0122 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

12 µs

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

5962-8776202VA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

BICMOS

38535Q/M;38534H;883B

8

7 mA

0.2 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

HAS-1202M

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

349 kHz

1

Hybrid

12

0.0122 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5.12 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

2.86 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

1.5 in (38.1 mm)

AD7572KN05

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

5.2 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.227 in (31.165 mm)

AD673SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

50 kHz

1

Bipolar

8

0.1953 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Sample

Dual

30 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7893BN-5

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

0.0122 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

6 µs

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

5962-01-174-1394

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

20 V

1

38535Q/M;38534H;883B

12

0.024 %

Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

LTC1272-3ACN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

250 kHz

1

BICMOS

12

0.0122 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-300 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

3 ms

R-PDIP-T24

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e0

AD674BTD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BIMOS

12

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

15 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD7858BN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

5.5 V

200 kHz

1

CMOS

12

0.0244 %

3 V

Binary

3.3/5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

4.6 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.227 in (31.165 mm)

AD572SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.012 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

25 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

AD7710SN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

12.3 V

160 kHz

1

CMOS

21

4 mA

0.0015 %

10 V

Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-6.3 V

Serial

-55 °C (-67 °F)

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

1.199 in (30.45 mm)

AD7710AN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

2

No

2.5 V

1

CMOS

24

0.003 %

5 V

Binary, Offset Binary

±5/10 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

ADC7672BQ03

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Dual

3.25 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

LTC1275BCN#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

300 kHz

1

BICMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-2.5 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

2.7 µs

R-PDIP-T24

1

0.3 in (7.62 mm)

No

e3

1.28 in (32.512 mm)

AD7824TQ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

100 kHz

1

CMOS

MIL-STD-883 Class B

8

0.3906 %

5 V

Binary, Complementary Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.8 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

LTC1287BCN8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

3.05 V

30 kHz

1

CMOS

12

0.0122 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

24 µs

R-PDIP-T8

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

5962-01-137-0285

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

38535Q/M;38534H;883B

8

0.195 %

Offset Binary

5,-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

PM7574HP

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

8

0.29 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T18

No

e0

AD7870AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

1

CMOS

12

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8965501LB

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9551902MLX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 MHz

1

BICMOS

MIL-STD-883

12

0.061 %

5 V

Binary

-5 V

In-Line

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

750 ns

R-CDIP-T24

No

LTC1096ACN8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

9.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

32 µs

R-PDIP-T8

1

0.15 in (3.809 mm)

0.3 in (7.62 mm)

No

e0

5962-9475501MPX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

BICMOS

MIL-STD-883

12

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Serial

-55 °C (-67 °F)

Track

Dual

6 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

ADC910AT/883C

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

10 V

1

Bipolar

38535Q/M;38534H;883B

10

0.073 %

5 V

Binary, Offset Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD7578KNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

15 V

Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Dual

100 µs

R-PDIP-T24

0.3 in (7.62 mm)

e3

1.227 in (31.165 mm)

AD9011KM

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

24

DIP

Rectangular

Metal

1

No

1 V

100 MHz

1

Bipolar

8

303 mA

0.4688 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

R-MDIP-P24

0.6 in (15.24 mm)

No

e0

1.272 in (32.3205 mm)

AD7572LNZ12

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0122 %

5 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

13 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e3

1.227 in (31.165 mm)

AD9070TD

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

100 MHz

1

Bipolar

38535Q/M;38534H;883B

10

0.2197 %

2's Complement Binary

5/-5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-6 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

1.4 in (35.56 mm)

PM7574BX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

20 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-20 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

17 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD976AANZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

200 kHz

1

BICMOS

16

0.0046 %

5 V

2's Complement Binary

5 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

4 µs

R-PDIP-T28

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.405 in (35.687 mm)

AD674AUD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

38535Q/M;38534H;883B

12

0.024 %

Binary, Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD1332TD/883B

Analog Devices

Analog To Digital Converter Subsystem

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

125 kHz

1

Hybrid

38535Q/M;38534H;883B

12

57 mA

0.024 %

15 V

Offset Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T40

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

LTC1094ACN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

1

10

0.0488 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

20 µs

R-PDIP-T20

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

HAS-1201SMB

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

46

DIP

Rectangular

1

No

15 V

1 MHz

1

Hybrid

MIL-STD-883 Class B (Modified)

12

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,-5.2,±15 V

-15 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

1 µs

R-XDIP-T46

0.231 in (5.86 mm)

1.3 in (33.02 mm)

No

e0

LTC1094ACN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

1

10

0.0488 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Dual

20 µs

R-PDIP-T20

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

ADADC72KM

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

32

DIP

Rectangular

Metal

1

No

20 V

1

Bipolar

16

0.003 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

AD579JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

10

0.0732 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

2.4 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

1.612 in (40.945 mm)

AD7772CQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

76 kHz

1

BICMOS

12

0.0122 %

5 V

Binary, Offset Binary, Comp Binary, 2's Complement Binary, Comp 2's Complement, Comp Offset Binary

5,-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-25 °C (-13 °F)

Tin Lead

Dual

10.2 µs

R-GDIP-T20

0.197 in (5 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.195 mm)

LTC1096IN8#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

9.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Dual

32 µs

R-PDIP-T8

0.3 in (7.62 mm)

No

e0

AD7574JN/+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

15 µs

R-PDIP-T18

0.176 in (4.48 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

LTC1290BIN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

50 kHz

1

CMOS

12

0.0122 %

5 V

2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5.05 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

13 µs

R-PDIP-T20

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

ADC912HP

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

12

7 mA

0.0244 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

13.5 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7672BQ03

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

15 V

1

CMOS

12

12 mA

0.024 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

3.25 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC908FP

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

8

2.5 mA

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

7 µs

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.885 in (22.48 mm)

AD7701TQ/883B

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

CMOS

38535Q/M;38534H;883B

16

3.2 mA

0.0015 %

5 V

Binary

±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD779SD

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

6.3 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.