Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX1248AMJE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

1.25 V

13.3 kHz

1

CMOS

10

0.0488 %

3 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

65 µs

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1391MTB

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSON

Square

Plastic/Epoxy

1

Yes

3.6 V

416 kHz

1

BICMOS

8

0.0781 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

1.8 µs

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0.118 in (3 mm)

MAX160MJN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

6 µs

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX1396MTB+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSON

Square

2

Yes

3.6 V

312.5 kHz

1

BICMOS

12

0.0244 %

1.6 V

Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Matte Tin

Track

Dual

S-XDSO-N10

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0.118 in (3 mm)

MAX170DMJA/883B-W

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Sample

Dual

5.6 µs

R-CDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

0.405 in (10.29 mm)

MAX149BMAP/PR

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

133 kHz

1

CMOS

MIL-STD-883 Class B

10

0.0977 %

3 V

Binary, 2's Complement Binary

3/5 V

Small Outline, Thin Profile, Shrink Pitch

SSOP20,.3

Analog to Digital Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Sample

Dual

65 µs

R-PDSO-G20

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

0.283 in (7.2 mm)

MX674ATQ/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

0.0732 %

12 V

Binary, Offset Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Dual

15 µs

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

20 s

240 °C (464 °F)

MAX1248BMJE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

1.25 V

13.3 kHz

1

CMOS

10

0.0977 %

3 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

65 µs

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX154BMRG/HR

Maxim Integrated

Digital To Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

4

No

5 V

CMOS

MIL-STD-883 Class B (Modified)

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

MAX152MJP

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

3.6 V

400 kHz

1

8

3.3 V

Binary

3/±3 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3.6 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.6 µs

R-CDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX161BMJI/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

MIL-STD-883

8

0.293 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

MAX188DMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX1242BMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

73 MHz

1

CMOS

10

0.0977 %

5.25 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC0820CJ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

4.9 V

1

CMOS

8

15 mA

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX574AJD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

0.012 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

25 µs

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

MAX1394MTB-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSON

Square

Plastic/Epoxy

2

Yes

3.6 V

416 kHz

1

BICMOS

8

0.0781 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

1.8 µs

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0.118 in (3 mm)

MAX1202BMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

133 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

3/5,5,GND/-5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX194BMDE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

85 kHz

1

CMOS

14

5 mA

0.0061 %

5 V

Binary

±5 V

-5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

MAX1110MJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

8

No

5.55 V

50 kHz

1

CMOS

8

0.1953 %

2.7 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin/Lead

Track

Dual

55 µs

R-CDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

MAX186AMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0122 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX172BMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10.4 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MX578ZSN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

80 mA

0.0183 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T32

No

e0

MX7820UQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.95 in (24.13 mm)

MAX173MRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

10

0.05 %

5 V

Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

5.2 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX1111MJE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

4

No

5.55 V

50 kHz

1

CMOS

8

0.1953 %

2.7 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

55 µs

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ICL7109MDL

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T40

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

2.05 in (52.075 mm)

MX7828UQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Ceramic, Glass-Sealed

8

No

5.25 V

1

CMOS

8

5 V

Complementary Offset Binary

In-Line

DIP28(UNSPEC)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.8 µs

1

No

e0

MX574ASD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

0.0244 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

25 µs

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

MX7572SQ12/883

Maxim Integrated

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

0.024 %

Offset Binary

5,-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

MAX172AMRG/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

MIL-STD-883

12

0.018 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10.4 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-89616042C

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

10 V

1

CMOS

MIL-STD-883

8

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Chip Carrier

LCC20,.35SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

15 µs

S-CQCC-N20

1

No

MAX162CMRG/883

Maxim Integrated

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

0.024 %

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

MX7572SQ12/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

MIL-STD-883

12

0.024 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX190AMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.25 V

76 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial, Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

18 µs

R-GDIP-T24

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MX7576SQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin/Lead

Track

Dual

30 µs

R-CDIP-T18

1

No

e0

MAX121MJE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

308 kHz

1

BICMOS

14

20 mA

5 V

2's Complement Binary

5,-12/-15 V

-15 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

3.2 µs

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX155AMJI

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

6.25 V

278 kHz

1

8

0.1953 %

5 V

Binary

5,GND/-5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-300 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

3.8 µs

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MX7820TQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.1 V

1

CMOS

8

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-100 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.95 in (24.13 mm)

MAX111BMJE

Maxim Integrated

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

1.5 V

1.25 MHz

1

14

0.25 %

5 V

2's Complement Binary

5 V

-5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Dual

20 ms

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1249BMJE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

1.25 V

13.3 kHz

1

CMOS

10

0.0977 %

3 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

65 µs

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7821TQ/883B

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

8

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

400 ns

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

MX7572UQ12

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.012 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

13 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX182AMJI

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

CMOS

12

10 mA

1 %

15 V

Binary, Offset Binary

±5,15 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

140 µs

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MAX1241CMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.3 V

73 kHz

1

CMOS

12

0.0244 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1393MTB-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSON

Square

1

Yes

1.8 V

312.5 kHz

1

BICMOS

12

0.0244 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-1.8 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

S-XDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0.118 in (3 mm)

MAX1396MUB-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

2

Yes

3.65 V

312.5 kHz

1

BICMOS

12

0.0244 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

S-PDSO-G10

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

MX578ZTN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

80 mA

0.0183 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T32

No

e0

MX7672UQ10-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

5 V

1

BICMOS

12

0.0183 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10.4 µs

R-GDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.