Commercial Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC1407ACMSE

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

2.5 V

3 MHz

1

14

0.0244 %

3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

LTC2207CUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

105 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2261CUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

125 MHz

1

CMOS

14

0.0229 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2377CDE-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

16

HVSON

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

500 kHz

1

CMOS

18

0.0007 %

2.5 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin

Dual

1.5 µs

R-PDSO-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

HAS-1002

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic

1

No

1

Bipolar

10

Offset Binary

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T32

No

e0

LTC2184CUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.25 V

105 MHz

1

CMOS

16

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

700 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

0.354 in (9 mm)

LTC1605-2CG

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

4 V

100 kHz

1

CMOS

16

0.0046 %

5 V

2's Complement Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-4 V

Parallel, Word

0 °C (32 °F)

Tin/Lead

Sample

Dual

8 µs

R-PDSO-G28

1

0.078 in (1.99 mm)

0.209 in (5.3 mm)

No

e0

0.402 in (10.2 mm)

AD679KN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

0.0122 %

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

6.3 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.473 in (37.425 mm)

LTC1604CG

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

36

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

20.8 kHz

1

CMOS

16

0.0061 %

5 V

Binary

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

2.8 µs

R-PDSO-G36

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.504 in (12.8 mm)

LTC2263CUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

25 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD1674JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

111 kHz

1

BICMOS

12

18 mA

0.0244 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

10 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

LTC2240CUP-12#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

170 MHz

1

CMOS

12

0.0513 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2268CUJ-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

125 MHz

1

CMOS

14

0.0214 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC1276BCN#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

300 kHz

1

BICMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

2.7 ms

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

LTC2370CMS-16#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

2 MHz

1

CMOS

16

0.0013 %

2.5 V

Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Dual

322 ns

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

LTC1279CG#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

1

Yes

1

CMOS

12

Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.323 in (8.2 mm)

LTC2473CDD#PBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

12

HVSON

Square

Plastic/Epoxy

1

Yes

1.253 V

1

CMOS

16

0.0183 %

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

4.8 ms

S-PDSO-N12

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC2247CUH#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

40 MHz

1

CMOS

14

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD578ZJD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

12

0.0122 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

6 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

LTC2202CUK#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.5 V

10 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

LTC1415CG#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

1.25 MHz

1

CMOS

12

20 mA

0.0244 %

5 V

Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin/Lead

Sample

Dual

700 ns

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.402 in (10.2 mm)

LTC1289CCSW#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

8

Yes

3.05 V

25 kHz

1

CMOS

12

0.0122 %

3 V

2's Complement Binary

-3 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-3.05 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

26 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

255 °C (491 °F)

0.504 in (12.8 mm)

LTC2378CDE-18#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

16

HVSON

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1 MHz

1

CMOS

18

0.0007 %

2.5 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin

Dual

527 ns

R-PDSO-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

AD7572KN05/883B

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Sample

Dual

5 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

1.227 in (31.165 mm)

LTC2321CUFD-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

28

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.053 V

2 MHz

1

CMOS

16

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.044 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

R-PQCC-N28

1

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC1864LACMS8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

1

Yes

2.5 V

150 kHz

1

16

0.0092 %

2.7 V

Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

4.66 µs

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

AD678KN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

200 kHz

1

BIMOS

12

0.0244 %

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

4.4 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.7 mm)

LTC2328CMS-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

10.2525 V

1 MHz

1

CMOS

16

0.0023 %

5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-10.2275 V

Serial

0 °C (32 °F)

Matte Tin

Dual

527 ns

R-PDSO-G16

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

0.159 in (4.039 mm)

LTC2260CUJ-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

105 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD7828KP

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

8

Yes

5 V

50 kHz

1

CMOS

8

0.3906 %

5 V

Binary, Complementary Offset Binary

5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Quad

2.4 µs

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

0.453 in (11.5062 mm)

LTC2378CDE-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

16

HVSON

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1 MHz

1

CMOS

18

0.0007 %

2.5 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.018 in (0.45 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin

Dual

527 ns

R-PDSO-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.157 in (4 mm)

AD7875LPZ-REEL

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Track

Quad

9 µs

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

260 °C (500 °F)

0.453 in (11.5062 mm)

LTC1860CS8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.25 V

250 kHz

1

12

0.0244 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

3.2 µs

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0.193 in (4.9 mm)

LTC1272-3ACSW

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

15 V

250 kHz

1

BICMOS

12

0.0122 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-300 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

3 ms

R-PDSO-G24

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e0

0.606 in (15.395 mm)

LTC1419ACSW#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

800 kHz

1

CMOS

14

0.0076 %

5 V

2's Complement Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Tin/Lead

Sample

Dual

1.15 µs

R-PDSO-G28

1

0.104 in (2.642 mm)

0.295 in (7.493 mm)

No

e0

40 s

255 °C (491 °F)

0.704 in (17.89 mm)

AD7574SCHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

18

DIE

1

Yes

15 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

Uncased Chip

70 °C (158 °F)

-15 V

Parallel, 8 Bits

0 °C (32 °F)

Upper

15 µs

X-XUUC-N18

No

LTC2313CTS8-14#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

2.056 V

2.5 MHz

1

CMOS

14

0.0244 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

LTC2246CUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

25 MHz

1

CMOS

14

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC1277CSW#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

8.3 kHz

1

CMOS

12

5 V

Binary

-5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-2.048 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

8 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

AD7572LP12/883B

Analog Devices

Analog To Digital Converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

5 V

Complementary Offset Binary

5,-15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Sample

Quad

12.5 µs

S-PQCC-J28

0.178 in (4.51 mm)

0.453 in (11.5062 mm)

No

0.453 in (11.5062 mm)

LTC1409CG#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

66.7 kHz

1

12

0.0244 %

5 V

2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

1.25 µs

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

LTC2482CDD

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

1

Yes

2.75 V

1

16

Binary

Small Outline, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

50 mV

Serial

0 °C (32 °F)

Tin Lead

Dual

149.9 ns

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

LTC2173CUKG-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

80 MHz

1

CMOS

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2378CMS-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1 MHz

1

CMOS

18

0.0007 %

2.5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin

Dual

527 ns

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

AD7572LP12

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1

Yes

5 V

1

CMOS

12

0.0122 %

5 V

Binary

5,-15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

13 µs

S-PQCC-J28

0.178 in (4.51 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

ADADC84Z-12

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.012 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

LTC2262CUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

150 MHz

1

CMOS

12

0.0269 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.016 in (0.4 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC1199LCMS8#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

1

Yes

5.05 V

500 kHz

1

10

0.0977 %

5 V

Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

1.4 µs

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.