Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
2.5 V |
1 MHz |
1 |
CMOS |
MIL-STD-883 |
8 |
25 mA |
0.3906 % |
5 V |
Binary |
5,GND/-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2.5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
975 ns |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 |
12 |
30 mA |
0.0122 % |
15 V |
Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
35 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
2.5 V |
1 |
CMOS |
10 |
10 mA |
0.0977 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2.5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
18.5 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
|||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3.5 V |
1 |
CMOS |
23 |
0 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-3.5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
245 °C (473 °F) |
2.05 in (52.075 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3.5 V |
1 |
CMOS |
23 |
0 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-3.5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
2.05 in (52.075 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 |
12 |
30 mA |
0.0122 % |
15 V |
Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
35 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
2.048 V |
133 kHz |
1 |
CMOS |
12 |
2.5 mA |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5/±5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-2.048 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
1.03 in (26.16 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
2.048 V |
133 kHz |
1 |
CMOS |
12 |
2.5 mA |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5/±5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-2.048 V |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
10 µs |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.03 in (26.16 mm) |
||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5 V |
100 kHz |
1 |
CMOS |
TS 16949 |
12 |
0.0488 % |
5 V |
Binary |
3/5 V |
0 V |
In-Line |
DIP16,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
6 µs |
R-PDIP-T16 |
0.21 in (5.334 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.755 in (19.177 mm) |
|||||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5 V |
100 kHz |
1 |
CMOS |
TS 16949 |
12 |
0.0244 % |
5 V |
Binary |
3/5 V |
0 V |
In-Line |
DIP16,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
6 µs |
R-PDIP-T16 |
0.21 in (5.334 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.755 in (19.177 mm) |
|||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
6.35 V |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-50 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Dual |
114 µs |
R-PDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.027 in (26.075 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.5 V |
16 kHz |
1 |
CMOS |
16 |
0.0015 % |
5 V |
Binary, Offset Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.992 in (25.2 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.05 V |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-50 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Dual |
114 µs |
R-PDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.027 in (26.075 mm) |
||||||||||||||
|
Renesas Electronics |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
1 |
CMOS |
4 |
6.25 % |
5 V |
Binary Coded Decimal |
-5 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, 4 Bits |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
e3 |
1.472 in (37.4 mm) |
|||||||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3.35 V |
1 |
CMOS |
TS 16949 |
1.8 mA |
5 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
2.7 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T40 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
2.038 in (51.753 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
3 |
No |
10 V |
100 kHz |
1 |
BICMOS |
16 |
5 V |
Binary, 2's Complement Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
8 µs |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.992 in (25.2 mm) |
|||||||||||||||
|
Nuvoton Technology |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
5.6 V |
1 |
24 |
5 V |
Offset Binary |
In-Line |
DIP16,.1 |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5.6 V |
Serial |
-40 °C (-40 °F) |
Dual |
R-PDIP-T16 |
0.021 in (0.5334 mm) |
0.3 in (7.62 mm) |
0.75 in (19.05 mm) |
|||||||||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
5 V |
100 kHz |
1 |
TS 16949 |
13 |
450 μA |
0.02441 % |
5 V |
2's Complement Binary |
In-Line |
DIP8,.3 |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDIP-T8 |
0.21 in (5.334 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.365 in (9.271 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
BICMOS |
12 |
0.012 % |
15 V |
Binary, Offset Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Dual |
25 µs |
R-PDIP-T28 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.45 in (36.83 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
BICMOS |
12 |
0.0122 % |
15 V |
Binary, Offset Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Dual |
25 µs |
R-PDIP-T28 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.45 in (36.83 mm) |
|||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.05 V |
1 |
CMOS |
10 |
0.0977 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-50 mV |
Parallel, Word |
0 °C (32 °F) |
Dual |
220 µs |
R-PDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
0.985 in (25.019 mm) |
||||||||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5 V |
200 kHz |
1 |
CMOS |
TS 16949 |
10 |
0.0977 % |
5 V |
Binary |
3/5 V |
In-Line |
DIP16,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
2.7778 µs |
R-PDIP-T16 |
0.21 in (5.334 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.755 in (19.177 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
500 kHz |
1 |
CMOS |
12 |
0.0488 % |
5 V |
Binary |
5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
4.75 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Dual |
R-PDIP-T8 |
0.2 in (5.08 mm) |
0.25 in (6.35 mm) |
No |
e4 |
0.386 in (9.81 mm) |
|||||||||||||
|
Renesas Electronics |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
1 |
CMOS |
9 V |
Binary |
In-Line |
DIP40,.6 |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T40 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
e3 |
2.037 in (51.75 mm) |
|||||||||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
14 |
DIP |
Rectangular |
Plastic/Epoxy |
4 |
No |
5 V |
100 kHz |
1 |
CMOS |
TS 16949 |
12 |
0.0244 % |
5 V |
Binary |
3/5 V |
0 V |
In-Line |
DIP14,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
6 µs |
R-PDIP-T14 |
0.21 in (5.334 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.75 in (19.05 mm) |
|||||||||||
|
Murata Manufacturing |
Analog To Digital Converter |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
1 |
No |
5 V |
1 |
Hybrid |
14 |
Offset Binary |
5,±15 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T24 |
No |
|||||||||||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
5 V |
100 kHz |
1 |
TS 16949 |
13 |
450 μA |
0.012207 % |
5 V |
2's Complement Binary |
In-Line |
DIP8,.3 |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDIP-T8 |
0.21 in (5.334 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.365 in (9.271 mm) |
|||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.1 V |
100 kHz |
1 |
CMOS |
TS 16949 |
12 |
0.0488 % |
5 V |
Binary |
5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-100 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
7.5 µs |
R-PDIP-T8 |
0.21 in (5.334 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.365 in (9.271 mm) |
||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
14 |
DIP |
Rectangular |
Plastic/Epoxy |
4 |
No |
5 V |
100 kHz |
1 |
CMOS |
TS 16949 |
12 |
0.0488 % |
5 V |
Binary |
3/5 V |
0 V |
In-Line |
DIP14,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
6 µs |
R-PDIP-T14 |
0.21 in (5.334 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.75 in (19.05 mm) |
|||||||||||
|
Maxim Integrated |
Analog To Digital Converter |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
9 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
2.05 in (52.075 mm) |
||||||||||||||||
Maxim Integrated |
Analog To Digital Converter |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
9 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.05 in (52.075 mm) |
|||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
10 V |
100 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary, 2's Complement Binary |
5 V |
In-Line |
SDIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
11 µs |
R-PDIP-T24 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.203 in (30.545 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
10 V |
100 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary, 2's Complement Binary |
5 V |
In-Line |
SDIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
11 µs |
R-PDIP-T24 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.203 in (30.545 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
7.3 V |
50 kHz |
1 |
CMOS |
8 |
10 mA |
0.39 % |
5 V |
Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-300 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
18.5 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.199 in (30.45 mm) |
||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Dual |
5.6 µs |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0.369 in (9.375 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
5.6 µs |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.369 in (9.375 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
5.05 V |
11.1 kHz |
1 |
CMOS |
12 |
640 μA |
0.0488 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3.35 V |
1 |
CMOS |
TS 16949 |
1.8 mA |
5 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
2.7 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T40 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
2.038 in (51.753 mm) |
||||||||||||||||
Murata Manufacturing |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
500 kHz |
1 |
Hybrid |
14 |
12 V |
Offset Binary |
5,±15 V |
-12 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Gold Over Nickel |
Sample |
Dual |
500 ns |
R-CDIP-T24 |
0.235 in (5.969 mm) |
0.6 in (15.24 mm) |
No |
e4 |
|||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.05 V |
1 |
CMOS |
10 |
0.0977 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-50 mV |
Parallel, Word |
-40 °C (-40 °F) |
Dual |
220 µs |
R-PDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
0.985 in (25.019 mm) |
||||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
16 |
0.0015 % |
9 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
245 °C (473 °F) |
2.05 in (52.075 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
16 |
0.0015 % |
9 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
2.05 in (52.07 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.05 V |
1 |
10 |
0.0488 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-50 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
20 µs |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.25 V |
500 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
4.75 V |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Dual |
R-PDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
0.386 in (9.81 mm) |
|||||||||||||
|
NXP Semiconductors |
Data Acquisition Device |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
4 |
No |
6 V |
11.1 kHz |
1 |
CMOS |
8 |
1 mA |
0.5859 % |
5 V |
2's Complement Binary |
In-Line |
DIP16,.3 |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Sample |
Dual |
90 µs |
R-PDIP-T16 |
0.165 in (4.2 mm) |
0.3 in (7.62 mm) |
0.749 in (19.025 mm) |
||||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3.35 V |
1 |
CMOS |
TS 16949 |
1.8 mA |
9 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
2.4 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T40 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
2.046 in (51.97 mm) |
||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.1 V |
625 kHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-PDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.027 in (26.075 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
4.9 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
2 µs |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.03 in (26.16 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.