Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX187BMJA/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

4.15 V

75 kHz

1

MIL-STD-883 Class B

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

8.5 µs

R-CDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

5962-9169201QXC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0046 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Gold

Sample

Dual

40.63 µs

R-GDIP-T28

No

e4

MAX144AMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5.3 V

108 kHz

1

CMOS

12

0.0122 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-CDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX188_MJP

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

20

DIP

Rectangular

Ceramic

1

No

4.116 V

133 kHz

1

MIL-STD-883

12

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.116 V

Serial

-55 °C (-67 °F)

Track

Dual

10 µs

R-CDIP-T20

MAX154BMRG/883

Analog Devices

Military

Through-Hole

24

DIP

Rectangular

Ceramic

4

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

MAX160MLP/883B

Analog Devices

Analog To Digital Converter

Military

No Lead

20

QCCN

Square

Ceramic

1

Yes

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

MX7672TE05+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

HQCCN

Square

2

Yes

125 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

-12 V

Chip Carrier, Heat Sink/Slug

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Quad

5 µs

S-XQCC-N28

0.1 in (2.54 mm)

0.451 in (11.455 mm)

0.451 in (11.455 mm)

MAX158BMJI/883

Analog Devices

Military

Through-Hole

28

DIP

Rectangular

Ceramic

8

No

5 V

CMOS

38535Q/M;38534H;883B

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

5962-8967601XX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

16.25 µs

S-CQCC-J44

0.135 in (3.43 mm)

0.65 in (16.51 mm)

No

e0

0.65 in (16.51 mm)

MAX1240BMJA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

3.65 V

73 kHz

1

BICMOS

12

0.0244 %

3 V

Binary

3/3.3 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

7.5 µs

R-CDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

30 s

260 °C (500 °F)

MAX161BMJI

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

8

5 mA

0.293 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MAX162AMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.012 %

5 V

Offset Binary, Complementary Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

3.25 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX159AMJA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

5.3 V

10.8 kHz

1

CMOS

10

0.0488 %

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7574SQ/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

5962-8967602XX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

50 kHz

1

CMOS

MIL-STD-883

16

0.0015 %

5 V

Binary, Offset Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Quad

16.25 µs

S-CQCC-J44

0.135 in (3.43 mm)

0.65 in (16.51 mm)

No

e0

0.65 in (16.51 mm)

MAX158BMDI

Analog Devices

Military

Through-Hole

28

DIP

Rectangular

Ceramic

8

No

5 V

CMOS

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

e0

5962-9169202QXX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

20 kHz

1

CMOS

MIL-PRF-38535 Class Q

16

0.0031 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

40.63 µs

R-GDIP-T28

No

e0

MAX1240AMJA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

3.65 V

73 kHz

1

BICMOS

12

0.0122 %

3 V

Binary

3/3.3 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Track

Dual

7.5 µs

R-CDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

30 s

260 °C (500 °F)

5962-8967901QX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

63 kHz

1

CMOS

MIL-STD-883

12

0.0122 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

12.25 µs

R-GDIP-T40

0.23 in (5.84 mm)

0.6 in (15.24 mm)

No

e0

2.06 in (52.32 mm)

MAX186AMJP/883B

Analog Devices

Military

Through-Hole

20

DIP

Rectangular

Ceramic

8

No

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

1

No

e0

20 s

240 °C (464 °F)

MAX188DMLP/883B

Analog Devices

Military

No Lead

20

QCCN

Square

Plastic/Epoxy

8

Yes

5 V

38535Q/M;38534H;883B

12

0.024 %

Binary, 2's Complement Binary

5/±5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-PQCC-N20

No

MAX184BMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

5.2 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.25 in (31.75 mm)

MAX184AMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.018 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

5.2 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.25 in (31.75 mm)

MAX185AMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.018 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10.4 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.25 in (31.75 mm)

MAX185BMRG

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10.4 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

5962-8982801EX

Onsemi

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

100 mV

25 MHz

1

MIL-STD-883

4

5 V

Binary, Offset 2's Complement

-5.2 V

In-Line

125 °C (257 °F)

-2.1 V

Parallel, 4 Bits

-55 °C (-67 °F)

Dual

40 ns

R-GDIP-T16

No

5962-8982801EA

Onsemi

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

100 mV

25 MHz

1

MIL-STD-883

4

5 V

Binary, Offset 2's Complement

-5.2 V

In-Line

125 °C (257 °F)

-2.1 V

Parallel, 4 Bits

-55 °C (-67 °F)

Dual

40 ns

R-GDIP-T16

No

RHF1401KSO2

STMicroelectronics

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Plastic/Epoxy

1

Yes

2 V

20 MHz

1

CMOS

14

2.5 V

Binary, 2's Complement Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

R-PDSO-G48

0.107 in (2.72 mm)

0.38 in (9.65 mm)

No

0.62 in (15.75 mm)

5962F0521701VXX

STMicroelectronics

Analog To Digital Converter Subsystem

Military

Gull Wing

48

SSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

650 mV

50 MHz

1

MIL-PRF-38535 Class V

12

0.0488 %

2.5 V

Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

125 °C (257 °F)

400 mV

Parallel, Word

-55 °C (-67 °F)

Dual

R-CDSO-G48

0.114 in (2.9 mm)

0.38 in (9.65 mm)

Yes

0.62 in (15.745 mm)

RH-AD128KX

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

Flat

16

SOF

Rectangular

300k Rad(Si)

Plastic/Epoxy

8

Yes

3.6 V

1 MHz

1

CMOS

12

0.022 %

3.3 V

Binary

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-2.7 V

Serial

-55 °C (-67 °F)

Track

Dual

R-PDSO-F16

0.107 in (2.72 mm)

0.272 in (6.905 mm)

0.391 in (9.94 mm)

RHF1401KSO1

STMicroelectronics

Analog To Digital Converter, Pipelined

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

2 V

20 MHz

1

CMOS

MIL-PRF-38535 Class V

14

0.018311 %

2.5 V

Binary, 2's Complement Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

R-CDSO-G48

0.107 in (2.72 mm)

0.38 in (9.65 mm)

No

0.62 in (15.75 mm)

5962F0626001VXC

STMicroelectronics

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

500 mV

20 MHz

1

MIL-PRF-38535 Class V

14

50 mA

0.0122 %

2.5 V

Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

400 mV

Parallel, Word

-55 °C (-67 °F)

Dual

50 ns

R-CDSO-G48

0.114 in (2.9 mm)

0.38 in (9.65 mm)

Yes

0.62 in (15.745 mm)

5962F1820401VXC

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

Flat

16

DFP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

8

Yes

3.6 V

1 MHz

2

CMOS

MIL-PRF-38535 Class V

12

0.0269 %

3.3 V

Binary

Flatpack

125 °C (257 °F)

-3.6 V

Serial

-55 °C (-67 °F)

Track

Dual

R-CDFP-F16

Yes

5962F1820401VXA

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

Flat

16

DFP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

8

Yes

3.6 V

1 MHz

2

CMOS

MIL-PRF-38535 Class V

12

0.0269 %

3.3 V

Binary

Flatpack

125 °C (257 °F)

-3.6 V

Serial

-55 °C (-67 °F)

Dual

R-CDFP-F16

Yes

5962F1820401V9A

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

No Lead

21

DIE

Rectangular

300k Rad(Si)

8

Yes

3.6 V

1 MHz

2

CMOS

MIL-PRF-38535 Class V

12

0.0269 %

3.3 V

Binary

Uncased Chip

125 °C (257 °F)

-3.6 V

Serial

-55 °C (-67 °F)

Track

Upper

R-XUUC-N21

Yes

5962F0521701VXC

STMicroelectronics

Analog To Digital Converter Subsystem

Military

Gull Wing

48

SSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

650 mV

50 MHz

1

CMOS

MIL-PRF-38535 Class V

12

0.0488 %

2.5 V

Binary

2.5 V

Small Outline, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

400 mV

Parallel, Word

-55 °C (-67 °F)

Dual

R-CDSO-G48

0.114 in (2.9 mm)

0.38 in (9.65 mm)

Yes

0.62 in (15.745 mm)

RHFAD1285K01V

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

Flat

16

SOF

Rectangular

300k Rad(Si)

Plastic/Epoxy

8

Yes

3.6 V

1 MHz

1

CMOS

12

0.022 %

3.3 V

Binary

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-2.7 V

Serial

-55 °C (-67 °F)

Track

Dual

R-PDSO-F16

0.107 in (2.72 mm)

0.272 in (6.905 mm)

0.391 in (9.94 mm)

RHF1401KSO-01V

STMicroelectronics

Analog To Digital Converter, Pipelined

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

2 V

20 MHz

1

CMOS

14

0.018311 %

2.5 V

Binary, 2's Complement Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

R-CDSO-G48

0.107 in (2.72 mm)

0.38 in (9.65 mm)

No

0.62 in (15.75 mm)

RHF1201KSO2

STMicroelectronics

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Plastic/Epoxy

1

Yes

2 V

50 MHz

1

CMOS

12

2.5 V

Binary, 2's Complement Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

R-PDSO-G48

0.107 in (2.72 mm)

0.38 in (9.652 mm)

No

40 s

250 °C (482 °F)

0.613 in (15.57 mm)

TDE8715D-T

NXP Semiconductors

Analog To Digital Converter, Resistance Ladder

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

6.25 MHz

1

Bipolar

8

0.293 %

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

ADC0820CSEF

NXP Semiconductors

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

WDIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

15 mA

0.39 %

5 V

Offset Binary

In-Line, Window

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.957 in (24.305 mm)

ADC0820BSEF

NXP Semiconductors

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

WDIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

15 mA

0.195 %

5 V

Offset Binary

In-Line, Window

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.957 in (24.305 mm)

TDE8715D

NXP Semiconductors

Analog To Digital Converter, Resistance Ladder

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

6.25 MHz

1

Bipolar

8

0.293 %

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

MAX183BMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

5.2 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MX7574TQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

0.2 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX674ASD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

0.0244 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

15 µs

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

MAX148AMJP+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

1.25 V

133 kHz

1

10

0.0488 %

3 V

Binary, 2's Complement Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Track

Dual

65 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

ADC0820BJ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

4.9 V

1

CMOS

8

15 mA

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.