Through-Hole Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD9003SM

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

15 V

1 MHz

1

12

90 mA

0.036 %

15 V

Complementary Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

100 °C (212 °F)

-15 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

1 µs

R-MDIP-T40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

AD5214TD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Hybrid

38535Q/M;38534H;883B

12

68 mA

0.0122 %

15 V

Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-CDIP-T24

0.245 in (6.22 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

AD9688BQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3.3 V

200 MHz

1

Bipolar

4

85 mA

0.3906 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.7 V

Parallel, 4 Bits

-25 °C (-13 °F)

Tin Lead

Dual

5.7 ns

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

LTC1292BCN8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5.05 V

60 kHz

1

CMOS

12

0.0122 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

12 µs

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

5962-8951801RC

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

CMOS

8

25 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

975 ns

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADADC84-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

10

0.048 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

ADC7672BQ10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Dual

10.4 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

LTC1096CN8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

9.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

32 µs

R-PDIP-T8

1

0.15 in (3.809 mm)

0.3 in (7.62 mm)

No

e0

HAS-1409KMB

Analog Devices

Analog To Digital Converter

Other

Through-Hole

40

DIP

Rectangular

Metal

1

No

10 V

1

Hybrid

MIL-STD-883 Class B (Modified)

14

0.009 %

Offset Binary, 2's Complement Binary

5,±15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T40

No

e0

AD7581KNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

17 V

1

CMOS

8

8 mA

0.293 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-17 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.472 in (37.4 mm)

5962-8951801RX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

CMOS

8

25 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

975 ns

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

5962-8865002RB

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

8

20 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD779KN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

0.0122 %

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

6.3 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

AD7885AN

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

166 kHz

1

BICMOS

16

35 mA

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Sample

Dual

5.3 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.7 mm)

5962-8759102LX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

BICMOS

38535Q/M;38534H;883B

12

12 mA

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD1378TD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

25 V

63 kHz

1

Hybrid

16

40 mA

0.003 %

15 V

Complementary Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-25 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

17 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD7820TQ

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

7.3 V

1

CMOS

8

20 mA

0.39 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-300 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

1.36 µs

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD574ATD/833B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

MIL-STD-883

12

0.0122 %

12 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Sample

Dual

32 ms

R-CDIP-T28

0.135 in (3.43 mm)

0.6 in (15.24 mm)

1.41 in (35.81 mm)

AD678JN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

200 kHz

1

BIMOS

12

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

4.4 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.7 mm)

AD7893BNZ-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

BICMOS

12

0.0122 %

5 V

2's Complement Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

6 µs

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.389 in (9.88 mm)

AD1671KN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1.25 MHz

1

CMOS

12

68 mA

0.036 %

5 V

Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

800 ns

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

5962-8865804XC

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

0.018 %

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Dual

R-CDIP-T32

0.28 in (7.112 mm)

0.6 in (15.24 mm)

No

1.62 in (41.15 mm)

ADC908AX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

2.5 mA

0.1953 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

7 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADADC72JM

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

32

DIP

Rectangular

Metal

1

No

20 V

1

Bipolar

16

0.006 %

Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

AD7874BN/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

4

No

10 V

29 kHz

1

CMOS

MIL-STD-883 Class B

12

5 V

2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Track

Dual

35 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

1.445 in (36.703 mm)

5962-01-187-0855

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

20 V

1

38535Q/M;38534H;883B

12

0.024 %

Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

AD7810YN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5.5 V

350 kHz

1

CMOS

10

0.0977 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

105 °C (221 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

2.3 µs

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

5962-8876403XX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

50 kHz

1

CMOS

MIL-STD-883

8

5 V

Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2 µs

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

Yes

e0

AD676BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

100 kHz

1

BICMOS

16

18 mA

0.0023 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

1 ms

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD7819YNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

200 kHz

1

CMOS

8

0.1953 %

3 V

Binary

3/5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

4.5 µs

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.793 in (20.13 mm)

LTC1094MJ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

10.05 V

1

CMOS

MIL-STD-883 Class B

10

0.0488 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-50 mV

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.06 in (26.924 mm)

AD7714YNZ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5

No

1.25 V

1

CMOS

24

0.001 %

3 V

Binary, Offset Binary

3/5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

105 °C (221 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T24

0.3 in (7.62 mm)

No

e3

1.227 in (31.165 mm)

AD9012TQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

-2 V

100 MHz

1

Bipolar

8

0.4688 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

No

e0

AD364RKD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

60

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

16

No

10 V

25 kHz

1

12

0.012 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

32 µs

R-CDIP-T60

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

AD375KD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1 MHz

1

12

0.0244 %

15 V

Binary, Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

1 µs

R-CDIP-T40

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

PMAD7572AJN10

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

AD1679KN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

100 kHz

1

BICMOS

12

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

8.5 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.7 mm)

AD7872JNZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

83 kHz

1

CMOS

14

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Serial

0 °C (32 °F)

Matte Tin

Track

Dual

10.5 µs

R-PDIP-T16

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e3

0.75 in (19.055 mm)

AD775JN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.6 V

20 MHz

1

CMOS

8

0.5078 %

5 V

Binary

5 V

In-Line

DIP24,.4

Analog to Digital Converters

0.1 in (2.54 mm)

75 °C (167 °F)

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Dual

R-PDIP-T24

0.161 in (4.1 mm)

0.4 in (10.16 mm)

No

e0

1.195 in (30.35 mm)

LTC1290BIN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

50 kHz

1

CMOS

12

0.0122 %

5 V

2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5.05 V

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Dual

13 µs

R-PDIP-T20

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

LTC1297DCN8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

5.05 V

1

CMOS

12

0.0183 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

12 µs

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

AD7710AQ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

2.5 V

1

CMOS

24

0.003 %

5 V

Binary, Offset Binary

±5/10 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7872AN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

83 kHz

1

CMOS

14

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10.5 µs

R-PDIP-T16

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e0

0.75 in (19.055 mm)

AD5240BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

100 mA

0.012 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

5 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

LTC1291CCN8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

5.05 V

1

CMOS

12

0.0122 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

12 µs

R-PDIP-T8

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

5962-01-184-0852

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

10

0.098 %

Offset Binary

5,-12/-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

AD573JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

50 kHz

1

Bipolar

10

0.0977 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

30 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1 in (25.4 mm)

AD7885BN

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

166 kHz

1

BICMOS

16

35 mA

0.0075 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Sample

Dual

5.3 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.7 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.