Through-Hole Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD1378SD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

16

40 mA

0.006 %

15 V

Complementary Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

17 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD5202SD

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

10 V

1

Hybrid

12

0.012 %

Complementary Offset Binary

5,±15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

AD871SD

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

5 MHz

1

BICMOS

MIL-STD-883

12

0.0366 %

5 V

Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

200 ns

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7576AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-M-38510

8

0.3906 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Sample

Dual

20 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

LTC1290BCN#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

50 kHz

1

CMOS

12

0.0122 %

5 V

2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5.05 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

13 µs

R-PDIP-T20

1

0.3 in (7.62 mm)

No

e3

LTC1272CCN-8#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

250 kHz

1

CMOS

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

8.125 µs

R-PDIP-T24

0.3 in (7.62 mm)

e3

1.28 in (32.512 mm)

AD7572JN05

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

5.2 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.227 in (31.165 mm)

AD7886KD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1.1 MHz

1

BICMOS

12

35 mA

0.0488 %

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

100 ns

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD674BJN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

BICMOS

12

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

15 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

5962-9475901MXX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

40 MHz

1

10

0.2441 %

5 V

Offset Binary

-5 V

In-Line

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Track

Dual

R-GDIP-T28

No

AD7711SN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

12.3 V

160 kHz

1

CMOS

21

4 mA

0.0015 %

10 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-6.3 V

Serial

-55 °C (-67 °F)

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

1.199 in (30.45 mm)

ADC908BIFX

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

2.5 mA

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

7 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD574UD

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

Bipolar

12

0.024 %

Offset Binary

5,±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD9003SM/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

2.5 V

1

38535Q/M;38534H;883B

12

0.049 %

Complementary Binary, Complementary Offset Binary

5,±15 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

Parallel, Word

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T40

No

e0

5962-8961602VA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

MIL-STD-883

8

0.293 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

6 µs

R-GDIP-T18

No

ADADC85S10/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

10

0.05 %

Complementary 2's Complement, Complementary Offset Binary, Complementary Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T32

No

e0

AD1671-713D

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1.25 MHz

1

BICMOS

38535V;38534K;883S

12

0.061 %

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

800 ns

R-CDIP-T28

No

AD679SD

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

0.0122 %

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

6.3 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

LTC1273ACN#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

300 kHz

1

BICMOS

12

0.0122 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

2.7 ms

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

ADADC71KM

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

32

DIP

Rectangular

Metal

1

No

20 V

1

Bipolar

16

0.003 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

AD574AJD/+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

12

0.0244 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Dual

35 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD369AD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

50 kHz

1

Hybrid

12

0.0183 %

15 V

Complementary Binary

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

PM7572EP12

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

13 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7878TQ

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

3 V

1

BICMOS

12

5 V

Offset 2's Complement, 2's Complement

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD16710703D

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1.25 MHz

1

12

0.07324 %

5 V

Binary

-5 V

In-Line

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

800 ns

R-CDIP-T28

LTC1287CCN8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

3.05 V

30 kHz

1

CMOS

12

0.0122 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

24 µs

R-PDIP-T8

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

ADADC85S-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

10

0.048 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

5962-01-426-6606

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

100 mV

1

Bipolar

8

0.47 %

Offset Binary

5,-5.2 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

1

No

LTC1098CN8#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

6.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

32 µs

R-PDIP-T8

1

0.3 in (7.62 mm)

No

e0

AD9688TQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3.3 V

200 MHz

1

Bipolar

4

85 mA

0.3906 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.7 V

Parallel, 4 Bits

-55 °C (-67 °F)

Tin Lead

Dual

5.7 ns

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7890AN-2

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

2.5 V

117 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

5.9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

LTC1272CCN-8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

250 kHz

1

CMOS

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

8.125 µs

R-PDIP-T24

0.3 in (7.62 mm)

e3

1.28 in (32.512 mm)

AD7576AQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Sample

Dual

30 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD574ALD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

12

40 mA

0.0122 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

35 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

ADC7672LN10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Dual

10.4 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

1.227 in (31.165 mm)

AD674ASD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

38535Q/M;38534H;883B

12

0.024 %

Binary, Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD7705BN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

2

No

2.5 V

19.2 kHz

1

CMOS

16

0.003 %

3 V

Binary, Offset Binary

3/5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.79 in (20.07 mm)

AD9048TQ/833B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

100 mV

38 MHz

1

Bipolar

MIL-STD-883 Class B

8

0.293 %

5 V

Binary, Offset 2's Complement

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

5962-8865804XC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.018 %

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Dual

R-CDIP-T32

0.28 in (7.112 mm)

0.6 in (15.24 mm)

No

1.62 in (41.15 mm)

ADC908AX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

2.5 mA

0.1953 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

7 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADADC72JM

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

32

DIP

Rectangular

Metal

1

No

20 V

1

Bipolar

16

0.006 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

AD7874BN/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

4

No

10 V

29 kHz

1

CMOS

MIL-STD-883 Class B

12

5 V

2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Track

Dual

35 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

1.445 in (36.703 mm)

5962-01-187-0855

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

20 V

1

38535Q/M;38534H;883B

12

0.024 %

Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

AD7810YN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5.5 V

350 kHz

1

CMOS

10

0.0977 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

105 °C (221 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

2.3 µs

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

5962-8876403XX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

50 kHz

1

CMOS

MIL-STD-883

8

5 V

Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

Yes

e0

AD676BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

100 kHz

1

BICMOS

16

18 mA

0.0023 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

1 ms

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7819YNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

200 kHz

1

CMOS

8

0.1953 %

3 V

Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

4.5 µs

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.793 in (20.13 mm)

LTC1094MJ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

10.05 V

1

CMOS

MIL-STD-883 Class B

10

0.0488 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-50 mV

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.06 in (26.924 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.