Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
Analog To Digital Converter, Dual-Slope |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 |
9 V |
Binary |
Flatpack |
0.031 in (0.8 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
0.394 in (10 mm) |
||||||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
5.25 V |
250 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
3.2 µs |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.7 V |
150 kHz |
1 |
16 |
0.0122 % |
2.7 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
4.66 µs |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.512 V |
1 |
24 |
0.0083 % |
3.3 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-12 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Dual |
163.44 ms |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
10 |
5 V |
Binary |
3.3,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
50 ns |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.2 mm) |
|||||||||||||
|
Cirrus Logic |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.94 V |
192 kHz |
1 |
24 |
3.3 V |
2's Complement Binary |
3.3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
-10 °C (14 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
3 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
16 |
0.0015 % |
9 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.05 in (52.07 mm) |
|||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
16 |
0.0015 % |
9 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
2.05 in (52.07 mm) |
||||||||||||||
|
Linear Technology |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.048 V |
200 kHz |
1 |
CMOS |
14 |
0.0076 % |
5 V |
Binary, 2's Complement Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-2.048 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
4 µs |
R-PDIP-T28 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
52 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2.064 V |
5 MHz |
1 |
CMOS |
12 |
0.0244 % |
3.3 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.034 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
170 ns |
R-PQCC-N52 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
4.096 V |
1 |
BICMOS |
12 |
0.024 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP24,.24 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
No |
e0 |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
16 |
Yes |
2.048 V |
300 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP24,.24 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-2.048 V |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
R-PDSO-G24 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.341 in (8.65 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
128 kHz |
1 |
BICMOS |
14 |
34 mA |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
6.3 µs |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.473 in (37.425 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
3 V |
83 kHz |
1 |
CMOS |
14 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-3 V |
Serial, Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Track |
Quad |
10.5 µs |
S-PQCC-J28 |
3 |
0.178 in (4.51 mm) |
0.453 in (11.5062 mm) |
No |
e3 |
260 °C (500 °F) |
0.453 in (11.5062 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Ball |
100 |
LFBGA |
Square |
Plastic/Epoxy |
64 |
Yes |
1 |
20 |
0.00015 % |
5 V |
Offset Binary |
3,5 V |
Grid Array, Low Profile, Fine Pitch |
BGA100,10X10,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Tin Silver Copper |
Sample |
Bottom |
S-PBGA-B100 |
3 |
0.059 in (1.5 mm) |
0.354 in (9 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
1 |
CMOS |
16 |
0.0015 % |
9 V |
Binary |
9 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e0 |
0.653 in (16.585 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Dual-Slope |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
1 |
CMOS |
16 |
0.0015 % |
9 V |
Binary |
9 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e3 |
245 °C (473 °F) |
0.653 in (16.585 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.05 V |
12.5 kHz |
1 |
CMOS |
12 |
500 μA |
0.0488 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
6 |
Yes |
2.5 V |
600 kHz |
1 |
12 |
0.0244 % |
3 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin/Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
3 |
Yes |
10 V |
200 kHz |
1 |
16 |
0.0046 % |
5 V |
Binary, 2's Complement Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-10 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
3 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.504 in (12.8 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.7 V |
150 kHz |
1 |
16 |
0.0092 % |
2.7 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
4.66 µs |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.7 V |
150 kHz |
1 |
16 |
0.0092 % |
2.7 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
4.66 µs |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.9 mm) |
No |
e3 |
0.193 in (4.9 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.7 V |
150 kHz |
1 |
16 |
0.0122 % |
2.7 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
4.66 µs |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
40 MHz |
1 |
CMOS |
16 |
0.0069 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
10 MHz |
1 |
CMOS |
12 |
0.0269 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
38 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
16 |
Yes |
2.75 V |
1 |
24 |
5 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin/Lead |
Quad |
170 ms |
R-PQCC-N38 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.276 in (7 mm) |
||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.25 V |
400 MHz |
1 |
10 |
0.0488 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP24,.24 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-1.25 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
4 µs |
R-PDSO-G24 |
1 |
0.068 in (1.73 mm) |
0.154 in (3.9 mm) |
No |
e0 |
245 °C (473 °F) |
0.341 in (8.65 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.25 V |
400 MHz |
1 |
10 |
0.0488 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP24,.24 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-1.25 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
4 µs |
R-PDSO-G24 |
1 |
0.068 in (1.73 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.341 in (8.65 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
200 mV |
1 |
CMOS |
24 |
0.05 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e0 |
0.653 in (16.585 mm) |
|||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
200 mV |
1 |
CMOS |
24 |
0.05 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e3 |
245 °C (473 °F) |
0.653 in (16.585 mm) |
|||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
108 kHz |
1 |
24 |
15 mA |
5 V |
2's Complement Binary |
3.3,5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP14,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
-10 °C (14 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G16 |
2 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
108 kHz |
1 |
24 |
5 V |
2's Complement Binary |
3.3,5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP14,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
Serial |
-10 °C (14 °F) |
Dual |
R-PDSO-G16 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
0.197 in (5 mm) |
|||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
31 kHz |
1 |
CMOS |
8 |
1.25 mA |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Analog to Digital Converters |
4.5 V |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Nickel Palladium Gold |
Sample |
Dual |
32 µs |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.256 in (6.5 mm) |
||||||||
Texas Instruments |
Analog To Digital Converter |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
9 V |
7-Segment |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T40 |
No |
||||||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
87 kHz |
1 |
CMOS |
10 |
1.5 mA |
0.0977 % |
2.7 V |
Binary |
3/5 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
2.7 V |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Nickel/Palladium/Gold |
Sample |
Dual |
25 µs |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
260 °C (500 °F) |
0.283 in (7.2 mm) |
|||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Hybrid |
16 |
0.003 % |
15 V |
Binary, Complementary Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Gold |
Sample |
Dual |
10 µs |
R-CDIP-T32 |
0.225 in (5.72 mm) |
0.9 in (22.86 mm) |
No |
e4 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
4 |
No |
5 V |
100 kHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
2.4 µs |
R-PDIP-T24 |
0.18 in (4.57 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.165 in (29.59 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5 V |
50 kHz |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
2.4 µs |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.472 in (37.4 mm) |
||||||||||||||
Silicon360 |
Analog To Digital Converter, Resistance Ladder |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.55 V |
50 MHz |
1 |
8 |
0.1953 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
1.7 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
0.402 in (10.2 mm) |
|||||||||||||||||||
|
NXP Semiconductors |
Analog To Digital Converter, Resistance Ladder |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.55 V |
50 MHz |
1 |
8 |
0.1953 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
1.7 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
0.402 in (10.2 mm) |
||||||||||||||||||
|
Cirrus Logic |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
192 kHz |
1 |
CMOS |
24 |
43 mA |
5 V |
2's Complement Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
Serial |
-10 °C (14 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G24 |
3 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0.307 in (7.8 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.05 V |
12.5 kHz |
1 |
CMOS |
12 |
500 μA |
0.0488 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
36 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
20.8 kHz |
1 |
CMOS |
16 |
0.0031 % |
5 V |
Binary |
-5 V |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
2.8 µs |
R-PDSO-G36 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
100 kHz |
1 |
16 |
0.0046 % |
5 V |
2's Complement Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
8 µs |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.705 in (17.9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
3 |
Yes |
10 V |
200 kHz |
1 |
16 |
0.0046 % |
5 V |
Binary, 2's Complement Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-10 V |
Serial |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
3 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.504 in (12.8 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.048 V |
1.25 MHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.048 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
650 ns |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.492 in (12.5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.048 V |
1.25 MHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.048 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
650 ns |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.492 in (12.5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
5.25 V |
250 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
3.2 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.