Commercial Analog-to-Digital Converters 2,400+

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7886JD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1.1 MHz

1

BICMOS

12

35 mA

0.048 %

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

100 ns

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD1330CCSKD

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

48

DIP

Rectangular

Ceramic

1

No

10 V

1

Hybrid

18

0.05 %

Offset Binary

5,±15 V

In-Line

DIP48,1.0

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T48

No

e0

AD7572LN05

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0122 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

5.2 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.227 in (31.165 mm)

AD872JD

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

10 MHz

1

BICMOS

12

5 V

Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

LTC1283CN#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

3.05 V

15 kHz

1

CMOS

10

0.0488 %

3 V

Binary, 2's Complement Binary

-3 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-3.05 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

R-PDIP-T20

0.3 in (7.62 mm)

No

e3

LTC2431CMS#PBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

1

Yes

5.8 V

1

20

0.002 %

Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

2.4 V

Serial

0 °C (32 °F)

Matte Tin

Dual

163.44 ms

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC1276ACSW#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

300 kHz

1

BICMOS

12

0.0122 %

5 V

Binary, 2's Complement Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

2.7 ms

R-PDSO-G24

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e0

0.606 in (15.395 mm)

AD7875KNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Track

Dual

9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.25 in (31.75 mm)

AD7878LPZ-REEL

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

3 V

8.3 kHz

1

CMOS

12

5 V

Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Track

Quad

7.125 µs

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

260 °C (500 °F)

0.453 in (11.5062 mm)

LTC2374CUH-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

8

Yes

5 V

1.6 MHz

1

CMOS

16

0.0015 %

5 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

427 ns

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

260 °C (500 °F)

0.197 in (5 mm)

LTC1860CS8#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.25 V

250 kHz

1

12

0.0244 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

3.2 µs

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

LTC1860LCS8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

150 kHz

1

12

0.0244 %

3 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

4.66 µs

R-PDSO-G8

0.069 in (1.752 mm)

0.154 in (3.899 mm)

No

e0

0.193 in (4.9025 mm)

LTC1401CS8#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

200 kHz

1

CMOS

12

0.0244 %

3 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

4.1 µs

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9025 mm)

LTC1418ACG#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

200 kHz

1

14

0.0076 %

5 V

Binary, 2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-2.048 V

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

4 µs

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

LTC1749CFW#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

80 MHz

1

CMOS

12

0.0244 %

5 V

Offset Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G48

1

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e3

30 s

260 °C (500 °F)

0.492 in (12.5 mm)

LTC1415CG#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

1.25 MHz

1

CMOS

12

20 mA

0.0244 %

5 V

Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

700 ns

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

AD573JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

50 kHz

1

Bipolar

10

0.0977 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

30 µs

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.07 in (27.18 mm)

AD676JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

100 kHz

1

BIMOS

16

12 mA

0.003 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

1 ms

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

LTC2241CUP-12#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

210 MHz

1

12

0.0562 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC1282ACN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

1.25 V

140 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

-3 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-1.25 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin/Lead

Sample

Dual

6 µs

R-PDIP-T24

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

20 s

235 °C (455 °F)

AD7870LP-REEL

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

3 V

1

CMOS

12

0.0122 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Quad

9 µs

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

0.453 in (11.5062 mm)

LTC1419CSW#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

800 kHz

1

CMOS

14

0.0122 %

5 V

2's Complement Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

1.15 µs

R-PDSO-G28

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e0

0.704 in (17.89 mm)

LTC1606ACSW#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

250 kHz

1

Bipolar

16

0.0031 %

5 V

2's Complement Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.5 µs

R-PDSO-G28

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e3

30 s

260 °C (500 °F)

0.704 in (17.89 mm)

LTC1292DCN8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5.05 V

60 kHz

1

CMOS

12

0.0183 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

12 µs

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

LTC1282BCSW#TRMPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

1.25 V

140 kHz

1

BICMOS

12

7.8 mA

0.024 %

3 V

2's Complement Binary

-3 V

Small Outline

SOP24,.4

0.05 in (1.27 mm)

70 °C (158 °F)

-1.25 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

6 µs

R-PDSO-G24

0.104 in (2.642 mm)

0.295 in (7.493 mm)

e3

0.606 in (15.395 mm)

LTC2382CDE-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

16

HVSON

Rectangular

Plastic/Epoxy

1

Yes

2.6 V

500 kHz

1

CMOS

16

0.0031 %

2.5 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

70 °C (158 °F)

-2.4 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

1.5 µs

R-PDSO-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

LTC2263CUJ-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

25 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC1282ACSW#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

1.25 V

11.6 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

-3 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-1.25 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

6 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

AD9224JRS

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

40 MHz

1

CMOS

12

0.1221 %

5 V

Binary

3/5,5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.402 in (10.2 mm)

LTC1606ACSW

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

250 kHz

1

Bipolar

16

0.0031 %

5 V

2's Complement Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

2.5 µs

R-PDSO-G28

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e0

0.704 in (17.89 mm)

LTC2191CUKG#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2 V

40 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.315 in (8 mm)

LTC1290CCSW#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

8

Yes

5.05 V

50 kHz

1

CMOS

12

0.0122 %

5 V

2's Complement Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-5.05 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

13 µs

R-PDSO-G20

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8015 mm)

LTC2268CUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

125 MHz

1

CMOS

14

0.0214 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD7824LNZ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

4

No

5 V

100 kHz

1

CMOS

8

0.1953 %

5 V

Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

2.4 µs

R-PDIP-T24

0.18 in (4.57 mm)

0.3 in (7.62 mm)

No

e3

1.165 in (29.59 mm)

LTC1747CFW

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.6 V

80 MHz

1

CMOS

12

0.0366 %

5 V

Offset Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

R-PDSO-G48

1

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e0

20 s

235 °C (455 °F)

0.492 in (12.5 mm)

HAS-1201KM

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

46

DIP

Rectangular

1

No

15 V

1 MHz

1

Hybrid

12

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,-5.2,±15 V

-15 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

950 ns

R-XDIP-T46

0.231 in (5.86 mm)

1.3 in (33.02 mm)

No

e0

AD7575JR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

15 µs

R-PDSO-G18

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

AD9060JZ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Gull Wing

68

HQFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

75 MHz

1

Bipolar

10

0.2441 %

5 V

Offset Binary, 2's Complement Binary

5,-5.2 V

-5.2 V

Flatpack, Heat Sink/Slug

QFP68,1.1SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-1.75 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Quad

13.3 ns

S-CQFP-G68

0.143 in (3.625 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

AD574AKD/+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

12

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

35 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

LTC2415CGN#TR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.75 V

1

24

3.3 V

Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

-2.75 V

Serial

0 °C (32 °F)

Tin Lead

Dual

81.72 ms

R-PDSO-G16

1

0.068 in (1.727 mm)

0.154 in (3.899 mm)

No

e0

0.193 in (4.8895 mm)

LTC1282BCN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

1.25 V

140 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

-3 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-1.25 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin/Lead

Sample

Dual

6 µs

R-PDIP-T24

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

20 s

235 °C (455 °F)

LTC1860CMS8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

1

Yes

5.25 V

250 kHz

1

12

0.0244 %

5 V

Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

3.2 µs

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

AD7871KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

83 kHz

1

CMOS

14

0.0061 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

10.5 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.7 mm)

LTC2386CUH-18#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

4.102 V

10 MHz

1

CMOS

18

0.0007 %

5 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-4.09 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

78 ns

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2162CUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

65 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N48

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

LTC1400CS8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

400 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-2.048 V

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

2.1 µs

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.899 mm)

No

e0

0.193 in (4.9025 mm)

AD7575JRZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

15 µs

R-PDSO-G18

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

0.455 in (11.55 mm)

LTC2414CGN#TR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

2.75 V

1

24

0.0014 %

5 V

Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

-2.75 V

Serial

0 °C (32 °F)

Tin Lead

Dual

163.44 ms

R-PDSO-G28

1

0.069 in (1.748 mm)

0.154 in (3.899 mm)

No

e0

0.389 in (9.893 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.