Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7820UQ

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

7.3 V

1

CMOS

8

20 mA

0.195 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-300 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

1.36 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9756301HXC

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

512 mV

100 MHz

1

Bipolar

MIL-STD-883

10

0.2197 %

2's Complement Binary

5/-5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-512 mV

Parallel, Word

-55 °C (-67 °F)

Gold

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e4

1.4 in (35.56 mm)

5962-8759102LA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

BICMOS

12

12 mA

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7576JN/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

30 µs

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.885 in (22.48 mm)

AD579TD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

10

0.0732 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

2 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

1.612 in (40.945 mm)

AD5240ZSD

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

1

No

10 V

1

Hybrid

12

0.01 %

Complementary 2's Complement, Complementary Offset Binary, Complementary Binary

5,±12/±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T32

No

e0

AD7576TQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-STD-883 Class B

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

20 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

AD679TJ/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

128 kHz

1

BICMOS

38535Q/M;38534H;883B

14

34 mA

0.0122 %

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

Chip Carrier

LCC44,.65SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

6.3 µs

S-CQCC-J44

0.135 in (3.42 mm)

0.65 in (16.51 mm)

No

e0

0.65 in (16.51 mm)

AD7574TE

Analog Devices

Analog To Digital Converter

Military

No Lead

20

QCCN

Square

Ceramic

1

Yes

15 V

1

CMOS

8

0.2 %

5 V

Offset Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

5962-88650012C

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

8

20 mA

5 V

Binary

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

2.5 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

ADADC85SZ-12

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

12

0.0003 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Gold

Dual

10 µs

R-CDIP-T32

0.23 in (5.84 mm)

0.9 in (22.86 mm)

No

e4

1.62 in (41.15 mm)

AD7574TD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

15 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

5962R0423002VXC

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Flat

52

GQFF

Square

100k Rad(Si)

1

Yes

80 MHz

1

Bipolar

MIL-PRF-38535 Class V

14

5 V

Binary

3.3,5 V

Flatpack, Guard Ring

TPAK52,1.5SQ,40

Analog to Digital Converters

0.04 in (1.016 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Quad

12.5 ns

S-XQFP-F52

0.131 in (3.327 mm)

0.6 in (15.24 mm)

Yes

0.6 in (15.24 mm)

AD9038TE/883B

Analog Devices

Analog To Digital Converter

Military

No Lead

68

QCCN

Square

Ceramic

1

Yes

1

Bipolar

38535Q/M;38534H;883B

8

0.39 %

Offset Binary

-5.2 V

-5.2 V

Chip Carrier

LCC68,.95SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N68

No

e0

AD7572SE12

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

13 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

ADC908BX/883C

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.29 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

AD9002SD

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

100 mV

150 MHz

1

Bipolar

8

0.4688 %

Binary

-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7828UE

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

8

Yes

5 V

50 kHz

1

CMOS

MIL-STD-883 Class B

8

0.1953 %

5 V

Binary, Complementary Offset Binary

5 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

2.8 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD579ZTD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

10

0.0488 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

2 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

5962-87591023X

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

2.5 V

1

BICMOS

38535Q/M;38534H;883B

12

12 mA

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

13 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD7875TQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

38535Q/M;38534H;883B

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial, Parallel, 8 Bits, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8865804XX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

12

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Dual

R-CDIP-T32

0.28 in (7.112 mm)

0.6 in (15.24 mm)

No

1.62 in (41.15 mm)

AD7820UE

Analog Devices

Analog To Digital Converter, Flash Method

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

7.3 V

1

CMOS

8

20 mA

0.195 %

5 V

Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-300 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

1.36 µs

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

AD7572UE12/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

5 V

Binary

5,-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Quad

13 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

AD7582TQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Binary

±5,15 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

100 µs

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

No

e0

5962-8982801EX

Onsemi

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

100 mV

25 MHz

1

MIL-STD-883

4

5 V

Binary, Offset 2's Complement

-5.2 V

In-Line

125 °C (257 °F)

-2.1 V

Parallel, 4 Bits

-55 °C (-67 °F)

Dual

40 ns

R-GDIP-T16

No

5962-8982801EA

Onsemi

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

100 mV

25 MHz

1

MIL-STD-883

4

5 V

Binary, Offset 2's Complement

-5.2 V

In-Line

125 °C (257 °F)

-2.1 V

Parallel, 4 Bits

-55 °C (-67 °F)

Dual

40 ns

R-GDIP-T16

No

RHF1401KSO2

STMicroelectronics

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Plastic/Epoxy

1

Yes

2 V

20 MHz

1

CMOS

14

2.5 V

Binary, 2's Complement Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

R-PDSO-G48

0.107 in (2.72 mm)

0.38 in (9.65 mm)

No

0.62 in (15.75 mm)

5962F0521701VXX

STMicroelectronics

Analog To Digital Converter Subsystem

Military

Gull Wing

48

SSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

650 mV

50 MHz

1

MIL-PRF-38535 Class V

12

0.0488 %

2.5 V

Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

125 °C (257 °F)

400 mV

Parallel, Word

-55 °C (-67 °F)

Dual

R-CDSO-G48

0.114 in (2.9 mm)

0.38 in (9.65 mm)

Yes

0.62 in (15.745 mm)

RH-AD128KX

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

Flat

16

SOF

Rectangular

300k Rad(Si)

Plastic/Epoxy

8

Yes

3.6 V

1 MHz

1

CMOS

12

0.022 %

3.3 V

Binary

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-2.7 V

Serial

-55 °C (-67 °F)

Track

Dual

R-PDSO-F16

0.107 in (2.72 mm)

0.272 in (6.905 mm)

0.391 in (9.94 mm)

RHF1401KSO1

STMicroelectronics

Analog To Digital Converter, Pipelined

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

2 V

20 MHz

1

CMOS

MIL-PRF-38535 Class V

14

0.018311 %

2.5 V

Binary, 2's Complement Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

R-CDSO-G48

0.107 in (2.72 mm)

0.38 in (9.65 mm)

No

0.62 in (15.75 mm)

5962F0626001VXC

STMicroelectronics

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

500 mV

20 MHz

1

MIL-PRF-38535 Class V

14

50 mA

0.0122 %

2.5 V

Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

400 mV

Parallel, Word

-55 °C (-67 °F)

Dual

50 ns

R-CDSO-G48

0.114 in (2.9 mm)

0.38 in (9.65 mm)

Yes

0.62 in (15.745 mm)

5962F1820401VXC

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

Flat

16

DFP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

8

Yes

3.6 V

1 MHz

2

CMOS

MIL-PRF-38535 Class V

12

0.0269 %

3.3 V

Binary

Flatpack

125 °C (257 °F)

-3.6 V

Serial

-55 °C (-67 °F)

Track

Dual

R-CDFP-F16

Yes

5962F1820401VXA

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

Flat

16

DFP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

8

Yes

3.6 V

1 MHz

2

CMOS

MIL-PRF-38535 Class V

12

0.0269 %

3.3 V

Binary

Flatpack

125 °C (257 °F)

-3.6 V

Serial

-55 °C (-67 °F)

Dual

R-CDFP-F16

Yes

5962F1820401V9A

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

No Lead

21

DIE

Rectangular

300k Rad(Si)

8

Yes

3.6 V

1 MHz

2

CMOS

MIL-PRF-38535 Class V

12

0.0269 %

3.3 V

Binary

Uncased Chip

125 °C (257 °F)

-3.6 V

Serial

-55 °C (-67 °F)

Track

Upper

R-XUUC-N21

Yes

5962F0521701VXC

STMicroelectronics

Analog To Digital Converter Subsystem

Military

Gull Wing

48

SSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

650 mV

50 MHz

1

CMOS

MIL-PRF-38535 Class V

12

0.0488 %

2.5 V

Binary

2.5 V

Small Outline, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

400 mV

Parallel, Word

-55 °C (-67 °F)

Dual

R-CDSO-G48

0.114 in (2.9 mm)

0.38 in (9.65 mm)

Yes

0.62 in (15.745 mm)

RHFAD1285K01V

STMicroelectronics

Analog To Digital Converter, Successive Approximation

Military

Flat

16

SOF

Rectangular

300k Rad(Si)

Plastic/Epoxy

8

Yes

3.6 V

1 MHz

1

CMOS

12

0.022 %

3.3 V

Binary

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-2.7 V

Serial

-55 °C (-67 °F)

Track

Dual

R-PDSO-F16

0.107 in (2.72 mm)

0.272 in (6.905 mm)

0.391 in (9.94 mm)

RHF1401KSO-01V

STMicroelectronics

Analog To Digital Converter, Pipelined

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

Yes

2 V

20 MHz

1

CMOS

14

0.018311 %

2.5 V

Binary, 2's Complement Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

R-CDSO-G48

0.107 in (2.72 mm)

0.38 in (9.65 mm)

No

0.62 in (15.75 mm)

RHF1201KSO2

STMicroelectronics

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

48

HSSOP

Rectangular

300k Rad(Si)

Plastic/Epoxy

1

Yes

2 V

50 MHz

1

CMOS

12

2.5 V

Binary, 2's Complement Binary

2.5 V

Small Outline, Heat Sink/Slug, Shrink Pitch

SSOP48,.48

Analog to Digital Converters

0.025 in (0.635 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

R-PDSO-G48

0.107 in (2.72 mm)

0.38 in (9.652 mm)

No

40 s

250 °C (482 °F)

0.613 in (15.57 mm)

TDE8715D-T

NXP Semiconductors

Analog To Digital Converter, Resistance Ladder

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

6.25 MHz

1

Bipolar

8

0.293 %

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

ADC0820CSEF

NXP Semiconductors

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

WDIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

15 mA

0.39 %

5 V

Offset Binary

In-Line, Window

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.957 in (24.305 mm)

ADC0820BSEF

NXP Semiconductors

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

WDIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

15 mA

0.195 %

5 V

Offset Binary

In-Line, Window

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.957 in (24.305 mm)

TDE8715D

NXP Semiconductors

Analog To Digital Converter, Resistance Ladder

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

6.25 MHz

1

Bipolar

8

0.293 %

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

MAX122BMYG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

500 kHz

1

BICMOS

12

0.0244 %

5 V

2's Complement Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Track

Dual

2.6 µs

R-PDIP-T24

0.225 in (5.72 mm)

0.3 in (7.62 mm)

1.28 in (32.51 mm)

MX7672UE05

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

5 V

1

BICMOS

12

0.0183 %

5 V

Binary

5,-12 V

-12 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

5.2 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

MAX149BMAP/PR3

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

133 kHz

1

CMOS

MIL-STD-883 Class B

10

0.0977 %

3 V

Binary, 2's Complement Binary

3/5 V

Small Outline, Thin Profile, Shrink Pitch

SSOP20,.3

Analog to Digital Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Sample

Dual

65 µs

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

0.283 in (7.2 mm)

MAX147AMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

1.25 V

133 kHz

1

CMOS

12

0.0122 %

5 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

65 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX167BMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

8.13 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.