Military Analog-to-Digital Converters 1,814

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MX578TN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

80 mA

0.0183 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T32

No

e0

MAX111MJE

Maxim Integrated

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

2 V

1

14

0.05 %

5 V

Binary

5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2 V

Serial

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7572TQ05

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

5.2 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX180AMJL/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

100 kHz

1

12

0.012 %

5 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T40

1

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

2.05 in (52.07 mm)

MAX1396MTB

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSON

Square

2

Yes

3.6 V

312.5 kHz

1

BICMOS

12

0.0244 %

1.6 V

Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

S-XDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0.118 in (3 mm)

MX7828TQ/883B

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

8

No

5.25 V

50 kHz

1

CMOS

MIL-STD-883 Class B

8

5 V

Complementary Offset Binary

In-Line

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Dual

2.8 µs

R-CDIP-T28

MAX1394MTB

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSON

Square

Plastic/Epoxy

2

Yes

3.6 V

416 kHz

1

BICMOS

8

0.0781 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

1.8 µs

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0.118 in (3 mm)

MAX188BMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0122 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX181CMJL/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

100 kHz

1

12

0.024 %

5 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T40

1

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

2.05 in (52.07 mm)

MAX172BC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

24

DIE

1

Yes

5 V

1

CMOS

12

0.018 %

5 V

Binary

5,-12/-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Upper

10.4 µs

X-XUUC-N24

No

e0

MX7824UQ/883B

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

4

No

5.25 V

100 kHz

1

CMOS

MIL-STD-883 Class B

8

5 V

Complementary Offset Binary

In-Line

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Dual

2.8 µs

R-CDIP-T24

MX7672UE10

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

5 V

1

BICMOS

12

0.0183 %

5 V

Binary

5,-12 V

-12 V

Chip Carrier

LCC28,.45SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Quad

10.4 µs

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

MAX1241BMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

73 kHz

1

CMOS

12

0.0244 %

5.25 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX160MJN/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

MIL-STD-883

8

0.2 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

6 µs

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.89 in (22.606 mm)

MX7578TD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

CMOS

12

5 V

Binary

±5,15 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

150 µs

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1112EPP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

4.096 V

50 kHz

1

CMOS

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

55 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

MAX191AMRG/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.25 V

100 kHz

1

CMOS

12

0.0244 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5.25 V

Serial, Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

18 µs

R-GDIP-T24

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

e0

MAX172BMRG/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

MIL-STD-883

12

0.024 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10.4 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX149BMAP/PR2

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

133 kHz

1

CMOS

MIL-STD-883 Class B

10

0.0977 %

3 V

Binary, 2's Complement Binary

3/5 V

Small Outline, Thin Profile, Shrink Pitch

SSOP20,.3

Analog to Digital Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Sample

Dual

65 µs

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

0.283 in (7.2 mm)

5962-9169201M3A

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

1

CMOS

MIL-STD-883

16

0.004 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Quad

40 µs

S-CQCC-N28

0.098 in (2.49 mm)

0.452 in (11.49 mm)

No

e0

30 s

240 °C (464 °F)

0.452 in (11.49 mm)

MAX155BMJI

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

6.25 V

278 kHz

1

8

0.3906 %

5 V

Binary

5,GND/-5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-300 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

3.8 µs

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

AD7574SQ/HR

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

MIL-STD-883 Class B (Modified)

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

MAX1203BMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

133 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

3/5,5,GND/-5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX181BMJL

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.5 V

100 kHz

1

12

0.0244 %

5 V

Binary

5,-12/-15 V

-12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T40

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

2.05 in (52.07 mm)

MAX148BMJP+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

1.25 V

133 kHz

1

10

0.0977 %

3 V

Binary, 2's Complement Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Track

Dual

65 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

MAX183AMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

5.2 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MX7574TQ/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

MIL-STD-883

8

5 V

Binary, Offset Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX574ATD/HR

Maxim Integrated

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

BICMOS

MIL-STD-883 Class B (Modified)

12

0.018 %

Binary, Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

MAX1395MTB+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSSON

Square

2

Yes

3.65 V

357 kHz

1

BICMOS

10

0.0488 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile, Shrink Pitch

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Matte Tin

Track

Dual

S-XDSO-N10

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0.118 in (3 mm)

MX674ASQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

BICMOS

12

0.0244 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

15 µs

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

MAX153MLP

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1

8

5 V

Offset Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

MAX170BMJA

Maxim Integrated

Analog To Digital Converter

Military

Through-Hole

8

DIP

Rectangular

Ceramic

1

No

5 V

1

CMOS

12

0.024 %

Offset Binary

5,-12/-15 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T8

e0

MAX180BMDL

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

40

8

2.5 V

100 kHz

1

12

0.0244 %

5 V

Binary

-12 V

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Track

10 µs

MX7572SQ05

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

MIL-STD-883

12

12 mA

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

5.2 s

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX161CMJI/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

MIL-STD-883

8

0.1953 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

MAX163BMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

8.13 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MX7581UQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

8

0.1953 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

MAX166AMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.58 V

200 kHz

1

CMOS

8

7 mA

0.195 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

5962-9169202M3X

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

1

CMOS

MIL-STD-883

16

0.002 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Quad

40 µs

S-CQCC-N28

0.098 in (2.49 mm)

0.452 in (11.49 mm)

No

e0

0.452 in (11.49 mm)

MAX182BMJI

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

CMOS

12

10 mA

1 %

15 V

Binary, Offset Binary

±5,15 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

140 µs

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MX7574SQ/HR

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

MIL-STD-883 Class B (Modified)

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

5962-8512701XC

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

MIL-PRF-38535

12

0.0122 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

24 µs

R-CDIP-T28

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

MAX162CMRG/HR

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

MIL-STD-883 Class B (Modified)

12

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

3.25 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7824TQ/883B

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

4

No

5.25 V

100 kHz

1

CMOS

MIL-STD-883 Class B

8

5 V

Complementary Offset Binary

In-Line

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Dual

2.8 µs

R-CDIP-T24

MAX1249AMJE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

1.25 V

13.3 kHz

1

CMOS

10

0.0488 %

3 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

65 µs

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX149BMJP+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

1.25 V

133 kHz

1

10

0.0977 %

3 V

Binary, 2's Complement Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Track

Dual

65 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

MAX187AMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

4.096 V

75 kHz

1

CMOS

12

2.5 mA

0.0122 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

8.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX165BMJN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.58 V

200 kHz

1

CMOS

8

7 mA

0.39 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.