Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7578TQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

15 V

Offset Binary

±5,15 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

100 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

AD9005ATM

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

46

DIP

Rectangular

Metal

1

No

3 V

10 MHz

1

Bipolar

12

55 mA

0.03 %

15 V

Offset Binary

5,-5.2,±15 V

-15 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

100 ns

R-MDIP-T46

0.231 in (5.86 mm)

1.3 in (33.02 mm)

No

e0

5962-01-085-7614

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T32

No

AD7896SQZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.5 V

100 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Track

Dual

8.5 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9463701MXX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Gull Wing

68

QFP

Square

1

Yes

1.75 V

60 MHz

1

MIL-STD-883

10

0.293 %

5 V

Offset Binary, 2's Complement Binary

-5 V

Flatpack

0.05 in (1.27 mm)

125 °C (257 °F)

-1.75 V

Parallel, Word

-55 °C (-67 °F)

Gold

Quad

S-XQFP-G68

0.95 in (24.13 mm)

No

e4

0.95 in (24.13 mm)

AD7672TQ05/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

38535Q/M;38534H;883B

12

12 mA

0.0244 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8965503LA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD572SD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.012 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Dual

25 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e4

5962-85127023C

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1

12

0.0122 %

15 V

Binary, Offset Binary

-15 V

Chip Carrier

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Gold

Quad

24 µs

S-CQCC-N28

No

e4

5962-8759104LB

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

BICMOS

12

12 mA

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-87762012X

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

2.46 V

1

BICMOS

38535Q/M;38534H;883B

8

7 mA

0.4 %

5 V

Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

15 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

AD16710703F

Analog Devices

Analog To Digital Converter, Flash Method

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1.25 MHz

1

12

0.07324 %

5 V

Binary

-5 V

Flatpack

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

800 ns

R-CDFP-F28

AD7478SRT-R2

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3 V

1 MHz

1

CMOS

8

0.1953 %

3 V

Binary

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

800 ns

R-PDSO-G6

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e0

0.114 in (2.9 mm)

AD670SE/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

5 V

1

Bipolar

38535Q/M;38534H;883B

8

45 mA

0.4 %

5 V

Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

3.4 V

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

10 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

0.35 in (8.89 mm)

AD574ASE/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

16.5 V

1

Bipolar

38535Q/M;38534H;883B

12

40 mA

0.0244 %

15 V

Binary

5,±12/±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-16.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

35 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD7824TQ

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

100 kHz

1

CMOS

MIL-STD-883 Class B

8

0.3906 %

5 V

Binary, Complementary Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.8 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

5962-9470301MYX

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1 V

50 MHz

2

MIL-STD-883

8

5 V

Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

S-CQCC-J44

0.135 in (3.43 mm)

0.65 in (16.51 mm)

Yes

0.65 in (16.51 mm)

5962-87762022X

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

2.46 V

1

BICMOS

38535Q/M;38534H;883B

8

7 mA

0.2 %

5 V

Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

15 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

AD1385TD/883

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

48

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

500 kHz

1

16

200 mA

15 V

Complementary 2's Complement, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T48

0.233 in (5.92 mm)

1 in (25.4 mm)

No

e0

2.475 in (62.865 mm)

5962-85127023A

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

20 V

1

Bipolar

MIL-STD-883

12

40 mA

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

24 µs

S-CQCC-N28

1

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

e0

0.45 in (11.43 mm)

ADC7672UE05

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Quad

5.2 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

AD7868TQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

83 kHz

1

CMOS

12

25 mA

0.0244 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-3 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7892SR

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

140 kHz

1

CMOS

12

10 mA

0.024 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Track

Dual

5.5 µs

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.606 in (15.4 mm)

5962-8990001EA

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2 V

1

Bipolar

6

1.5625 %

5 V

Binary

-5.2 V

In-Line

125 °C (257 °F)

-2 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13.3 ns

R-CDIP-T16

No

e0

5962-8512702XX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

Bipolar

12

0.0244 %

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

35 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

AD7876TQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, 8 Bits, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7672TCHIPS

Analog Devices

Analog To Digital Converter

Military

1

10 V

1

BICMOS

12

0.024 %

Binary, Offset Binary

5,-12 V

DIE OR CHIP

Analog to Digital Converters

125 °C (257 °F)

-55 °C (-67 °F)

No

AD9020TZ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

60 MHz

1

Bipolar

38535Q/M;38534H;883B

10

542 mA

0.1953 %

5 V

Binary

±5 V

-5 V

Flatpack

QFP68,1.1SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-G68

0.118 in (2.997 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

5962-9158101MYX

Analog Devices

Analog To Digital Converter

Military

Gull Wing

68

QFP

Square

Ceramic

1

Yes

1.75 V

1

Bipolar

38535Q/M;38534H;883B

10

0.24 %

Binary

5,-5.2 V

Flatpack

QFP68,1.1SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQFP-G68

No

AD871SE/883

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1 V

5 MHz

1

BICMOS

12

5 V

Offset Binary, 2's Complement Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

S-CQCC-N44

0.1 in (2.54 mm)

0.651 in (16.545 mm)

No

e0

0.651 in (16.545 mm)

5962-01-159-5935

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

1

No

5962-9092701M3A

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

35 MHz

1

Bipolar

MIL-STD-883

8

110 mA

0.1953 %

5 V

Binary

5,-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

ADC908BRCMDC

Analog Devices

Analog To Digital Converter

Military

No Lead

20

QCCN

Square

Ceramic

1

Yes

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.29 %

5 V

Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

AD7721SQ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1.25 V

468 kHz

1

CMOS

16

28.5 mA

0.1953 %

5 V

Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7575TE

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

15 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

5962-87591043A

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

MIL-STD-883

12

12 mA

0.0244 %

5 V

Binary

5,-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

5 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

30 s

220 °C (428 °F)

0.45 in (11.43 mm)

AD574ASE

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

10 V

1

Bipolar

12

40 mA

0.0244 %

15 V

Binary

5,±12/±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

35 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD7980SRMZ-EP-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

10

TSSOP

Square

1

Yes

5.1 V

1 MHz

1

16

0.0023 %

2.5 V

Binary

2.5,2.5/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

720 ns

S-XDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0.118 in (3 mm)

5962-9756401QXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

200 kHz

1

BICMOS

16

0.0038 %

5 V

2's Complement Binary

In-Line

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Dual

4 µs

R-CDIP-T28

Yes

5962-9961001HXA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

2.048 V

105 MHz

2

Hybrid

MIL-PRF-38534 Class H

12

0.0732 %

5 V

2's Complement Binary

3.3,5 V

Flatpack

QFP68,1.2SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Track

Quad

S-CQFP-G68

0.29 in (7.37 mm)

0.95 in (24.13 mm)

No

30 s

220 °C (428 °F)

0.95 in (24.13 mm)

AD9002SE/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

150 MHz

1

Bipolar

MIL-STD-883 Class B

8

0.4688 %

Binary

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

8 ns

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

5962-89518012B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1

CMOS

8

25 mA

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

975 ns

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

AD670SE

Analog Devices

Analog To Digital Converter

Military

No Lead

20

QCCN

Square

Ceramic

1

Yes

2.55 V

1

Bipolar

8

0.4 %

5 V

Offset Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

5962-8759104LX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

BICMOS

12

12 mA

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

5962-8965502LC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD872SD/883

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

10 MHz

1

CMOS

12

5 V

Offset Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9048SE/833B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

100 mV

38 MHz

1

Bipolar

MIL-STD-883 Class B

8

0.3906 %

5 V

Binary, Offset 2's Complement

5,-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2.1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Sample

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

5962-8759101LC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

BICMOS

12

12 mA

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.