Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

5962-01-159-5935

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

1

No

5962-9092701M3A

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

35 MHz

1

Bipolar

MIL-STD-883

8

110 mA

0.1953 %

5 V

Binary

5,-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

ADC908BRCMDC

Analog Devices

Analog To Digital Converter

Military

No Lead

20

QCCN

Square

Ceramic

1

Yes

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.29 %

5 V

Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

AD7721SQ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1.25 V

468 kHz

1

CMOS

16

28.5 mA

0.1953 %

5 V

Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7575TE

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

15 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

5962-87591043A

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

MIL-STD-883

12

12 mA

0.0244 %

5 V

Binary

5,-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

5 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

30 s

220 °C (428 °F)

0.45 in (11.43 mm)

AD574ASE

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

10 V

1

Bipolar

12

40 mA

0.0244 %

15 V

Binary

5,±12/±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

35 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD7980SRMZ-EP-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

10

TSSOP

Square

1

Yes

5.1 V

1 MHz

1

16

0.0023 %

2.5 V

Binary

2.5,2.5/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

720 ns

S-XDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e4

260 °C (500 °F)

0.118 in (3 mm)

5962-9756401QXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

200 kHz

1

BICMOS

16

0.0038 %

5 V

2's Complement Binary

In-Line

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Dual

4 µs

R-CDIP-T28

Yes

5962-9961001HXA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

2.048 V

105 MHz

2

Hybrid

MIL-PRF-38534 Class H

12

0.0732 %

5 V

2's Complement Binary

3.3,5 V

Flatpack

QFP68,1.2SQ,50

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Track

Quad

S-CQFP-G68

0.29 in (7.37 mm)

0.95 in (24.13 mm)

No

30 s

220 °C (428 °F)

0.95 in (24.13 mm)

AD9002SE/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

0 mV

150 MHz

1

Bipolar

MIL-STD-883 Class B

8

0.4688 %

Binary

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

8 ns

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

5962-89518012B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1

CMOS

8

25 mA

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

975 ns

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

AD670SE

Analog Devices

Analog To Digital Converter

Military

No Lead

20

QCCN

Square

Ceramic

1

Yes

2.55 V

1

Bipolar

8

0.4 %

5 V

Offset Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

5962-8759104LX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

BICMOS

12

12 mA

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

5962-8965502LC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD872SD/883

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

10 MHz

1

CMOS

12

5 V

Offset Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9048SE/833B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

100 mV

38 MHz

1

Bipolar

MIL-STD-883 Class B

8

0.3906 %

5 V

Binary, Offset 2's Complement

5,-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2.1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Sample

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

5962-8759101LC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

BICMOS

12

12 mA

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9684601QJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

CMOS

MIL-PRF-38535 Class Q

12

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-89616042A

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

10 V

1

CMOS

MIL-STD-883

8

0.293 %

5 V

Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

15 µs

S-CQCC-N20

No

AD364TD/883B

Analog Devices

Digital To Analog Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

16

No

10 V

38535Q/M;38534H;883B

12

0.012 %

Binary, Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T32

No

AD678TD/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

38535Q/M;38534H;883B

12

34 mA

0.0488 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

4.4 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

ADC922BTC/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

10 V

1

Bipolar

12

45 mA

0.0244 %

15 V

Binary

-15 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

5962-9561501MLX

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

1

CMOS

MIL-STD-883

12

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Serial

-55 °C (-67 °F)

Track

Dual

5.9 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

AD571SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

40 kHz

1

Bipolar

10

15 mA

0.098 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

AD7477SRT

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

3 V

1 MHz

1

CMOS

10

0.0977 %

3 V

Binary

2.5/5 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

Analog to Digital Converters

0.037 in (0.95 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

800 ns

R-PDSO-G6

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e0

0.114 in (2.9 mm)

AD9058TJ/883

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1 V

50 MHz

2

MIL-STD-883

8

5 V

Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-J44

0.135 in (3.43 mm)

0.65 in (16.51 mm)

No

e0

0.65 in (16.51 mm)

5962-01-174-7679

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

38535Q/M;38534H;883B

10

0.098 %

Offset Binary

5,-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

MP7684ASD/883

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

4.1 V

20 MHz

1

CMOS

38535Q/M;38534H;883B

8

0.7812 %

5 V

Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

1.44 in (36.58 mm)

AD678TD

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

200 kHz

1

BIMOS

12

0.0244 %

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

4.4 µs

R-CDIP-T28

0.165 in (4.191 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD7576JP/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

J Bend

20

QCCJ

Square

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

30 µs

S-PQCC-J20

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

0.353 in (8.9662 mm)

AD7893SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

BIMOS

12

10 mA

0.024 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

5.5 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7712SQ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

CMOS

24

0.003 %

5 V

Binary, Offset Binary

5/10 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8512701XX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

Bipolar

12

0.0244 %

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

35 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

AD7575SE/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

2.46 V

1

CMOS

MIL-STD-883 Class B

8

0.3906 %

5 V

Offset Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

15 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

AD7575TQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-STD-883 Class B

8

0.1953 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

5962-8876401LC

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

BICMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Track

Dual

2 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

5962-89616042X

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

Chip Carrier

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

15 µs

S-CQCC-N20

No

AD7890SQ-2

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.5 V

117 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

5.9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD9060TE

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

68

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

75 MHz

1

10

5 V

Offset Binary, 2's Complement Binary

-5.2 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-1.75 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N68

0.118 in (2.997 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

AD7890SR

Analog Devices

Analog To Digital Converter Subsystem

Military

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

12

10 mA

0.024 %

5 V

2's Complement Binary

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-PDSO-G24

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

AD9060SE/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

68

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1.75 V

75 MHz

1

Bipolar

38535Q/M;38534H;883B

10

500 mA

0.2441 %

5 V

Binary

5,-5.2 V

-5 V

Chip Carrier

LCC68,.95SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N68

0.103 in (2.62 mm)

0.953 in (24.195 mm)

No

e0

0.953 in (24.195 mm)

AD9028SZ/883

Analog Devices

Analog To Digital Converter, Flash Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

500 mV

325 MHz

1

Bipolar

8

475 mA

0.39 %

Offset Binary, 2's Complement Binary

-5.2 V

Flatpack

0.05 in (1.27 mm)

125 °C (257 °F)

-6 V

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

3.3 ns

S-CQFP-G68

0.118 in (2.997 mm)

0.95 in (24.13 mm)

No

0.95 in (24.13 mm)

AD573SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

50 kHz

1

Bipolar

10

0.0977 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

30 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1 in (25.4 mm)

5962-8969802LC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

2.5 V

1

CMOS

10

10 mA

0.0977 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Gold

Dual

18.5 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

AD670-703D

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

1

8

5 V

Offset Binary, 2's Complement Binary

In-Line

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

13 µs

R-CDIP-T20

AD7878SE/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

3 V

8.3 kHz

1

CMOS

38535Q/M;38534H;883B

12

5 V

Binary

±5 V

-5 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-3 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

7.125 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

5962-9066601HXX

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

46

DIP

Rectangular

0

No

1.024 V

10 MHz

1

Hybrid

MIL-PRF-38534 Class H

12

0.0549 %

5 V

Offset Binary

±5 V

-5 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.024 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T46

0.231 in (5.87 mm)

1.45 in (36.83 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.