Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX1247AMJE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

1.25 V

133 kHz

1

CMOS

12

0.0122 %

3.6 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

65 µs

R-GDIP-T16

1

0.23 in (5.842 mm)

0.3 in (7.62 mm)

No

e0

5962-9169102M3X

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

1

CMOS

MIL-STD-883

16

0.003 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Quad

8.13 µs

S-CQCC-N28

0.098 in (2.49 mm)

0.452 in (11.49 mm)

No

e0

0.452 in (11.49 mm)

MAX167AMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

CMOS

12

10 mA

0.012 %

5 V

Binary, Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

8.13 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1393MTB+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSON

Square

1

Yes

1.8 V

312.5 kHz

1

BICMOS

12

0.0244 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-1.8 V

Serial

-55 °C (-67 °F)

Matte Tin

Track

Dual

S-XDSO-N10

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0.118 in (3 mm)

MAX1395MTB+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSSON

Square

2

Yes

3.65 V

357 kHz

1

BICMOS

10

0.0488 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile, Shrink Pitch

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Matte Tin

Track

Dual

S-XDSO-N10

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0.118 in (3 mm)

5962-9169101M3A

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

1

CMOS

MIL-STD-883

16

0.004 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Quad

8.13 µs

S-CQCC-N28

0.098 in (2.49 mm)

0.452 in (11.49 mm)

No

e0

30 s

240 °C (464 °F)

0.452 in (11.49 mm)

MAX160MJN/HR

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

MIL-STD-883 Class B (Modified)

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

6 µs

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX149AMJP+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

1.25 V

133 kHz

1

10

0.0488 %

3 V

Binary, 2's Complement Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Track

Dual

65 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

MX7572UQ05

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.012 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

5.2 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7575TQ/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2.583 V

1

CMOS

MIL-STD-883 Class B

8

0.1953 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Dual

15 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

0.96 in (24.38 mm)

MAX110MJE

Maxim Integrated

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

2.5 V

1

14

0.05 %

5 V

Binary

±5 V

-5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1393MUB-T

Maxim Integrated

Military

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

4 V

BICMOS

12

0.02 %

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-PDSO-G10

No

e0

MAX1112EPP+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

4.096 V

50 kHz

1

CMOS

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Matte Tin

Track

Dual

55 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.03 in (26.16 mm)

MX7581SQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

8

0.7324 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

AD578SN

Maxim Integrated

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

1

No

20 V

1

Hybrid

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T32

e0

MAX188CMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0183 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

245 °C (473 °F)

MAX1240BMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.52 V

73 kHz

1

CMOS

12

0.0244 %

3 V

Binary

3/3.3 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1242DMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

7.3 kHz

1

CMOS

10

0.0977 %

Binary

3/3.3 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX188AMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0122 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX146AMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.5 V

133 kHz

1

CMOS

12

0.0122 %

3 V

Binary

3/3.3 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

65 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MX674AUQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

BICMOS

12

0.0183 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

15 µs

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

MX7824UQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Ceramic, Glass-Sealed

4

No

5.25 V

1

CMOS

8

5 V

Complementary Offset Binary

In-Line

DIP24(UNSPEC)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead

Track

Dual

2.8 µs

1

No

e0

MAX164CMRG/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Binary, Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Dual

8.13 µs

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

1.28 in (32.51 mm)

MX7824TQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Ceramic, Glass-Sealed

4

No

5.25 V

1

CMOS

8

5 V

Complementary Offset Binary

In-Line

DIP24(UNSPEC)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead

Track

Dual

2.8 µs

1

No

e0

MAX181AMJL

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.5 V

100 kHz

1

12

0.0244 %

5 V

Binary

5,-12/-15 V

-12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T40

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

2.05 in (52.07 mm)

MAX164CMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

8.13 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX170DMJA/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

38535Q/M;38534H;883B

12

0.0244 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Dual

5.6 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX148BMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

1.25 V

133 kHz

1

CMOS

MIL-STD-883 Class B

10

0.0977 %

3 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

65 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX164BMRG/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Binary, Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Dual

8.13 µs

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

1.28 in (32.51 mm)

MAX154AMRG/HR

Maxim Integrated

Digital To Analog Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

4

No

5 V

CMOS

MIL-STD-883 Class B (Modified)

8

5 V

Binary, Offset Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

MAX1392MTB

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSSON

Square

1

Yes

3.65 V

357 kHz

1

BICMOS

10

0.0488 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile, Shrink Pitch

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

S-XDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0.118 in (3 mm)

MX7576TQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

2.46 V

1

CMOS

8

0.1953 %

5 V

Offset Binary

In-Line

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin/Lead

Track

Dual

30 µs

R-CDIP-T18

1

No

e0

MAX151AMRG

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

300 kHz

1

10

45 mA

0.098 %

5 V

Offset Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.25 in (31.75 mm)

MX7581TQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

MX7572SQ05/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.024 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

5.2 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX174AMJI

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

BICMOS

12

0.0183 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

8 µs

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MX574ATD/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

MIL-STD-883

12

0.012 %

15 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Gold Over Nickel

Dual

25 µs

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e4

MX574ATQ/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

BICMOS

MIL-STD-883

12

0.012 %

15 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

25 µs

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

MX7572SQ12

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead

Dual

13 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

MAX1392MTB-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSSON

Square

1

Yes

3.65 V

357 kHz

1

BICMOS

10

0.0488 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile, Shrink Pitch

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

S-XDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0.118 in (3 mm)

MAX186DMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-9169202M3A

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

1

CMOS

MIL-STD-883

16

0.002 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Quad

40 µs

S-CQCC-N28

0.098 in (2.49 mm)

0.452 in (11.49 mm)

No

e0

30 s

240 °C (464 °F)

0.452 in (11.49 mm)

MAX1241AMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

73 kHz

1

CMOS

12

0.0122 %

5.25 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX186DMJP/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

MAX1243AMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

73 MHz

1

CMOS

10

0.0488 %

5.25 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7575TQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

2.46 V

1

CMOS

8

0.1953 %

5 V

Offset Binary

In-Line

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin/Lead

Track

Dual

15 µs

R-CDIP-T18

1

No

e0

MX578SN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

80 mA

0.0183 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T32

No

e0

MAX113MRG

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

3 V

400 kHz

1

CMOS

8

6 mA

3.6 V

Binary

3.3 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.