Military Analog-to-Digital Converters 1,814

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX149AMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

1.25 V

133 kHz

1

CMOS

MIL-STD-883 Class B

10

0.0488 %

3 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

65 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX1113MJE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

4.096 V

50 kHz

1

CMOS

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

55 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

MAX176BMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

250 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX1246BMJE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

1.25 V

133 kHz

1

CMOS

12

0.0244 %

3.6 V

Binary, 2's Complement Binary

3/3.3 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.25 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

65 µs

R-GDIP-T16

1

0.23 in (5.842 mm)

0.3 in (7.62 mm)

No

e0

MAX177MRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

CMOS

10

0.05 %

5 V

Binary

5,-12/-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

8.57 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX1242AMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

73 MHz

1

CMOS

10

0.0488 %

5.25 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7574TD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

1

No

10 V

1

CMOS

8

0.2 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e0

MX7672TQ05

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

5 V

1

BICMOS

12

0.0244 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

5.2 µs

R-GDIP-T24

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

MX7672TQ10

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

5 V

1

BICMOS

12

0.0244 %

5 V

Binary

5,-12 V

-12 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10.4 µs

R-GDIP-T24

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

MX574ATQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

BICMOS

12

0.0183 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

25 µs

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

MAX117MJI

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

3 V

400 kHz

1

CMOS

8

6 mA

3.6 V

Binary

3.3 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.6 µs

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

MX7575SQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin/Lead

Track

Dual

15 µs

R-CDIP-T18

1

No

e0

ICL7109MJL

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3.5 V

1

CMOS

12

0.0244 %

5 V

Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-3.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T40

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

2.05 in (52.075 mm)

MX7574SQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7828TQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Ceramic, Glass-Sealed

8

No

5.25 V

1

CMOS

8

5 V

Complementary Offset Binary

In-Line

DIP28(UNSPEC)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead

Track

Dual

2.8 µs

1

No

e0

MX7574TQ/HR

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

MIL-STD-883 Class B (Modified)

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

5962-9169202MXX

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

4.5 V

1

CMOS

MIL-STD-883

16

0.002 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

40 µs

R-GDIP-T28

No

e0

MAX192BMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

133 kHz

1

CMOS

10

0.0977 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.03 in (26.16 mm)

MAX161AMJI/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

MIL-STD-883

8

0.7324 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

MAX189AMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

4.096 V

75 kHz

1

CMOS

12

2 mA

0.0122 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

8.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX122BMRG/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

500 kHz

1

BICMOS

12

0.024 %

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.6 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7582TQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

12

15 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

MAX174BMJI

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

BICMOS

12

0.0183 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

8 µs

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MAX163CMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

8.13 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX1395MUB-T

Maxim Integrated

Military

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

2

Yes

3.65 V

BICMOS

10

0.048 %

Binary

1.8/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-PDSO-G10

No

e0

MX7572TQ05/883

Maxim Integrated

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

0.024 %

Offset Binary

5,-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

MAX1396MUB+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

2

Yes

3.65 V

312.5 kHz

1

BICMOS

12

0.0244 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Matte Tin

Track

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

0.118 in (3 mm)

MAX187BMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

4.096 V

75 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

8.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX194AMDE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

85 kHz

1

CMOS

14

5 mA

0.0031 %

5 V

Binary

±5 V

-5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.05 mm)

MAX186CMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.048 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX1393MTB

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSON

Square

1

Yes

1.8 V

312.5 kHz

1

BICMOS

12

0.0244 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-1.8 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

S-XDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0.118 in (3 mm)

AD7574TQ/HR

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

MIL-STD-883 Class B (Modified)

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

MAX178AMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

12

10 mA

0.024 %

15 V

Binary, Offset Binary

±5,15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

140 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX122BMYG/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

500 kHz

1

BICMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

2's Complement Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Track

Dual

2.6 µs

R-PDIP-T24

0.225 in (5.72 mm)

0.3 in (7.62 mm)

1.28 in (32.51 mm)

MX7572SQ05/883

Maxim Integrated

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

0.024 %

Offset Binary

5,-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

MX7578TQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

5 V

Binary

±5,15 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

150 µs

R-GDIP-T24

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

MAX146BMJP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.5 V

133 kHz

1

CMOS

12

0.0244 %

3 V

Binary

3/3.3 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

65 µs

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX167CMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

CMOS

12

10 mA

0.024 %

5 V

Binary, Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

8.13 µs

R-GDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7575SQ/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2.583 V

1

CMOS

MIL-STD-883 Class B

8

0.3906 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Dual

15 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

0.96 in (24.38 mm)

MAX191AMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.25 V

100 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5,GND/-5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5.25 V

Serial, Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

18 µs

R-GDIP-T24

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MAX1391MTB-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

10

HVSON

Square

Plastic/Epoxy

1

Yes

3.6 V

416 kHz

1

BICMOS

8

0.0781 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

1.8 µs

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

245 °C (473 °F)

0.118 in (3 mm)

AD578TN

Maxim Integrated

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

1

No

20 V

1

Hybrid

12

0.012 %

Offset Binary

5,±15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T32

e0

MAX190BMRG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5.25 V

76 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial, Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

18 µs

R-GDIP-T24

1

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MAX170CMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0183 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Dual

5.6 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7574SD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

1

No

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-XDIP-T18

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e4

MAX180BMJL

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

40

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

2.5 V

100 kHz

1

12

0.0244 %

5 V

Binary

5,-12/-15 V

-12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

10 µs

R-GDIP-T40

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

2.05 in (52.07 mm)

MAX153MJP

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

2.5 V

1 MHz

1

CMOS

8

0.39 %

5 V

Binary

5,GND/-5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

975 ns

R-CDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX1243BMJA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

73 MHz

1

CMOS

10

0.0977 %

5.25 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

7.5 µs

R-GDIP-T8

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.