Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
12 |
40 mA |
0.0244 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
35 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
12 |
40 mA |
0.0244 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
35 µs |
R-CDIP-T28 |
0.145 in (3.68 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.41 in (35.815 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
12 |
30 mA |
0.0122 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
35 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
2.5 V |
1 MHz |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary, Offset Binary |
5,GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2.5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
660 ns |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
5 V |
100 kHz |
1 |
CMOS |
MIL-STD-883 Class B |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.8 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
6 µs |
R-GDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 MHz |
1 |
16 |
0.0023 % |
2.5 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Dual |
710 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e4 |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
16 |
0.00992 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Quad |
333.3 ns |
S-XQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
125 MHz |
1 |
14 |
0.0159 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Sample |
Quad |
100 ns |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
1.25 V |
1 |
24 |
10 mA |
0.009 % |
2.5 V |
2's Complement Binary |
±2.5,3.3 V |
-2.5 V |
In-Line |
DIP28,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
210 °C (410 °F) |
-1.25 V |
Serial |
-55 °C (-67 °F) |
Dual |
R-CDIP-T28 |
0.175 in (4.45 mm) |
0.3 in (7.62 mm) |
No |
1.4 in (35.56 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
128 |
QFP |
Square |
300k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
2 |
Yes |
950 mV |
1000 MHz |
1 |
CMOS |
8 |
0.3516 % |
1.9 V |
Offset Binary |
1.9 V |
Flatpack |
QFP120,.87SQ,20 |
Analog to Digital Converters |
0.02 in (0.508 mm) |
125 °C (257 °F) |
-950 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Sample |
Quad |
1 ns |
S-CQFP-G128 |
0.134 in (3.4036 mm) |
0.77 in (19.558 mm) |
No |
0.77 in (19.558 mm) |
||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
11 |
No |
3.6 V |
38 kHz |
1 |
CMOS |
MIL-STD-883 |
10 |
0.0977 % |
3.3 V |
Binary |
3.3 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Dual |
21 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
0.953 in (24.195 mm) |
|||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
11 |
No |
5.5 V |
38 kHz |
1 |
CMOS |
10 |
0.0977 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Dual |
21 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
0.953 in (24.195 mm) |
||||||||||||||||
Texas Instruments |
Analog To Digital Converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
1 |
No |
1 |
CMOS |
13 |
Offset Binary |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
||||||||||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
1 |
CMOS |
13 |
Binary |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDIP-T28 |
|||||||||||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
5.5 V |
1 |
CMOS |
10 |
0.0977 % |
5 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Quad |
21 µs |
S-CQCC-N20 |
0.08 in (2.03 mm) |
0.35 in (8.89 mm) |
No |
0.35 in (8.89 mm) |
||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
11 |
No |
3.6 V |
38 kHz |
1 |
CMOS |
MIL-STD-883 |
10 |
0.0977 % |
3.3 V |
Binary |
3.3 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Dual |
21 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
0.953 in (24.195 mm) |
|||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
52 |
HLQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.2 V |
105 MHz |
1 |
Bipolar |
14 |
5 V |
2's Complement Binary |
3.3,5 V |
Flatpack, Heat Sink/Slug, Low Profile |
QFP52,.47SQ |
Analog to Digital Converters |
0.026 in (0.65 mm) |
125 °C (257 °F) |
0 mV |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Quad |
S-PQFP-G52 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
0.394 in (10 mm) |
|||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
11 |
No |
5.5 V |
38 kHz |
1 |
CMOS |
MIL-STD-883 |
10 |
0.0977 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Dual |
21 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
0.953 in (24.195 mm) |
|||||||||||||||
Texas Instruments |
Analog To Digital Converter Subsystem |
Military |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
2 V |
10 MHz |
1 |
Hybrid |
MIL-PRF-38534 Class H |
12 |
0.0977 % |
5 V |
Binary |
-5.2 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2 V |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
100 ns |
R-CDIP-T40 |
0.252 in (6.4 mm) |
0.6 in (15.24 mm) |
2.095 in (53.213 mm) |
|||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
3.3 V |
200 kHz |
1 |
CMOS |
MIL-PRF-38535 Class Q |
12 |
0.0244 % |
3.3 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Dual |
3.6 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
0.953 in (24.195 mm) |
||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.45 V |
1.25 MHz |
1 |
CMOS |
10 |
0.1318 % |
3.3 V |
Binary |
2.5/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Analog to Digital Converters |
0.037 in (0.95 mm) |
125 °C (257 °F) |
-200 mV |
Serial |
-55 °C (-67 °F) |
Matte Tin |
Sample |
Dual |
800 ns |
R-PDSO-G6 |
2 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
19 |
Yes |
6.8 V |
76 kHz |
1 |
CMOS |
8 |
2.5 mA |
0.195 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-300 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Quad |
9.009 µs |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
0.453 in (11.5062 mm) |
|||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
19 |
No |
6.8 V |
40 kHz |
1 |
CMOS |
8 |
2.5 mA |
0.195 % |
5 V |
Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-300 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Dual |
16.95 µs |
R-PDIP-T28 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
1.43 in (36.32 mm) |
|||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
19 |
No |
6.8 V |
76 kHz |
1 |
CMOS |
8 |
2.5 mA |
0.195 % |
5 V |
Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-300 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Dual |
9.009 µs |
R-PDIP-T28 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
1.43 in (36.32 mm) |
|||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
8 |
Yes |
5.5 V |
87 kHz |
1 |
CMOS |
10 |
0.0977 % |
2.7 V |
Binary |
3/5 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Quad |
25 µs |
S-CQCC-N20 |
0.08 in (2.03 mm) |
0.35 in (8.89 mm) |
No |
0.35 in (8.89 mm) |
||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
11 |
No |
5.5 V |
66 kHz |
1 |
CMOS |
MIL-PRF-38535 Class Q |
12 |
2.5 mA |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
10 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
0.953 in (24.195 mm) |
|||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
52 |
HLQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.2 V |
105 MHz |
1 |
Bipolar |
14 |
5 V |
2's Complement Binary |
3.3,5 V |
Flatpack, Heat Sink/Slug, Low Profile |
QFP52,.47SQ |
Analog to Digital Converters |
0.026 in (0.65 mm) |
125 °C (257 °F) |
0 mV |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Quad |
S-PQFP-G52 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
0.394 in (10 mm) |
|||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
11 |
Yes |
3.6 V |
38 kHz |
1 |
CMOS |
MIL-PRF-38535 Class Q |
10 |
0.0977 % |
3.3 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Quad |
21 µs |
S-CQCC-N20 |
0.08 in (2.03 mm) |
0.35 in (8.89 mm) |
No |
0.35 in (8.89 mm) |
||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
Ball |
376 |
BGA |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
2.15 V |
2000 MHz |
1 |
CMOS |
MIL-STD-883 |
10 |
0.1367 % |
1.9 V |
Offset Binary, 2's Complement Binary |
1.9 V |
Grid Array |
PGA376(UNSPEC) |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Bottom |
S-CBGA-B376 |
0.138 in (3.5 mm) |
1.1 in (27.94 mm) |
No |
1.1 in (27.94 mm) |
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|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.0305 % |
3.3 V |
Binary, Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2 V |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
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Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
11 |
No |
5.5 V |
38 kHz |
1 |
CMOS |
MIL-PRF-38535 Class Q |
10 |
0.0488 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Dual |
21 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
0.953 in (24.195 mm) |
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Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
11 |
Yes |
5.5 V |
38 kHz |
1 |
CMOS |
MIL-PRF-38535 Class Q |
10 |
0.0488 % |
5 V |
Binary |
5 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Quad |
21 µs |
S-CQCC-N20 |
0.08 in (2.03 mm) |
0.35 in (8.89 mm) |
No |
0.35 in (8.89 mm) |
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Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
6.8 V |
125 kHz |
1 |
CMOS |
8 |
2.5 mA |
0.195 % |
5 V |
Binary |
5 V |
Small Outline |
SOP8,.25 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-300 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Dual |
17 µs |
R-PDSO-G8 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
0.193 in (4.9 mm) |
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Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
6 V |
1 |
MIL-STD-883 |
8 |
0.1953 % |
4.75 V |
Binary |
Chip Carrier |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Quad |
17 µs |
S-CQCC-N20 |
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Texas Instruments |
Analog To Digital Converter, Flash Method |
Military |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10.2 V |
625 kHz |
1 |
CMOS |
8 |
13 mA |
0.195 % |
5 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-200 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Track |
Dual |
2.5 µs |
R-PDSO-G20 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.504 in (12.8 mm) |
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Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
8 |
Yes |
5.5 V |
85 kHz |
1 |
CMOS |
MIL-PRF-38535 Class Q |
10 |
1.5 mA |
0.0977 % |
5 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Quad |
25 µs |
S-CQCC-N20 |
0.08 in (2.03 mm) |
0.35 in (8.89 mm) |
Yes |
0.35 in (8.89 mm) |
|||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5.55 V |
1 |
CMOS |
MIL-STD-883 |
12 |
0.0244 % |
5 V |
2's Complement Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5.55 V |
Parallel, Word |
-55 °C (-67 °F) |
Sample |
Dual |
13.8 µs |
R-GDIP-T28 |
0.225 in (5.715 mm) |
0.6 in (15.24 mm) |
1.49 in (37.846 mm) |
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Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
8 |
No |
5.5 V |
87 kHz |
1 |
CMOS |
MIL-PRF-38535 Class Q |
10 |
1.5 mA |
0.0977 % |
2.7 V |
Binary |
3/5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
2.7 V |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Tin/Lead |
Sample |
Dual |
25 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
0.953 in (24.195 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
Flat |
84 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
2.2 V |
250 MHz |
1 |
MIL-PRF-38535 Class V |
13 |
410 mA |
0.0342 % |
5 V |
Offset Binary |
3.3,5 V |
Flatpack |
TPAK84,2.0SQ,25 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
125 °C (257 °F) |
-2.2 V |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Quad |
S-CQFP-F84 |
0.1 in (2.54 mm) |
0.65 in (16.51 mm) |
Yes |
Peak-to-peak input voltage range: 2.2 V |
0.65 in (16.51 mm) |
||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
11 |
Yes |
3.6 V |
38 kHz |
1 |
CMOS |
MIL-PRF-38535 Class Q |
10 |
0.0977 % |
3.3 V |
Binary |
3.3 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Quad |
21 µs |
S-CQCC-N20 |
0.08 in (2.03 mm) |
0.35 in (8.89 mm) |
No |
0.35 in (8.89 mm) |
|||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
3.6 V |
1 |
CMOS |
10 |
0.0977 % |
3.3 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Sample |
Quad |
21 µs |
S-CQCC-N20 |
0.08 in (2.03 mm) |
0.35 in (8.89 mm) |
No |
0.35 in (8.89 mm) |
||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
Flat |
84 |
GQFF |
Square |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
2.2 V |
500 MHz |
1 |
Bipolar |
38535V;38534K;883S |
12 |
345 mA |
0.0708 % |
5 V |
Offset Binary |
3.3,5 V |
Flatpack, Guard Ring |
TPAK84,2.0SQ,25 |
Analog to Digital Converters |
0.025 in (0.64 mm) |
125 °C (257 °F) |
0 mV |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Quad |
S-CQFP-F84 |
0.075 in (1.91 mm) |
0.65 in (16.51 mm) |
Yes |
Peak-to-peak input voltage range: 2.2 V |
0.65 in (16.51 mm) |
||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
Butt |
256 |
LGA |
Square |
300k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
2 |
Yes |
800 mV |
1600 MHz |
1 |
CMOS |
12 |
6 mA |
0.1831 % |
1.9 V |
Offset Binary |
Grid Array |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-55 °C (-67 °F) |
Track |
Bottom |
S-CBGA-B256 |
1 |
0.163 in (4.13 mm) |
1.1 in (27.94 mm) |
Peak-to-peak input voltage range: 0.8 V |
1.1 in (27.94 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
Flat |
84 |
GQFF |
Square |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
2.2 V |
500 MHz |
1 |
Bipolar |
MIL-PRF-38535 Class V |
12 |
0.0854 % |
5 V |
Offset Binary |
Flatpack, Guard Ring |
0.025 in (0.64 mm) |
125 °C (257 °F) |
-2.2 V |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Quad |
S-CQFP-F84 |
0.1 in (2.54 mm) |
0.65 in (16.51 mm) |
Yes |
Peak-to-peak input voltage range: 2.2 V |
0.65 in (16.51 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.0305 % |
3.3 V |
Binary, Offset Binary, 2's Complement Binary |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2 V |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||
Texas Instruments |
Analog To Digital Converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
1 |
CMOS |
8 |
5 V |
Offset Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDIP-T28 |
|||||||||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
1 |
CMOS |
13 |
Binary |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-PDIP-T28 |
No |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.