Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
Ball |
376 |
HBGA |
Square |
300k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
2 |
Yes |
800 mV |
3200 MHz |
1 |
CMOS |
MIL-STD-883 |
12 |
1.29 A |
0.1831 % |
1.9 V |
Offset Binary, 2's Complement Binary |
1.9 V |
Grid Array, Heat Sink/Slug |
PGA376(UNSPEC) |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-55 °C (-67 °F) |
Track |
Bottom |
S-CBGA-B376 |
1 |
0.138 in (3.5 mm) |
1.1 in (27.94 mm) |
No |
Peak-to-peak input voltage range: 0.8 V |
1.1 in (27.94 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
10 |
15 mA |
0.1 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
30 µs |
R-CDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
8 |
15 mA |
0.2 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
30 µs |
R-CDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 V |
100 MHz |
1 |
CMOS |
38535V;38534K;883S |
8 |
1.3672 % |
3 V |
Binary |
3 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Track |
Quad |
10 ns |
S-CQCC-N20 |
1 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
0.35 in (8.89 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
1 |
No |
20 V |
1 |
MIL-PRF-38535 |
12 |
0.0122 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
24 µs |
R-CDIP-T28 |
0.226 in (5.75 mm) |
0.6 in (15.24 mm) |
Yes |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
5.25 V |
1 MHz |
1 |
16 |
0.0092 % |
5 V |
Binary |
3/5,5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Sample |
Quad |
875 ns |
S-XQCC-N48 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
0.276 in (7 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
1 |
No |
20 V |
1 |
Bipolar |
MIL-PRF-38535 |
12 |
0.0122 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
24 µs |
R-CDIP-T28 |
0.226 in (5.75 mm) |
0.6 in (15.24 mm) |
Yes |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
16 |
Yes |
5 V |
1 MHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Track |
Dual |
800 ns |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
5 V |
1 MHz |
1 |
16 |
0.0092 % |
5 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Parallel, Word |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Quad |
875 µs |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
500 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
1.68 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
|
STMicroelectronics |
Analog To Digital Converter, Successive Approximation |
Military |
Flat |
16 |
SOF |
Rectangular |
300k Rad(Si) |
Plastic/Epoxy |
8 |
Yes |
3.6 V |
1 MHz |
1 |
CMOS |
12 |
0.0269 % |
3.3 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-2.7 V |
Serial |
-55 °C (-67 °F) |
Track |
Dual |
R-PDSO-F16 |
0.107 in (2.72 mm) |
0.272 in (6.905 mm) |
0.391 in (9.94 mm) |
|||||||||||||||||||
|
STMicroelectronics |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
48 |
HSSOP |
Rectangular |
300k Rad(Si) |
Ceramic |
1 |
Yes |
2 V |
50 MHz |
1 |
CMOS |
12 |
2.5 V |
Binary |
2.5 V |
Small Outline, Heat Sink/Slug, Shrink Pitch |
SSOP48,.48 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
125 °C (257 °F) |
-2 V |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Dual |
R-CDSO-G48 |
0.107 in (2.72 mm) |
0.38 in (9.65 mm) |
No |
40 s |
250 °C (482 °F) |
0.613 in (15.57 mm) |
||||||||||||||
|
STMicroelectronics |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
48 |
HSSOP |
Rectangular |
300k Rad(Si) |
Ceramic |
1 |
Yes |
2 V |
50 MHz |
1 |
CMOS |
12 |
0.0415 % |
2.5 V |
Binary |
2.5 V |
Small Outline, Heat Sink/Slug, Shrink Pitch |
SSOP48,.48 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
125 °C (257 °F) |
-2 V |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Dual |
R-CDSO-G48 |
0.107 in (2.72 mm) |
0.38 in (9.65 mm) |
No |
40 s |
250 °C (482 °F) |
0.62 in (15.75 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 V |
10 MHz |
1 |
BICMOS |
MIL-STD-883 |
12 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
2 |
Yes |
2 V |
50 MHz |
1 |
MIL-STD-883 Class B |
8 |
0.49 % |
5 V |
Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J44 |
0.135 in (3.43 mm) |
0.645 in (16.385 mm) |
No |
e0 |
0.645 in (16.385 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
Hybrid |
MIL-STD-883 Class B |
12 |
0.0003 % |
12 V |
Complementary Binary, Complementary 2's Complement, Complementary Offset Binary |
5,±15 V |
-12 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
10 µs |
R-CDIP-T32 |
0.23 in (5.84 mm) |
0.9 in (22.86 mm) |
No |
1.62 in (41.15 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
196 |
CGA |
Rectangular |
300k Rad(Si) |
2 |
Yes |
800 mV |
6400 MHz |
1 |
12 |
Binary |
Grid Array |
125 °C (257 °F) |
-800 mV |
-55 °C (-67 °F) |
Lateral |
R-XLGA-X196 |
0.591 in (15 mm) |
Peak-to-peak input voltage range: 0.8 V |
0.591 in (15 mm) |
|||||||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
11 |
Yes |
5.5 V |
200 kHz |
1 |
12 |
2.4 mA |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Analog to Digital Converters |
2.7 V |
0.026 in (0.65 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Dual |
6.46 µs |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.256 in (6.5 mm) |
|||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
11 |
Yes |
4.25 V |
200 kHz |
1 |
12 |
2.4 mA |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Dual |
6.46 µs |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.256 in (6.5 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Flat |
48 |
QFF |
Square |
100k Rad(Si) |
Plastic/Epoxy |
1 |
Yes |
125 MHz |
1 |
MIL-PRF-38535 Class V |
14 |
0.0488 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
Flatpack |
0.04 in (1.016 mm) |
125 °C (257 °F) |
Serial |
-55 °C (-67 °F) |
Sample |
Quad |
8 ns |
S-PQFP-F48 |
0.105 in (2.66 mm) |
0.563 in (14.305 mm) |
Yes |
0.563 in (14.305 mm) |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
3 |
Yes |
2 V |
40 MHz |
2 |
Hybrid |
MIL-STD-883 Class B |
12 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Flatpack |
QFP68,1.2SQ,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-2 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-G68 |
0.95 in (24.13 mm) |
No |
e0 |
0.95 in (24.13 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
60 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
16 |
No |
10 V |
25 kHz |
1 |
12 |
0.012 % |
15 V |
Binary, Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Gold |
Sample |
Dual |
32 µs |
R-CDIP-T60 |
0.232 in (5.89 mm) |
0.6 in (15.24 mm) |
No |
e4 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
10 V |
500 kHz |
1 |
CMOS |
12 |
0.0305 % |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-55 °C (-67 °F) |
Track |
Dual |
1.6 µs |
R-PDSO-G20 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
0.256 in (6.5 mm) |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
10 V |
500 kHz |
1 |
CMOS |
12 |
0.0305 % |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Track |
Dual |
1.6 µs |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.256 in (6.5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
HVQCCN |
Square |
8 |
Yes |
2.9 V |
250 kHz |
1 |
CMOS |
14 |
0.0061 % |
5 V |
Binary, 2's Complement Binary |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.16SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-250 mV |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Quad |
3.2 µs |
S-XQCC-N20 |
3 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 V |
10 MHz |
1 |
BICMOS |
MIL-STD-883 Class B |
12 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
16 |
0.00992 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Quad |
333.3 ns |
S-XQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
8 |
No |
5.25 V |
15 Hz |
1 |
CMOS |
24 |
0.0025 % |
3 V |
Binary |
3/5 V |
In-Line |
DIP20,.3 |
Other Converters |
2.7 V |
0.1 in (2.54 mm) |
210 °C (410 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Gold |
Sample |
Dual |
R-GDIP-T20 |
0.175 in (4.45 mm) |
0.3 in (7.62 mm) |
No |
e4 |
1.01 in (25.65 mm) |
|||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
32 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
4 V |
6 MHz |
1 |
CMOS |
12 |
40 mA |
0.0439 % |
5 V |
Binary, 2's Complement Binary |
3.3,5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP32,.3 |
Analog to Digital Converters |
3 V |
0.026 in (0.65 mm) |
125 °C (257 °F) |
1.4 V |
Parallel, Word |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Dual |
R-PDSO-G32 |
2 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.433 in (11 mm) |
|||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
11 |
Yes |
5.5 V |
66 kHz |
1 |
CMOS |
12 |
2.5 mA |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
4.5 V |
0.026 in (0.65 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Dual |
10 µs |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.283 in (7.2 mm) |
||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
3 |
Yes |
2 V |
40 MHz |
2 |
Hybrid |
MIL-STD-883 |
12 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Flatpack |
QFP68,1.2SQ,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-2 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-G68 |
0.95 in (24.13 mm) |
Yes |
e0 |
0.95 in (24.13 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
16.5 V |
111 kHz |
1 |
BICMOS |
12 |
18 mA |
0.012 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-16.5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
10 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.0305 % |
3.3 V |
Binary, Offset Binary, 2's Complement Binary |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2 V |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||
Honeywell |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
14 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5.55 V |
100 kHz |
1 |
SOI-CMOS |
12 |
0.06835 % |
5 V |
Binary |
In-Line |
DIP14,.3 |
0.1 in (2.54 mm) |
225 °C (437 °F) |
-300 mV |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Dual |
11.5 µs |
R-CDIP-T14 |
0.146 in (3.7084 mm) |
0.3 in (7.62 mm) |
0.7 in (17.78 mm) |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Hybrid |
MIL-STD-883 Class B |
12 |
0.012 % |
12 V |
Complementary Binary, Complementary 2's Complement, Complementary Offset Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
10 µs |
R-CDIP-T32 |
0.225 in (5.72 mm) |
0.9 in (22.86 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary |
5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
6 µs |
R-GDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
10 V |
400 kHz |
1 |
14 |
0.0122 % |
5 V |
2's Complement Binary |
5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Matte Tin |
Track |
Dual |
2.2 µs |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.705 in (17.9 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
20 V |
1 |
Bipolar |
MIL-STD-883 |
12 |
40 mA |
0.0122 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Quad |
24 µs |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
Yes |
e0 |
0.45 in (11.43 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
20 V |
1 |
Bipolar |
MIL-STD-883 |
12 |
40 mA |
0.0122 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
24 µs |
R-CDIP-T28 |
0.226 in (5.75 mm) |
0.6 in (15.24 mm) |
Yes |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
20 V |
1 |
Bipolar |
MIL-STD-883 |
12 |
40 mA |
0.0122 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
24 µs |
R-CDIP-T28 |
0.226 in (5.75 mm) |
0.6 in (15.24 mm) |
Yes |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1 |
Bipolar |
MIL-STD-883 |
10 |
15 mA |
0.098 % |
5 V |
Binary |
5,-15 V |
-15 V |
In-Line |
DIP18,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
40 µs |
R-CDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
100 kHz |
1 |
BICMOS |
MIL-STD-883 |
16 |
0.0031 % |
12 V |
Binary |
5,±12 V |
-12 V |
In-Line |
DIP16,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
Yes |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
600 kHz |
1 |
CMOS |
MIL-PRF-38535 Class Q |
12 |
0.024 % |
5 V |
2's Complement Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
1.68 µs |
R-GDIP-T24 |
Yes |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
200 kHz |
1 |
BICMOS |
MIL-PRF-38535 Class Q |
16 |
0.0038 % |
5 V |
2's Complement Binary |
5 V |
In-Line |
DIP28,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
4 µs |
R-CDIP-T28 |
Yes |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
40 kHz |
1 |
Bipolar |
8 |
15 mA |
0.2 % |
5 V |
Binary, Offset Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP18,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
40 µs |
R-CDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
10 |
15 mA |
0.1 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
30 µs |
R-CDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
12 |
40 mA |
0.0244 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
35 µs |
R-CDIP-T28 |
0.145 in (3.68 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.41 in (35.815 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.