Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
5 V |
200 kHz |
1 |
CMOS |
TS 16949 |
10 |
0.0977 % |
5 V |
Binary |
3/5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
3.125 µs |
R-PDIP-T8 |
0.21 in (5.334 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.37 in (9.4 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
14 |
DIP |
Rectangular |
Plastic/Epoxy |
4 |
No |
5.5 V |
31 kHz |
1 |
CMOS |
8 |
1.25 mA |
0.3906 % |
5 V |
Binary |
5 V |
In-Line |
DIP14,.3 |
Analog to Digital Converters |
4.5 V |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Nickel Palladium Gold |
Sample |
Dual |
32 µs |
R-PDIP-T14 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
0.76 in (19.305 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
BICMOS |
12 |
0.0122 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Dual |
15 µs |
R-CDIP-T28 |
0.145 in (3.68 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.41 in (35.815 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.5 V |
16 kHz |
1 |
CMOS |
20 |
0.003 % |
5 V |
Binary, Offset Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDIP-T20 |
0.18 in (4.57 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.965 in (24.51 mm) |
||||||||||||||||
Honeywell |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
14 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5.55 V |
100 kHz |
1 |
SOI-CMOS |
12 |
0.06835 % |
5 V |
Binary |
In-Line |
DIP14,.3 |
0.1 in (2.54 mm) |
225 °C (437 °F) |
-300 mV |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Dual |
11.5 µs |
R-CDIP-T14 |
0.146 in (3.7084 mm) |
0.3 in (7.62 mm) |
0.7 in (17.78 mm) |
||||||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.024 % |
5 V |
Offset Binary, Complementary Offset Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Dual |
3.25 µs |
R-PDIP-T24 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.203 in (30.545 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.024 % |
5 V |
Offset Binary, Complementary Offset Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Dual |
3.25 µs |
R-PDIP-T24 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.203 in (30.545 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Hybrid |
MIL-STD-883 Class B |
12 |
0.012 % |
12 V |
Complementary Binary, Complementary 2's Complement, Complementary Offset Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
10 µs |
R-CDIP-T32 |
0.225 in (5.72 mm) |
0.9 in (22.86 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
5.2 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary |
5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
6 µs |
R-GDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
2.5 V |
1 |
CMOS |
24 |
0.003 % |
5 V |
Binary, Offset Binary |
±5/10 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.199 in (30.45 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
4.096 V |
75 kHz |
1 |
CMOS |
12 |
2.5 mA |
0.0244 % |
5 V |
Binary |
5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
8.5 µs |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0.369 in (9.375 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
4.096 V |
75 kHz |
1 |
CMOS |
12 |
2.5 mA |
0.0244 % |
5 V |
Binary |
5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
8.5 µs |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.369 in (9.375 mm) |
|||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial, Parallel, 8 Bits, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
9 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
|
Renesas Electronics |
Analog To Digital Converter, Successive Approximation |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
BICMOS |
12 |
0.0244 % |
12 V |
Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
75 °C (167 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Gold |
Sample |
Dual |
25 µs |
R-CDIP-T28 |
0.233 in (5.92 mm) |
0.6 in (15.24 mm) |
No |
e4 |
|||||||||||||||||
Thomson Consumer Electronics |
Analog To Digital Converter, Successive Approximation |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
BICMOS |
12 |
0.0244 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
75 °C (167 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Gold |
Sample |
Dual |
25 µs |
R-CDIP-T28 |
0.233 in (5.92 mm) |
0.6 in (15.24 mm) |
No |
e4 |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.25 V |
76 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial, Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
18 µs |
R-PDIP-T24 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
1.203 in (30.545 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.25 V |
76 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
18 µs |
R-PDIP-T24 |
1 |
0.3 in (7.62 mm) |
e3 |
30 s |
260 °C (500 °F) |
1.27 in (32.26 mm) |
||||||||||||
Motorola |
Analog To Digital Converter, Dual-Slope |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
1 |
CMOS |
16 |
7.4 mA |
0.05 % |
5 V |
Binary Coded Decimal |
-5 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.25 in (31.75 mm) |
||||||||||||||||||||
Toshiba |
Analog To Digital Converter, Proprietary Method |
Industrial |
Through-Hole |
42 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5 V |
1 |
CMOS |
13 |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Dual |
41 ms |
R-PDIP-T42 |
0.189 in (4.8 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.094 in (53.2 mm) |
||||||||||||||||||||
Dymec |
Analog To Digital Converter |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
0 mV |
1 |
Hybrid |
20 |
0.02 % |
Binary |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T32 |
No |
e0 |
|||||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.6 V |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Track |
Dual |
0.9 ns |
R-PDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
1.027 in (26.075 mm) |
|||||||||||||||||
Renesas Electronics |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
200 mV |
1 |
Bipolar |
4 |
5 V |
Binary Coded Decimal |
In-Line |
DIP16,.3 |
70 °C (158 °F) |
-200 mV |
Parallel, 4 Bits |
0 °C (32 °F) |
Dual |
R-PDIP-T16 |
|||||||||||||||||||||||||||
|
Broadcom |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
320 mV |
1 |
15 |
0.0916 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-320 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
47 µs |
R-PDIP-T16 |
1 |
0.185 in (4.7 mm) |
0.3 in (7.62 mm) |
No |
e3 |
260 °C (500 °F) |
0.386 in (9.8 mm) |
|||||||||||||||||
Intersil |
Analog To Digital Converter, Successive Approximation |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
12 |
0.0122 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
75 °C (167 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
25 µs |
R-CDIP-T28 |
0.233 in (5.92 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||
Thomson Consumer Electronics |
Analog To Digital Converter, Successive Approximation |
Commercial Extended |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
12 |
0.0122 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
75 °C (167 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
25 µs |
R-CDIP-T28 |
0.233 in (5.92 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||
Renesas Electronics |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3 V |
1 |
BIMOS |
8 |
0.0035 % |
5 V |
Binary |
-5 V |
In-Line |
DIP28,.6 |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-3 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Dual |
133 ns |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.612 in (15.555 mm) |
1.472 in (37.4 mm) |
||||||||||||||||||||
National Semiconductor |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
6.1 V |
1.5 MHz |
1 |
CMOS |
8 |
20 mA |
0.4 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
560 ns |
R-PDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.027 in (26.075 mm) |
|||||||||||||
National Semiconductor |
Analog To Digital Converter, Pulse-Width Modulation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.55 V |
1 |
CMOS |
10 mA |
0.05 % |
Offset Binary |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Dual |
650 ms |
R-PDIP-T28 |
0.21 in (5.334 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.406 in (35.725 mm) |
||||||||||||||||||
National Semiconductor |
Analog To Digital Converter, Pulse-Width Modulation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.55 V |
1 |
CMOS |
10 mA |
0.05 % |
Offset Binary |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Dual |
1.28 s |
R-PDIP-T28 |
0.21 in (5.334 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.406 in (35.725 mm) |
||||||||||||||||||
Intersil |
Analog To Digital Converter, Flash Method |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.5 V |
20 MHz |
1 |
CMOS |
8 |
0.5078 % |
5 V |
Binary |
5 V |
In-Line |
DIP24,.4 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
75 °C (167 °F) |
500 mV |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Tin Lead |
Sample |
Dual |
50 ns |
R-PDIP-T24 |
0.161 in (4.1 mm) |
0.4 in (10.16 mm) |
No |
e0 |
1.195 in (30.35 mm) |
||||||||||||||
Renesas Electronics |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
24 |
0.0015 % |
5 V |
Binary, Offset Binary, 2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.019 in (25.895 mm) |
|||||||||||||||||
National Semiconductor |
Analog To Digital Converter |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
1 |
CMOS |
Binary |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
Dual |
R-PDIP-T28 |
No |
e0 |
|||||||||||||||||||||||||||
Toshiba |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
8 |
2.1 mA |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T18 |
0.177 in (4.5 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.866 in (22 mm) |
||||||||||||||||||||
Toshiba |
Analog To Digital Converter, Proprietary Method |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
6 |
No |
5 V |
1 |
CMOS |
8 |
3 mA |
0.3906 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 4 Bits |
-40 °C (-40 °F) |
Tin Lead |
Dual |
2 ms |
R-PDIP-T28 |
0.209 in (5.3 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.457 in (37 mm) |
||||||||||||||||||
Raytheon Semiconductor |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
0 mV |
20 MHz |
1 |
Bipolar |
8 |
260 mA |
0.2 % |
5 V |
Binary, 2's Complement Binary, Complementary Binary, Complementary 2's Complement |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-2 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
20 V |
1 |
Bipolar |
MIL-STD-883 |
12 |
40 mA |
0.0122 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
24 µs |
R-CDIP-T28 |
0.226 in (5.75 mm) |
0.6 in (15.24 mm) |
Yes |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
20 V |
1 |
Bipolar |
MIL-STD-883 |
12 |
40 mA |
0.0122 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
24 µs |
R-CDIP-T28 |
0.226 in (5.75 mm) |
0.6 in (15.24 mm) |
Yes |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1 |
Bipolar |
MIL-STD-883 |
10 |
15 mA |
0.098 % |
5 V |
Binary |
5,-15 V |
-15 V |
In-Line |
DIP18,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
40 µs |
R-CDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
100 kHz |
1 |
BICMOS |
MIL-STD-883 |
16 |
0.0031 % |
12 V |
Binary |
5,±12 V |
-12 V |
In-Line |
DIP16,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
Yes |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
600 kHz |
1 |
CMOS |
MIL-PRF-38535 Class Q |
12 |
0.024 % |
5 V |
2's Complement Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
1.68 µs |
R-GDIP-T24 |
Yes |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
200 kHz |
1 |
BICMOS |
MIL-PRF-38535 Class Q |
16 |
0.0038 % |
5 V |
2's Complement Binary |
5 V |
In-Line |
DIP28,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
4 µs |
R-CDIP-T28 |
Yes |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
40 kHz |
1 |
Bipolar |
8 |
15 mA |
0.2 % |
5 V |
Binary, Offset Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP18,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
40 µs |
R-CDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
10 |
15 mA |
0.1 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
30 µs |
R-CDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
12 |
40 mA |
0.0244 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
35 µs |
R-CDIP-T28 |
0.145 in (3.68 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.41 in (35.815 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
12 |
40 mA |
0.0244 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
35 µs |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
12 |
40 mA |
0.0244 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
35 µs |
R-CDIP-T28 |
0.145 in (3.68 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.41 in (35.815 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.