Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
38 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
16 |
Yes |
5.5 V |
1 |
CMOS |
16 |
0.002 % |
5 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Quad |
149.9 ms |
R-PQCC-N38 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
20.505 V |
500 kHz |
1 |
CMOS |
18 |
0.0015 % |
5 V |
2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-20.455 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Dual |
1.5 µs |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
1 |
BICMOS |
12 |
0.024 % |
Offset Binary |
5,-12/-15 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDSO-G24 |
No |
e0 |
|||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
125 MHz |
1 |
CMOS |
10 |
0.0586 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
5 V |
1 MHz |
1 |
CMOS |
16 |
0.0015 % |
5 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.5 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
527 ns |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
3.05 V |
15 kHz |
1 |
CMOS |
10 |
350 μA |
0.0488 % |
3 V |
Binary, 2's Complement Binary |
-3 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-3.05 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G20 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
245 °C (473 °F) |
0.504 in (12.8 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.05 V |
50 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-5.05 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-PDSO-G20 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e0 |
0.504 in (12.8015 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
66.7 kHz |
1 |
12 |
0.0244 % |
5 V |
2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, Word |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
1.25 µs |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
0.402 in (10.2 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.55 V |
1.4 kHz |
1 |
CMOS |
12 |
0.0732 % |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G24 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
0.323 in (8.2 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.056 V |
500 kHz |
1 |
CMOS |
12 |
4.3 mA |
0.0366 % |
3 V |
Binary |
Small Outline, Very Thin Profile, Shrink Pitch |
TSSOP8,.1 |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
250 kHz |
1 |
10 |
0.0977 % |
2.7 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
2.9 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1.253 V |
250 Hz |
1 |
CMOS |
16 |
0.013 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.5 V |
1 |
16 |
0.0046 % |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-2.5 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Dual |
149.6 ms |
R-PDSO-G16 |
1 |
0.068 in (1.727 mm) |
0.154 in (3.899 mm) |
No |
e0 |
0.193 in (4.8895 mm) |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
14 |
0.0183 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2 V |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
20 V |
1 |
Bipolar |
12 |
0.012 % |
Offset Binary |
5,±15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-XDIP-T28 |
No |
e0 |
||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
15 V |
1 |
CMOS |
12 |
9 mA |
0.024 % |
5 V |
Binary |
5,-12/-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-15 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
10.4 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.199 in (30.45 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
1 |
CMOS |
11 |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
Hybrid |
12 |
0.0122 % |
12 V |
Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP32,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
4.5 µs |
R-CDIP-T32 |
0.275 in (6.98 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
250 mV |
20 MHz |
1 |
BICMOS |
10 |
5 V |
Offset Binary, 2's Complement Binary |
5,5,5,-5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-250 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
128 kHz |
1 |
BIMOS |
14 |
12 V |
Binary, 2's Complement Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Sample |
Dual |
6.3 µs |
R-CDIP-T28 |
0.165 in (4.191 mm) |
0.6 in (15.24 mm) |
1.41 in (35.815 mm) |
||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.05 V |
500 kHz |
1 |
10 |
0.0977 % |
5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
1.4 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
170 MHz |
1 |
CMOS |
10 |
0.0977 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
38 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
16 |
Yes |
5.5 V |
1 |
CMOS |
16 |
0.002 % |
5 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Quad |
149.9 ms |
R-PQCC-N38 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.197 in (5 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.75 V |
1 |
24 |
5.5 V |
Binary |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-2.75 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Dual |
163.44 ms |
R-PDSO-G16 |
1 |
0.068 in (1.727 mm) |
0.154 in (3.899 mm) |
No |
e0 |
0.193 in (4.8895 mm) |
||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
52 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
4.115 V |
2 MHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
4.078 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQCC-N52 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e3 |
260 °C (500 °F) |
0.315 in (8 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
15 V |
1 |
CMOS |
12 |
9 mA |
0.024 % |
5 V |
Binary |
5,-12/-15 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-15 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
10.4 µs |
R-PDSO-G24 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
30 s |
240 °C (464 °F) |
0.606 in (15.4 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
128 kHz |
1 |
BICMOS |
14 |
34 mA |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
6.3 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
128 kHz |
1 |
BICMOS |
14 |
34 mA |
0.0122 % |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
6.3 µs |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.473 in (37.425 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
2.2 MHz |
1 |
BICMOS |
14 |
80 mA |
5 V |
Binary |
5,5,5,-5 V |
-5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-2.5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-J44 |
0.18 in (4.57 mm) |
0.653 in (16.5862 mm) |
No |
e0 |
0.653 in (16.5862 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
20 MHz |
1 |
CMOS |
10 |
0.1953 % |
3 V |
Binary |
3/5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQFP-G48 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
12 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
1 |
16 |
0.0122 % |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
23 ms |
R-PDSO-G12 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3 V |
1 |
CMOS |
12 |
5 V |
Binary, 2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-3 V |
Serial, Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
9 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.25 in (31.75 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
170 MHz |
1 |
CMOS |
12 |
0.0513 % |
2.5 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
3.05 V |
6.6 kHz |
1 |
CMOS |
12 |
390 μA |
0.0488 % |
3 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
100 µs |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.25 V |
500 kHz |
1 |
12 |
0.0244 % |
5 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
1.6 µs |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
1 V |
1 |
20 |
0.0002 % |
5 V |
Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Track |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
16 |
HVSON |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
250 kHz |
1 |
CMOS |
16 |
0.0011 % |
2.5 V |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Dual |
3 µs |
R-PDSO-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
3 V |
8.3 kHz |
1 |
CMOS |
12 |
5 V |
Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-3 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Track |
Quad |
7.125 µs |
S-PQCC-J28 |
3 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e3 |
260 °C (500 °F) |
0.453 in (11.5062 mm) |
|||||||||||
Analog Devices |
Digital To Analog Converter |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
Hybrid |
12 |
Binary, Offset Binary, 2's Complement, Offset 2's Complement |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-XDIP-T32 |
No |
e0 |
|||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5.05 V |
46.5 kHz |
1 |
CMOS |
12 |
12 mA |
0.0122 % |
5 V |
Binary, 2's Complement Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5.05 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
12 µs |
R-PDIP-T20 |
1 |
0.15 in (3.81 mm) |
0.3 in (7.62 mm) |
No |
e3 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
VQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
125 MHz |
2 |
CMOS |
12 |
0.0488 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
Bipolar |
12 |
40 mA |
0.0244 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
35 µs |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
30 s |
225 °C (437 °F) |
0.453 in (11.5062 mm) |
||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Pin/Peg |
72 |
Rectangular |
1 |
No |
10 V |
1 |
8 |
0.3906 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Dual |
1 µs |
R-XDMA-P72 |
No |
|||||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5 V |
50 kHz |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
2.4 µs |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.472 in (37.4 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
9.05 V |
33 kHz |
1 |
8 |
0.3906 % |
3 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Dual |
32 µs |
R-PDIP-T8 |
0.3 in (7.62 mm) |
No |
e3 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
22 |
Rectangular |
1 |
No |
15 V |
20 MHz |
1 |
Hybrid |
8 |
0.01 % |
5 V |
Binary |
Microelectronic Assembly |
70 °C (158 °F) |
-15 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Gold |
Sample |
Dual |
45.05 ns |
R-XDMA-P22 |
No |
e4 |
|||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
4.75 V |
1 MHz |
1 |
CMOS |
16 |
0.0031 % |
5 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.5 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
600 ns |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
3 V |
1 |
CMOS |
12 |
5 V |
Binary, 2's Complement Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-3 V |
Serial, Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Track |
Quad |
9 µs |
S-PQCC-J28 |
3 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e3 |
260 °C (500 °F) |
0.453 in (11.5062 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.