Through-Hole Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MCP3002-I/P

Microchip Technology

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

5 V

200 kHz

1

CMOS

TS 16949

10

0.0977 %

5 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

3.125 µs

R-PDIP-T8

0.21 in (5.334 mm)

0.3 in (7.62 mm)

No

e3

0.37 in (9.4 mm)

TLC0834CN

Texas Instruments

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

4

No

5.5 V

31 kHz

1

CMOS

8

1.25 mA

0.3906 %

5 V

Binary

5 V

In-Line

DIP14,.3

Analog to Digital Converters

4.5 V

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Nickel Palladium Gold

Sample

Dual

32 µs

R-PDIP-T14

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

0.76 in (19.305 mm)

AD674BBD

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

12

0.0122 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

15 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD7703ANZ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

16 kHz

1

CMOS

20

0.003 %

5 V

Binary, Offset Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDIP-T20

0.18 in (4.57 mm)

0.3 in (7.62 mm)

No

e3

0.965 in (24.51 mm)

HTADC12DCB

Honeywell

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

14

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5.55 V

100 kHz

1

SOI-CMOS

12

0.06835 %

5 V

Binary

In-Line

DIP14,.3

0.1 in (2.54 mm)

225 °C (437 °F)

-300 mV

Serial, Parallel, Word

-55 °C (-67 °F)

Dual

11.5 µs

R-CDIP-T14

0.146 in (3.7084 mm)

0.3 in (7.62 mm)

0.7 in (17.78 mm)

MAX162BENG+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.024 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Dual

3.25 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

MAX162BENG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.024 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

3.25 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

ADADC85SZ-12/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.012 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

AD7572BQ05

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

5.2 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

AD7893SQ-5

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

6 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7710ANZ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

2

No

2.5 V

1

CMOS

24

0.003 %

5 V

Binary, Offset Binary

±5/10 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.199 in (30.45 mm)

MAX187BEPA

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

4.096 V

75 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

8.5 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

0.369 in (9.375 mm)

MAX187BEPA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

4.096 V

75 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

8.5 µs

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.369 in (9.375 mm)

AD7875CQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, 8 Bits, Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

HI1-574AJD-5

Renesas Electronics

Analog To Digital Converter, Successive Approximation

Commercial Extended

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

BICMOS

12

0.0244 %

12 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

75 °C (167 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

25 µs

R-CDIP-T28

0.233 in (5.92 mm)

0.6 in (15.24 mm)

No

e4

HI1-574AJD5

Thomson Consumer Electronics

Analog To Digital Converter, Successive Approximation

Commercial Extended

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

BICMOS

12

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

75 °C (167 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

25 µs

R-CDIP-T28

0.233 in (5.92 mm)

0.6 in (15.24 mm)

No

e4

MAX190BENG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5.25 V

76 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

18 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

MAX190BENG+

Analog Devices

Analog To Digital Converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5.25 V

76 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

18 µs

R-PDIP-T24

1

0.3 in (7.62 mm)

e3

30 s

260 °C (500 °F)

1.27 in (32.26 mm)

MC14433P

Motorola

Analog To Digital Converter, Dual-Slope

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

1

CMOS

16

7.4 mA

0.05 %

5 V

Binary Coded Decimal

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

TC5092AP

Toshiba

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

42

DIP

Rectangular

Plastic/Epoxy

8

No

5 V

1

CMOS

13

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

41 ms

R-PDIP-T42

0.189 in (4.8 mm)

0.6 in (15.24 mm)

No

e0

2.094 in (53.2 mm)

2841

Dymec

Analog To Digital Converter

Commercial

Through-Hole

32

DIP

Rectangular

Plastic/Epoxy

1

No

0 mV

1

Hybrid

20

0.02 %

Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T32

No

e0

ADC08061BIN

Texas Instruments

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.6 V

1

CMOS

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Track

Dual

0.9 ns

R-PDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

1.027 in (26.075 mm)

CA3162E

Renesas Electronics

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

200 mV

1

Bipolar

4

5 V

Binary Coded Decimal

In-Line

DIP16,.3

70 °C (158 °F)

-200 mV

Parallel, 4 Bits

0 °C (32 °F)

Dual

R-PDIP-T16

HCPL-786J-000E

Broadcom

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

1

No

320 mV

1

15

0.0916 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-320 mV

Serial

-40 °C (-40 °F)

Matte Tin

Dual

47 µs

R-PDIP-T16

1

0.185 in (4.7 mm)

0.3 in (7.62 mm)

No

e3

260 °C (500 °F)

0.386 in (9.8 mm)

HI1-574ALD-5

Intersil

Analog To Digital Converter, Successive Approximation

Commercial Extended

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

12

0.0122 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

75 °C (167 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

25 µs

R-CDIP-T28

0.233 in (5.92 mm)

0.6 in (15.24 mm)

No

e0

HI1-574ALD5

Thomson Consumer Electronics

Analog To Digital Converter, Successive Approximation

Commercial Extended

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

12

0.0122 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

75 °C (167 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

25 µs

R-CDIP-T28

0.233 in (5.92 mm)

0.6 in (15.24 mm)

No

e0

HI3-7159A-5

Renesas Electronics

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

1

BIMOS

8

0.0035 %

5 V

Binary

-5 V

In-Line

DIP28,.6

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Parallel, 8 Bits

0 °C (32 °F)

Dual

133 ns

R-PDIP-T28

0.25 in (6.35 mm)

0.612 in (15.555 mm)

1.472 in (37.4 mm)

ADC08161CIN

National Semiconductor

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

6.1 V

1.5 MHz

1

CMOS

8

20 mA

0.4 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-100 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Sample

Dual

560 ns

R-PDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.027 in (26.075 mm)

ADD3501CCN

National Semiconductor

Analog To Digital Converter, Pulse-Width Modulation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5.55 V

1

CMOS

10 mA

0.05 %

Offset Binary

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-300 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

650 ms

R-PDIP-T28

0.21 in (5.334 mm)

0.6 in (15.24 mm)

No

e0

1.406 in (35.725 mm)

ADD3701CCN

National Semiconductor

Analog To Digital Converter, Pulse-Width Modulation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5.55 V

1

CMOS

10 mA

0.05 %

Offset Binary

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-300 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

1.28 s

R-PDIP-T28

0.21 in (5.334 mm)

0.6 in (15.24 mm)

No

e0

1.406 in (35.725 mm)

HI1175JCP

Intersil

Analog To Digital Converter, Flash Method

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

20 MHz

1

CMOS

8

0.5078 %

5 V

Binary

5 V

In-Line

DIP24,.4

Analog to Digital Converters

0.1 in (2.54 mm)

75 °C (167 °F)

500 mV

Parallel, 8 Bits

-20 °C (-4 °F)

Tin Lead

Sample

Dual

50 ns

R-PDIP-T24

0.161 in (4.1 mm)

0.4 in (10.16 mm)

No

e0

1.195 in (30.35 mm)

HI7190IP

Renesas Electronics

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

24

0.0015 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.019 in (25.895 mm)

MM74C935N-1

National Semiconductor

Analog To Digital Converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

1

CMOS

Binary

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

TC35094P

Toshiba

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

8

2.1 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T18

0.177 in (4.5 mm)

0.3 in (7.62 mm)

No

e0

0.866 in (22 mm)

TC5091AP

Toshiba

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

6

No

5 V

1

CMOS

8

3 mA

0.3906 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 4 Bits

-40 °C (-40 °F)

Tin Lead

Dual

2 ms

R-PDIP-T28

0.209 in (5.3 mm)

0.6 in (15.24 mm)

No

e0

1.457 in (37 mm)

TDC1048B6C

Raytheon Semiconductor

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

0 mV

20 MHz

1

Bipolar

8

260 mA

0.2 %

5 V

Binary, 2's Complement Binary, Complementary Binary, Complementary 2's Complement

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T28

No

e0

5962-8512701XA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

Bipolar

MIL-STD-883

12

40 mA

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

24 µs

R-CDIP-T28

0.226 in (5.75 mm)

0.6 in (15.24 mm)

Yes

e0

5962-8512702XA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

20 V

1

Bipolar

MIL-STD-883

12

40 mA

0.0122 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

24 µs

R-CDIP-T28

0.226 in (5.75 mm)

0.6 in (15.24 mm)

Yes

e0

5962-8680202VA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Bipolar

MIL-STD-883

10

15 mA

0.098 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

5962-8876401LX

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

CMOS

MIL-STD-883

8

0.1953 %

5 V

Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

2.5 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

Yes

e0

5962-9559201MEA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

100 kHz

1

BICMOS

MIL-STD-883

16

0.0031 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

Yes

e0

5962-9684601QLA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

600 kHz

1

CMOS

MIL-PRF-38535 Class Q

12

0.024 %

5 V

2's Complement Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

1.68 µs

R-GDIP-T24

Yes

e0

5962-9756401QXA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

200 kHz

1

BICMOS

MIL-PRF-38535 Class Q

16

0.0038 %

5 V

2's Complement Binary

5 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

4 µs

R-CDIP-T28

Yes

e0

AD570SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

40 kHz

1

Bipolar

8

15 mA

0.2 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD573SD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

38535Q/M;38534H;883B

10

15 mA

0.1 %

5 V

Binary

5,-12/-15 V

-15 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

30 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD574ASD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

12

40 mA

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

35 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD574ASD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

38535Q/M;38534H;883B

12

40 mA

0.0244 %

15 V

Binary

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

35 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD574ATD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

12

40 mA

0.0244 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

35 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.