Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3.35 V |
1 |
CMOS |
TS 16949 |
1.8 mA |
9 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
2.4 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T40 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
2.046 in (51.97 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
BICMOS |
12 |
0.0244 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Dual |
15 µs |
R-CDIP-T28 |
0.145 in (3.68 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.41 in (35.815 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
10 V |
1 |
CMOS |
24 |
0.003 % |
5 V |
Binary, Offset Binary |
5,10 V |
-5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.199 in (30.45 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
12 |
140 mA |
0.012 % |
15 V |
Complementary Offset Binary, Complementary Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial, Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Dual |
10 µs |
R-CDIP-T32 |
0.23 in (5.84 mm) |
0.9 in (22.86 mm) |
No |
e0 |
1.612 in (40.945 mm) |
||||||||||||||||||
Renesas Electronics |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
BICMOS |
MIL-STD-883 |
12 |
0.0244 % |
12 V |
Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
15 µs |
R-CDIP-T28 |
0.233 in (5.92 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Other |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3.5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-3.5 V |
Parallel, Word |
-20 °C (-4 °F) |
Tin/Lead |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
2.05 in (52.075 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
16 |
120 μA |
0.0015 % |
9 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
245 °C (473 °F) |
2.05 in (52.075 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
16 |
120 μA |
0.0015 % |
9 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
2.05 in (52.07 mm) |
|||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3.35 V |
1 |
CMOS |
TS 16949 |
1.8 mA |
5 V |
Binary |
15 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
2.7 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T40 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
2.038 in (51.753 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
11 |
No |
5.5 V |
66 kHz |
1 |
CMOS |
12 |
2.5 mA |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
4.5 V |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Nickel Palladium Gold |
Sample |
Dual |
10 µs |
R-PDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e4 |
1 in (25.4 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
111 kHz |
1 |
BICMOS |
12 |
18 mA |
0.0244 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
10 µs |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.472 in (37.4 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
800 mV |
1 |
CMOS |
19 |
0.0018 % |
5 V |
Binary |
3/5,5 V |
In-Line |
DIP24,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.199 in (30.45 mm) |
||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
16 |
0.0015 % |
9 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
2.05 in (52.07 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
16 |
0.0015 % |
9 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.05 in (52.07 mm) |
||||||||||||||||
Intersil |
Analog To Digital Converter |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
0.05 % |
5 V |
7-Segment |
±5 V |
-5 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T40 |
No |
e0 |
||||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
2.5 V |
100 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary |
5,-12/-15 V |
-12 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
245 °C (473 °F) |
2.05 in (52.075 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
2.5 V |
100 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary |
5,-12/-15 V |
-12 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
10 µs |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
2.05 in (52.07 mm) |
||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
100 mV |
75 MHz |
1 |
Bipolar |
MIL-STD-883 |
8 |
0.3906 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
No |
e0 |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
100 kHz |
1 |
BICMOS |
MIL-STD-883 |
16 |
12 V |
2's Complement Binary |
-12 V |
In-Line |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
1 ms |
R-PDIP-T28 |
No |
e3 |
|||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
6.35 V |
1 |
Bipolar |
8 |
5 V |
Binary |
5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-50 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
32 µs |
R-PDIP-T8 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.378 in (9.59 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
10 |
15 mA |
0.1 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
30 µs |
R-CDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
8 |
15 mA |
0.2 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
30 µs |
R-CDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
17 V |
1 |
CMOS |
8 |
8 mA |
0.731 % |
5 V |
Binary, Offset Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-17 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.472 in (37.4 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
2.5 V |
1 |
CMOS |
24 |
0.003 % |
5 V |
Binary, Offset Binary |
±5/10 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
0.18 in (4.57 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.165 in (29.59 mm) |
|||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Dual-Slope |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
200 mV |
1 |
CMOS |
3 |
0.05 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.255 in (31.88 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
1 |
No |
20 V |
1 |
MIL-PRF-38535 |
12 |
0.0122 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
24 µs |
R-CDIP-T28 |
0.226 in (5.75 mm) |
0.6 in (15.24 mm) |
Yes |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
2.5 V |
1 |
CMOS |
24 |
0.003 % |
5 V |
Binary, Offset Binary |
±5/10 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
16 |
0.0015 % |
9 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.05 in (52.07 mm) |
|||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
16 |
0.0015 % |
9 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
2.05 in (52.07 mm) |
||||||||||||||
|
Linear Technology |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.048 V |
200 kHz |
1 |
CMOS |
14 |
0.0076 % |
5 V |
Binary, 2's Complement Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-2.048 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
4 µs |
R-PDIP-T28 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
2.048 V |
133 kHz |
1 |
CMOS |
12 |
2.5 mA |
0.0122 % |
5 V |
Binary, 2's Complement Binary |
5/±5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.048 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
1.03 in (26.16 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
2.048 V |
133 kHz |
1 |
CMOS |
12 |
2.5 mA |
0.0122 % |
5 V |
Binary, 2's Complement Binary |
5/±5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.048 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
10 µs |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.03 in (26.16 mm) |
||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
128 kHz |
1 |
BICMOS |
14 |
34 mA |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
6.3 µs |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.473 in (37.425 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
1.25 V |
1 |
CMOS |
16 |
0.0015 % |
3 V |
Binary, Offset Binary |
3/5,3 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T16 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.79 in (20.07 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.05 V |
12.5 kHz |
1 |
CMOS |
12 |
500 μA |
0.0488 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
||||||||||||||
Texas Instruments |
Analog To Digital Converter |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
9 V |
7-Segment |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-PDIP-T40 |
No |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
1 |
No |
20 V |
1 |
Bipolar |
MIL-PRF-38535 |
12 |
0.0122 % |
15 V |
Binary |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
24 µs |
R-CDIP-T28 |
0.226 in (5.75 mm) |
0.6 in (15.24 mm) |
Yes |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Hybrid |
16 |
0.003 % |
15 V |
Binary, Complementary Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Gold |
Sample |
Dual |
10 µs |
R-CDIP-T32 |
0.225 in (5.72 mm) |
0.9 in (22.86 mm) |
No |
e4 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
4 |
No |
5 V |
100 kHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
2.4 µs |
R-PDIP-T24 |
0.18 in (4.57 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.165 in (29.59 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5 V |
50 kHz |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
2.4 µs |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.472 in (37.4 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
500 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
1.68 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
6.1 V |
10 kHz |
1 |
CMOS |
8 |
0.293 % |
5 V |
Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
116 µs |
R-PDIP-T28 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.43 in (36.32 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.05 V |
12.5 kHz |
1 |
CMOS |
12 |
500 μA |
0.0488 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
5.05 V |
11.1 kHz |
1 |
CMOS |
12 |
640 μA |
0.0488 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-50 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Multi-Slope |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
6 V |
1 |
CMOS |
18 |
125 μA |
0.006 % |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-9 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
245 °C (473 °F) |
1.25 in (31.75 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Multi-Slope |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
6 V |
1 |
CMOS |
18 |
125 μA |
0.006 % |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-9 V |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.25 in (31.75 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 V |
10 MHz |
1 |
BICMOS |
MIL-STD-883 |
12 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3 V |
400 kHz |
1 |
CMOS |
10 |
0.0977 % |
3 V |
Binary |
3/5 V |
In-Line |
DIP16,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
105 °C (221 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
2.3 µs |
R-PDIP-T16 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.793 in (20.13 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.