Maxim Integrated Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MX7820KP

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

1

Yes

5.1 V

1

CMOS

8

5 V

Binary

5 V

Chip Carrier

LDCC20,.4SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Quad

2 µs

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

0.353 in (8.965 mm)

MX7572KCWG12+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

1

CMOS

12

12 mA

0.024 %

5 V

Offset Binary, Complementary Offset Binary

5,-15 V

-15 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Dual

13 s

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.606 in (15.4 mm)

MX7821TQ

Maxim Integrated

Analog To Digital Converter, Flash Method

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

CMOS

8

5 V

Binary

5,GND/-5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

400 ns

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

MAX130CPL

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

2 V

1

CMOS

16

400 μA

0.0015 %

9 V

Binary

9 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

200 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

2.05 in (52.075 mm)

MAX1156ACUP-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

135 kHz

1

BICMOS

14

0.0061 %

5 V

Binary

3/5,5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

4.7 µs

R-PDSO-G20

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

0.256 in (6.5 mm)

MAX149AEPP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

1.25 V

133 kHz

1

CMOS

10

0.0488 %

3 V

Binary, 2's Complement Binary

3/5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Tin Lead

Sample

Dual

65 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.03 in (26.16 mm)

MAX1306ECM+T

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

2

Yes

5 V

901 kHz

1

BICMOS

12

0.0244 %

5 V

Offset Binary

3,5 V

Flatpack, Low Profile, Fine Pitch

TQFP48,.35SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin

Track

Quad

900 ns

S-PQFP-G48

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

MAX1396MUB

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

2

Yes

3.65 V

312.5 kHz

1

BICMOS

12

0.0244 %

1.6 V

Binary, 2's Complement Binary

1.8/3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

MAX110BEAP-T

Maxim Integrated

Analog To Digital Converter, Delta-Sigma

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

2

Yes

1.5 V

1.25 MHz

1

14

0.08 %

5 V

2's Complement Binary

±5 V

-5 V

Small Outline, Shrink Pitch

SSOP20,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-1.5 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

20 ms

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

0.283 in (7.2 mm)

MAX1121EGK-TD

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

68

HVQCCN

Square

1

Yes

1.375 V

250 MHz

1

8

0.2344 %

1.8 V

Binary, Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

1.1 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-XQCC-N68

3

0.035 in (0.9 mm)

0.394 in (10 mm)

No

e0

0.394 in (10 mm)

MAX574ALEPI

Maxim Integrated

MAX11120ATI+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Square

4

Yes

3.65 V

1 MHz

1

8

2.5 μA

0.05859375 %

3 V

2's Complement Binary

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-300 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MAX1169BCUD+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

4.136 V

58.6 kHz

1

BICMOS

16

0.0031 %

5 V

Binary

3/5,5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Track

Dual

6 µs

R-PDSO-G14

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

MX7581JN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5 V

1

CMOS

8

0.7324 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

1.45 in (36.83 mm)

MAX161AMJI

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

5 V

1

CMOS

8

0.7324 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

MX7820LN

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

1

No

5.1 V

1

CMOS

8

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-100 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

2 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

MAX1182ECM-TD

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

2

Yes

1 V

65 MHz

1

CMOS

10

0.2148 %

3 V

Offset Binary, 2's Complement Binary

1.8/3.3,3/3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G48

1

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

MAX1142BCAP-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

1

Yes

12 V

200 kHz

1

BICMOS

14

0.0122 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline, Shrink Pitch

SSOP20,.3

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

-12 V

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

240 µs

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

0.283 in (7.2 mm)

MAX117EPI

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

3 V

400 kHz

1

CMOS

8

6 mA

3.6 V

Binary

3.3 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

2.4 µs

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

MX574ALEWI+TCDR

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

BICMOS

12

0.0122 %

15 V

Offset Binary

-15 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

25 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

MAX113CNG-T

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

4

No

3 V

400 kHz

1

CMOS

8

5 mA

3.6 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

2 µs

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

MAX1418ETN

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

56

HVQCCN

Square

1

Yes

2.56 V

65 MHz

1

15

5 V

2's Complement Binary

2.5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

15 ns

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e0

245 °C (473 °F)

0.315 in (8 mm)

MAX174BEWI

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

BICMOS

12

10 mA

0.012 %

15 V

Binary, Offset Binary

5,±12/±15 V

-15 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

8 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.705 in (17.9 mm)

MAX178AEWG-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

1

12

10 mA

0.024 %

15 V

Binary, Offset Binary

±5,15 V

-15 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

140 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

MAX177EWG-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

1

CMOS

10

0.05 %

5 V

Binary

5,-12/-15 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-2.5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

8.57 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.606 in (15.4 mm)

MX7572LN05-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

12 mA

0.012 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

5.2 s

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

MAX1271BENG-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

4.096 V

110 kHz

1

12

0.0244 %

5 V

Binary, 2's Complement Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-4.096 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

11 µs

R-PDIP-T24

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

ICL7106C/D

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Commercial

No Lead

40

DIE

Rectangular

1

Yes

2 V

1

CMOS

3

0.05 %

9 V

Binary

9 V

0 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N40

1

No

e0

MX7574SQ/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

MIL-STD-883

8

5 V

Binary, Offset Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX12527ETK

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

68

HVQCCN

Square

2

Yes

1.024 V

65 MHz

1

CMOS

12

0.0269 %

3.3 V

2's Complement Binary

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC68,.4SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

15.4 ns

S-XQCC-N68

3

0.031 in (0.8 mm)

0.394 in (10 mm)

No

e0

245 °C (473 °F)

0.394 in (10 mm)

MAX172ACWG

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

5,-12/-15 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

10.4 µs

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.606 in (15.4 mm)

MAX1277AETC-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

12

HVQCCN

Square

1

Yes

2.058 V

1.5 MHz

1

BICMOS

12

0.0244 %

3 V

Binary

3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC12,.16SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Quad

667 ns

S-XQCC-N12

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e0

0.157 in (4 mm)

MAX133EPL

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

3.3 V

1

Bipolar

4

1 %

5 V

9's Complement Binary Coded Decimal

9 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

2.8 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

2.05 in (52.075 mm)

5962-9169102M3A

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

2

Yes

4.5 V

1

CMOS

MIL-STD-883

16

0.003 %

5 V

Binary, 2's Complement Binary

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-4.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Quad

8.13 µs

S-CQCC-N28

0.098 in (2.49 mm)

0.452 in (11.49 mm)

No

e0

30 s

240 °C (464 °F)

0.452 in (11.49 mm)

MAX1231AEEG

Maxim Integrated

Analog To Digital Converter

Industrial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

1

BICMOS

12

0.024 %

Offset Binary

3/3.3 V

Small Outline, Shrink Pitch

SSOP24,.24

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

No

e0

MAX180ACPL

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

8

No

2.5 V

100 kHz

1

12

0.0244 %

5 V

Binary

5,-12/-15 V

-12 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

10 µs

R-PDIP-T40

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

245 °C (473 °F)

2.05 in (52.075 mm)

MAX1200BEMH

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

4.096 V

1 MHz

1

CMOS

16

5 V

Offset Binary, 2's Complement Binary, 1's Complement Binary

3/5,5 V

Flatpack

QFP44,.5SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-4.096 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

3.906 µs

S-PQFP-G44

1

0.094 in (2.388 mm)

0.394 in (10.0075 mm)

No

e0

245 °C (473 °F)

0.394 in (10.0075 mm)

MAX161BEPI+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary, Complementary Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

30 s

260 °C (500 °F)

1.45 in (36.83 mm)

MAX110BMJE

Maxim Integrated

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

1.5 V

1.25 MHz

1

14

0.1 %

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.5 V

Serial

-55 °C (-67 °F)

Tin/Lead

Dual

20 ms

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

MAX1202BEAP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

8

Yes

2.048 V

133 kHz

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

3/5,5,GND/-5 V

-5 V

Small Outline, Shrink Pitch

SSOP20,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-2.048 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10 µs

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

245 °C (473 °F)

0.283 in (7.2 mm)

MAX1180ECM

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

HTFQFP

Square

Plastic/Epoxy

2

Yes

1 V

105 MHz

1

CMOS

10

0.2441 %

3.3 V

Offset Binary, 2's Complement Binary

1.8/3.3,3/3.3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP48,.35SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G48

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

ICL7129ACQH-TD

Maxim Integrated

Analog To Digital Converter, Dual-Slope

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

1

Yes

2 V

1

CMOS

4

9 V

Binary

9 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Quad

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

0.653 in (16.585 mm)

MAX1037MEKA+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

4

Yes

1.024 V

188 kHz

1

BICMOS

8

0.3906 %

3 V

Binary, 2's Complement Binary

Small Outline, Low Profile, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

-1.024 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

6.1 µs

R-PDSO-G8

0.057 in (1.45 mm)

0.064 in (1.625 mm)

No

e3

0.114 in (2.9 mm)

MAX1069CCUD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

4.096 V

58.6 kHz

1

BICMOS

14

0.0183 %

5 V

Binary

3/5,5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

6 µs

R-PDSO-G14

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

0.197 in (5 mm)

MX574ATQ/HR

Maxim Integrated

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

BICMOS

MIL-STD-883 Class B (Modified)

12

0.018 %

Binary, Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

MAX1267BEEG+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

256 kHz

1

12

0.0244 %

3 V

Binary

3/3.3 V

Small Outline, Shrink Pitch

SSOP24,.24

Analog to Digital Converters

0.025 in (0.635 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Track

Dual

4.1 µs

R-PDSO-G24

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e3

0.341 in (8.65 mm)

MAX160CC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

18

DIE

Rectangular

1

Yes

10 V

1

CMOS

8

0.1953 %

5 V

Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Upper

4 µs

R-XUUC-N18

1

No

MAX1189CEUI-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

135 kHz

1

BICMOS

16

0.0061 %

5 V

Offset Binary

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

4.7 µs

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

0.382 in (9.7 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.