Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

ADC12D1600CCMPR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Military

Ball

376

HBGA

Square

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

2

Yes

800 mV

3200 MHz

1

CMOS

MIL-STD-883

12

1.29 A

0.1831 %

1.9 V

Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

PGA376(UNSPEC)

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-800 mV

Serial

-55 °C (-67 °F)

Track

Bottom

S-CBGA-B376

1

0.138 in (3.5 mm)

1.1 in (27.94 mm)

No

Peak-to-peak input voltage range: 0.8 V

1.1 in (27.94 mm)

5962-8850501RA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

38535Q/M;38534H;883B

10

15 mA

0.1 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

30 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

5962-8850502RA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

38535Q/M;38534H;883B

8

15 mA

0.2 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

30 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

AD9283-703RC

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1 V

100 MHz

1

CMOS

38535V;38534K;883S

8

1.3672 %

3 V

Binary

3 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Quad

10 ns

S-CQCC-N20

1

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

0.35 in (8.89 mm)

5962R8512702VXA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

MIL-PRF-38535

12

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

24 µs

R-CDIP-T28

0.226 in (5.75 mm)

0.6 in (15.24 mm)

Yes

AD7655SCP-EP-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

48

HVQCCN

Square

4

Yes

5.25 V

1 MHz

1

16

0.0092 %

5 V

Binary

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial, Parallel, Word

-55 °C (-67 °F)

Sample

Quad

875 ns

S-XQCC-N48

0.039 in (1 mm)

0.276 in (7 mm)

No

0.276 in (7 mm)

5962R8512701VXA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

Bipolar

MIL-PRF-38535

12

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

24 µs

R-CDIP-T28

0.226 in (5.75 mm)

0.6 in (15.24 mm)

Yes

AD7490SRUZ-EP-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

16

Yes

5 V

1 MHz

1

12

0.0244 %

5 V

Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Track

Dual

800 ns

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e4

30 s

260 °C (500 °F)

0.382 in (9.7 mm)

AD7655SCPZ-EP-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

48

HVQCCN

Square

4

Yes

5 V

1 MHz

1

16

0.0092 %

5 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Nickel Palladium Gold

Sample

Quad

875 µs

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

e4

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD7892SQ-1

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

500 kHz

1

CMOS

12

0.0244 %

5 V

2's Complement Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

1.68 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

RH-AD128K1

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

Flat

16

SOF

Rectangular

300k Rad(Si)

Plastic/Epoxy

8

Yes

3.6 V

1 MHz

1

CMOS

12

0.0269 %

3.3 V

Binary

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-2.7 V

Serial

-55 °C (-67 °F)

Track

Dual

R-PDSO-F16

0.107 in (2.72 mm)

0.272 in (6.905 mm)

0.391 in (9.94 mm)

RHF1201KSO-01V

STMicroelectronics

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Ceramic

1

Yes

2 V

50 MHz

1

CMOS

12

2.5 V

Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

-2 V

Parallel, Word

-55 °C (-67 °F)

Track

Dual

R-CDSO-G48

0.107 in (2.72 mm)

0.38 in (9.65 mm)

No

40 s

250 °C (482 °F)

0.613 in (15.57 mm)

RHF1201KSO1

STMicroelectronics

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Ceramic

1

Yes

2 V

50 MHz

1

CMOS

12

0.0415 %

2.5 V

Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

-2 V

Parallel, Word

-55 °C (-67 °F)

Track

Dual

R-CDSO-G48

0.107 in (2.72 mm)

0.38 in (9.65 mm)

No

40 s

250 °C (482 °F)

0.62 in (15.75 mm)

5962-9306001MXA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

10 MHz

1

BICMOS

MIL-STD-883

12

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9058ATJ/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

2

Yes

2 V

50 MHz

1

MIL-STD-883 Class B

8

0.49 %

5 V

Binary

±5 V

-5 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-J44

0.135 in (3.43 mm)

0.645 in (16.385 mm)

No

e0

0.645 in (16.385 mm)

ADADC85S12/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.0003 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Dual

10 µs

R-CDIP-T32

0.23 in (5.84 mm)

0.9 in (22.86 mm)

No

1.62 in (41.15 mm)

ADC12DJ3200ZMX/EM

Texas Instruments

Analog To Digital Converter, Proprietary Method

Military

196

CGA

Rectangular

300k Rad(Si)

2

Yes

800 mV

6400 MHz

1

12

Binary

Grid Array

125 °C (257 °F)

-800 mV

-55 °C (-67 °F)

Lateral

R-XLGA-X196

0.591 in (15 mm)

Peak-to-peak input voltage range: 0.8 V

0.591 in (15 mm)

TLV2556MPWREP

Texas Instruments

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

11

Yes

5.5 V

200 kHz

1

12

2.4 mA

0.0244 %

5 V

Binary, 2's Complement Binary

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Analog to Digital Converters

2.7 V

0.026 in (0.65 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Sample

Dual

6.46 µs

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0.256 in (6.5 mm)

TLV2556MPWREPG4

Texas Instruments

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

11

Yes

4.25 V

200 kHz

1

12

2.4 mA

0.0244 %

5 V

Binary, 2's Complement Binary

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Analog to Digital Converters

0.026 in (0.65 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Sample

Dual

6.46 µs

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0.256 in (6.5 mm)

5962R1422701VXC

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Flat

48

QFF

Square

100k Rad(Si)

Plastic/Epoxy

1

Yes

125 MHz

1

MIL-PRF-38535 Class V

14

0.0488 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

Flatpack

0.04 in (1.016 mm)

125 °C (257 °F)

Serial

-55 °C (-67 °F)

Sample

Quad

8 ns

S-PQFP-F48

0.105 in (2.66 mm)

0.563 in (14.305 mm)

Yes

0.563 in (14.305 mm)

AD10242TZ/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

3

Yes

2 V

40 MHz

2

Hybrid

MIL-STD-883 Class B

12

5 V

2's Complement Binary

±5 V

-5 V

Flatpack

QFP68,1.2SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-G68

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

AD364RTD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

60

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

16

No

10 V

25 kHz

1

12

0.012 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Sample

Dual

32 µs

R-CDIP-T60

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e4

AD7327TRU-EP-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

10 V

500 kHz

1

CMOS

12

0.0305 %

Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

0.026 in (0.65 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Track

Dual

1.6 µs

R-PDSO-G20

0.047 in (1.2 mm)

0.173 in (4.4 mm)

0.256 in (6.5 mm)

AD7327TRUZ-EP

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

10 V

500 kHz

1

CMOS

12

0.0305 %

Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

0.026 in (0.65 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Track

Dual

1.6 µs

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e4

30 s

260 °C (500 °F)

0.256 in (6.5 mm)

AD7949SCPZ-EP-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

HVQCCN

Square

8

Yes

2.9 V

250 kHz

1

CMOS

14

0.0061 %

5 V

Binary, 2's Complement Binary

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.16SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-250 mV

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

3.2 µs

S-XQCC-N20

3

0.039 in (1 mm)

0.157 in (4 mm)

No

e4

30 s

260 °C (500 °F)

0.157 in (4 mm)

AD872ASD/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

10 MHz

1

BICMOS

MIL-STD-883 Class B

12

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9266TCPZRL7-65EP

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

32

HVQCCN

Square

1

Yes

2 V

65 MHz

1

CMOS

16

0.00992 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-2 V

Serial, Parallel, Word

-55 °C (-67 °F)

Nickel Palladium Gold

Sample

Quad

333.3 ns

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

e4

30 s

260 °C (500 °F)

0.197 in (5 mm)

ADS1243SJD

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5.25 V

15 Hz

1

CMOS

24

0.0025 %

3 V

Binary

3/5 V

In-Line

DIP20,.3

Other Converters

2.7 V

0.1 in (2.54 mm)

210 °C (410 °F)

0 mV

Serial

-55 °C (-67 °F)

Gold

Sample

Dual

R-GDIP-T20

0.175 in (4.45 mm)

0.3 in (7.62 mm)

No

e4

1.01 in (25.65 mm)

THS1206MDAREP

Texas Instruments

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

32

TSSOP

Rectangular

Plastic/Epoxy

4

Yes

4 V

6 MHz

1

CMOS

12

40 mA

0.0439 %

5 V

Binary, 2's Complement Binary

3.3,5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP32,.3

Analog to Digital Converters

3 V

0.026 in (0.65 mm)

125 °C (257 °F)

1.4 V

Parallel, Word

-55 °C (-67 °F)

Nickel Palladium Gold

Sample

Dual

R-PDSO-G32

2

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e4

30 s

260 °C (500 °F)

0.433 in (11 mm)

TLC2543MDBREP

Texas Instruments

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

11

Yes

5.5 V

66 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline, Shrink Pitch

SSOP20,.3

Analog to Digital Converters

4.5 V

0.026 in (0.65 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Sample

Dual

10 µs

R-PDSO-G20

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e4

30 s

260 °C (500 °F)

0.283 in (7.2 mm)

5962-9581501HXA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

3

Yes

2 V

40 MHz

2

Hybrid

MIL-STD-883

12

5 V

2's Complement Binary

±5 V

-5 V

Flatpack

QFP68,1.2SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-G68

0.95 in (24.13 mm)

Yes

e0

0.95 in (24.13 mm)

AD1674TD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

16.5 V

111 kHz

1

BICMOS

12

18 mA

0.012 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-16.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

ADS6445MRGCTEP

Texas Instruments

Analog To Digital Converter, Proprietary Method

Military

No Lead

64

HVQCCN

Square

Plastic/Epoxy

4

Yes

2 V

125 MHz

1

CMOS

14

0.0305 %

3.3 V

Binary, Offset Binary, 2's Complement Binary

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-2 V

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Sample

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

Peak-to-peak input voltage range: 2 V

e4

30 s

260 °C (500 °F)

0.354 in (9 mm)

HTADC12DCB

Honeywell

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

14

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5.55 V

100 kHz

1

SOI-CMOS

12

0.06835 %

5 V

Binary

In-Line

DIP14,.3

0.1 in (2.54 mm)

225 °C (437 °F)

-300 mV

Serial, Parallel, Word

-55 °C (-67 °F)

Dual

11.5 µs

R-CDIP-T14

0.146 in (3.7084 mm)

0.3 in (7.62 mm)

0.7 in (17.78 mm)

ADADC85SZ-12/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.012 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD7893SQ-5

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

6 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7899SRZ-1

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

2

Yes

10 V

400 kHz

1

14

0.0122 %

5 V

2's Complement Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Matte Tin

Track

Dual

2.2 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

5962-85127013A

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

20 V

1

Bipolar

MIL-STD-883

12

40 mA

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

24 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

e0

0.45 in (11.43 mm)

5962-8512701XA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

Bipolar

MIL-STD-883

12

40 mA

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

24 µs

R-CDIP-T28

0.226 in (5.75 mm)

0.6 in (15.24 mm)

Yes

e0

5962-8512702XA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

Bipolar

MIL-STD-883

12

40 mA

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

24 µs

R-CDIP-T28

0.226 in (5.75 mm)

0.6 in (15.24 mm)

Yes

e0

5962-8680202VA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Bipolar

MIL-STD-883

10

15 mA

0.098 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

5962-8876401LX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

CMOS

MIL-STD-883

8

0.1953 %

5 V

Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

Yes

e0

5962-9559201MEA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

100 kHz

1

BICMOS

MIL-STD-883

16

0.0031 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

Yes

e0

5962-9684601QLA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

600 kHz

1

CMOS

MIL-PRF-38535 Class Q

12

0.024 %

5 V

2's Complement Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

1.68 µs

R-GDIP-T24

Yes

e0

5962-9756401QXA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

200 kHz

1

BICMOS

MIL-PRF-38535 Class Q

16

0.0038 %

5 V

2's Complement Binary

5 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

4 µs

R-CDIP-T28

Yes

e0

AD570SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

40 kHz

1

Bipolar

8

15 mA

0.2 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD573SD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

38535Q/M;38534H;883B

10

15 mA

0.1 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

30 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD574ASD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

12

40 mA

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

35 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.