Commercial Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD9280JRSRL

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

3 V

32 MHz

1

CMOS

8

0.5859 %

3 V

Binary

3/5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.402 in (10.2 mm)

AD579JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

10

0.0732 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

2.4 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

1.612 in (40.945 mm)

LTC2376CDE-20#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

16

HVSON

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

250 kHz

1

CMOS

20

0.0002 %

2.5 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

3 µs

R-PDSO-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

AD574ALP

Analog Devices

Analog To Digital Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

20 V

1

Bipolar

12

0.012 %

Offset Binary

5,±12/±15 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

AD7574JN/+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

15 µs

R-PDIP-T18

0.176 in (4.48 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

LTC2291CUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

25 MHz

2

CMOS

12

0.0317 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-500 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2344CUH-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

4

Yes

4.101 V

400 kHz

1

CMOS

16

0.0019 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-4.091 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

2.08 µs

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

ADC912HP

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

12

7 mA

0.0244 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

13.5 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

LTC1740CG#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

36

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

6 MHz

1

CMOS

14

0.0153 %

5 V

2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

135 ns

R-PDSO-G36

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

0.504 in (12.8 mm)

LTC2447CUHF#TR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

38

HVQCCN

Rectangular

Plastic/Epoxy

8

Yes

2.75 V

1

24

5 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Quad

170 ns

R-PQCC-N38

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.276 in (7 mm)

AD7572JP12/883B

Analog Devices

Analog To Digital Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Sample

Quad

12.5 µs

S-PQCC-J28

0.178 in (4.51 mm)

0.453 in (11.5062 mm)

No

0.453 in (11.5062 mm)

LTC2295CUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1 V

10 MHz

1

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-500 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2234CUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

135 MHz

1

CMOS

10

0.0781 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2462CDD#PBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

12

HVSON

Square

Plastic/Epoxy

1

Yes

1.25 V

60 Hz

1

16

0.0153 %

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

23 ms

S-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC2378CMS-20#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1 MHz

1

CMOS

20

0.0002 %

2.5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin

Dual

675 ns

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

LTM9009CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

80 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

3

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.443 in (11.25 mm)

LTC1288CN8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

3.05 V

6.6 kHz

1

CMOS

12

390 μA

0.0488 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

AD1380JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

50 kHz

1

Hybrid

16

0.006 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

14 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e4

AD7576JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

MIL-M-38510

8

0.3906 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

20 µs

R-PDIP-T18

0.18 in (4.58 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

LTC2122CUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.5 V

170 MHz

1

CMOS

14

0.0311 %

1.8 V

Offset Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.5 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

0.276 in (7 mm)

LTC2263CUJ-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

25 MHz

1

CMOS

14

0.0183 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD9038JZ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

500 mV

325 MHz

1

Bipolar

8

495 mA

0.39 %

Offset Binary, 2's Complement Binary

-5.2 V

-5.2 V

Flatpack

QFP68,1.1SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-6 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Quad

3.3 ns

S-CQFP-G68

0.118 in (2.997 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

LTC2220CUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

170 MHz

1

CMOS

12

0.0366 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LT1605ACG#PBF

Analog Devices

Analog To Digital Converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

16

0.003 %

5 V

2's Complement Binary

5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDSO-G28

No

ADC85C-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

10

140 mA

0.048 %

15 V

Complementary Offset Binary, Complementary Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.23 in (5.84 mm)

0.9 in (22.86 mm)

No

e0

1.612 in (40.945 mm)

LTC1417CGN#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

400 kHz

1

CMOS

14

0.0122 %

5 V

Binary, 2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

-2.048 V

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

2.25 µs

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

e0

0.193 in (4.9 mm)

AD574ALNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

Bipolar

12

40 mA

0.0122 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

35 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

1.445 in (36.71 mm)

LTC2480CMS

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

1

Yes

5.5 V

1

16

0.001 %

5 V

Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Dual

163.5 ms

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

AD574KD

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

Bipolar

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

LTC1282ACN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

1.25 V

11.6 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

-3 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-1.25 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

6 µs

R-PDIP-T24

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

LTC1199LCS8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.05 V

500 kHz

1

10

0.0977 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

1.4 µs

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.899 mm)

No

e0

0.193 in (4.9025 mm)

LTC2171CUKG-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

40 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2310CMSE-12#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

HTSSOP

Rectangular

Plastic/Epoxy

1

Yes

2.054 V

2 MHz

1

CMOS

12

0.0244 %

3.3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-2.042 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G16

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

0.159 in (4.039 mm)

LTC2247CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

40 MHz

1

CMOS

14

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC1864ACMS8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

1

Yes

5.25 V

250 kHz

1

16

0.0092 %

5 V

Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

3.2 µs

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

ADADC84-122

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

12

0.0003 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.23 in (5.84 mm)

0.9 in (22.86 mm)

No

e0

1.62 in (41.15 mm)

LTC2377CDE-20#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

16

HVSON

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

500 kHz

1

CMOS

20

0.0002 %

2.5 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin

Dual

1.5 µs

R-PDSO-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

LTC2284CUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1 V

105 MHz

1

CMOS

14

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-500 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC1272CCSW-8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

250 kHz

1

CMOS

12

0.0244 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

8.125 µs

R-PDSO-G24

0.104 in (2.642 mm)

0.295 in (7.493 mm)

e3

0.606 in (15.395 mm)

AD876JSTZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

2 V

20 MHz

1

CMOS

10

25 mA

5 V

Binary

3.3,5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQFP-G48

3

0.067 in (1.7 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD7572AJNZ03

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

9 mA

0.024 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

3.25 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.199 in (30.45 mm)

LTC2310CMSE-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

HTSSOP

Rectangular

Plastic/Epoxy

1

Yes

2.054 V

2 MHz

1

CMOS

16

0.0122 %

3.3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-2.042 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

260 °C (500 °F)

0.159 in (4.039 mm)

LTC2259CUJ-16#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

80 MHz

1

CMOS

16

0.0183 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2207CUK-14#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

105 MHz

1

CMOS

14

0.0092 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

LTC1861CS8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2

Yes

5.25 V

250 kHz

1

12

0.0244 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

3.2 µs

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0.193 in (4.9 mm)

LTC2281CUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

2

CMOS

10

0.0684 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD1671JP

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1.25 MHz

1

BICMOS

12

68 mA

0.061 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

800 ns

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

30 s

225 °C (437 °F)

0.453 in (11.5062 mm)

LTC2385CUH-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

4.176 V

5 MHz

1

CMOS

16

0.0008 %

2.5 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-4.016 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.