Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

5962-8967901XC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

62.5 kHz

1

CMOS

12

0.0122 %

5 V

Binary, Offset Binary

-5 V

Chip Carrier

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Quad

12.25 µs

S-CQCC-N44

No

e4

5962-8967601QA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

16.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX144BMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5.3 V

108 kHz

1

CMOS

12

0.0244 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-CDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9169102Q3X

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

100 kHz

1

MIL-PRF-38535 Class Q

12

0.0488 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Quad

8.12 µs

S-CQCC-N28

No

e0

5962-9169202Q3X

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0031 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Quad

40.63 µs

S-CQCC-N28

No

e0

5962-8967401XC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

4.52 V

55.6 kHz

1

CMOS

14

0.0092 %

5 V

Binary, Offset Binary

-5 V

Chip Carrier

125 °C (257 °F)

-4.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Quad

14.25 µs

S-CQCC-N44

No

e4

MAX149BMAP/PR+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

133 kHz

1

MIL-STD-883 Class B

10

0.0977 %

3 V

Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Sample

Dual

65 µs

R-PDSO-G20

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

0.283 in (7.2 mm)

MAX157BMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

5.3 V

10.8 kHz

1

CMOS

10

0.0977 %

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9169201Q3C

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0046 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Quad

40.63 µs

S-CQCC-N28

No

e4

MAX174CMJ

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

BICMOS

12

0.0244 %

15 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

8 µs

R-GDIP-T28

0.232 in (5.89 mm)

0.6 in (15.24 mm)

5962-8967402QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

56 kHz

1

CMOS

MIL-STD-883

14

0.0031 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

14.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX176BMLP/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

250 kHz

1

CMOS

MIL-STD-883 Class B

12

5 V

Binary

5,-12/-15 V

-15 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-5 V

Serial

-55 °C (-67 °F)

Gold Over Nickel

Track

Quad

S-CQCC-N20

1

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e4

0.35 in (8.89 mm)

MAX1241BMJA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5.3 V

73 kHz

1

BICMOS

12

0.0244 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

7.5 µs

R-CDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

30 s

260 °C (500 °F)

MX574ATQ/883

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

BICMOS

38535Q/M;38534H;883B

12

0.018 %

Binary, Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

5962-8967602QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

16.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MX7672UE05+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

HQCCN

Square

2

Yes

125 kHz

1

BICMOS

12

0.0183 %

5 V

Binary

-12 V

Chip Carrier, Heat Sink/Slug

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Quad

5 µs

S-XQCC-N28

0.1 in (2.54 mm)

0.451 in (11.455 mm)

0.451 in (11.455 mm)

MAX188CMLP/883B

Analog Devices

Military

No Lead

20

QCCN

Square

Plastic/Epoxy

8

Yes

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-PQCC-N20

No

5962-9169202QXC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0031 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Dual

40.63 µs

R-GDIP-T28

No

e4

5962-9169102QXC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

100 kHz

1

MIL-PRF-38535 Class Q

12

0.0488 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Dual

8.12 µs

R-GDIP-T28

No

e4

MAX122AMRG/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

500 kHz

1

BICMOS

12

0.018 %

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.6 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9169101QXC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

100 kHz

1

MIL-PRF-38535 Class Q

12

0.0732 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Dual

8.12 µs

R-GDIP-T28

No

e4

MAX176AMLP/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

250 kHz

1

CMOS

MIL-STD-883 Class B

12

5 V

Binary

5,-12/-15 V

-15 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-5 V

Serial

-55 °C (-67 °F)

Track

Quad

S-CQCC-N20

1

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

0.35 in (8.89 mm)

MAX149BMAP/PR3+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

133 kHz

1

MIL-STD-883 Class B

10

0.0977 %

3 V

Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Matte Tin - annealed

Sample

Dual

65 µs

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0.283 in (7.2 mm)

MAX188AMJP/883B

Analog Devices

Military

Through-Hole

20

DIP

Rectangular

Ceramic

8

No

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

1

No

e0

20 s

240 °C (464 °F)

MAX188AMLP/883B

Analog Devices

Military

No Lead

20

QCCN

Square

Plastic/Epoxy

8

Yes

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-PQCC-N20

No

5962-9169101Q3C

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

100 kHz

1

MIL-PRF-38535 Class Q

12

0.0732 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Quad

8.12 µs

S-CQCC-N28

No

e4

MAX186_MJP

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

20

DIP

Rectangular

Ceramic

1

No

4.116 V

133 kHz

1

MIL-STD-883

12

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.116 V

Serial

-55 °C (-67 °F)

Track

Dual

10 µs

R-CDIP-T20

MAX145BMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5.3 V

108 kHz

1

CMOS

12

0.0244 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-CDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8967601QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

16.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX170CMJA/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0183 %

5 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Dual

5.6 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7824TQ/883

Analog Devices

Military

Through-Hole

24

DIP

Rectangular

Ceramic

4

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

MX7824UQ/883

Analog Devices

Military

Through-Hole

24

DIP

Rectangular

Ceramic

4

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

MAX160MJN/883

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

MAX186CMJP/883B

Analog Devices

Military

Through-Hole

20

DIP

Rectangular

Ceramic

8

No

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

1

No

e0

20 s

240 °C (464 °F)

5962-8967901XX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

63 kHz

1

CMOS

MIL-STD-883

12

0.0122 %

5 V

Binary, Offset Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

12.25 µs

S-CQCC-J44

0.135 in (3.43 mm)

0.65 in (16.51 mm)

No

e0

0.65 in (16.51 mm)

5962-8967401QC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

4.52 V

55.6 kHz

1

CMOS

14

0.0092 %

5 V

Binary, Offset Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Dual

14.25 µs

R-GDIP-T40

No

e4

MAX145AMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5.3 V

108 kHz

1

CMOS

12

0.0122 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-CDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1241AMJA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5.3 V

73 kHz

1

BICMOS

12

0.0122 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

7.5 µs

R-CDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

30 s

260 °C (500 °F)

5962-9169202Q3C

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0031 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Quad

40.63 µs

S-CQCC-N28

No

e4

MX7574TQ/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

MX7572TQ05/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

5.2 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

MAX157AMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

5.3 V

10.8 kHz

1

CMOS

10

0.0488 %

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX188DMJP/883B

Analog Devices

Military

Through-Hole

20

DIP

Rectangular

Ceramic

8

No

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

1

No

e0

20 s

240 °C (464 °F)

MX7672UE10+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

HQCCN

Square

2

Yes

64.5 kHz

1

BICMOS

12

0.0183 %

5 V

Binary

-12 V

Chip Carrier, Heat Sink/Slug

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Quad

10 µs

S-XQCC-N28

0.1 in (2.54 mm)

0.451 in (11.455 mm)

0.451 in (11.455 mm)

MX7828TQ/883

Analog Devices

Military

Through-Hole

28

DIP

Rectangular

Ceramic

8

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

MAX186CMLP/883B

Analog Devices

Military

No Lead

20

QCCN

Square

Plastic/Epoxy

8

Yes

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-PQCC-N20

No

5962-8967402XC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

4.52 V

55.6 kHz

1

CMOS

14

0.0031 %

5 V

Binary, Offset Binary

-5 V

Chip Carrier

125 °C (257 °F)

-4.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Quad

14.25 µs

S-CQCC-N44

No

e4

5962-8512702XC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

MIL-PRF-38535

12

0.0122 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

24 µs

R-CDIP-T28

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.