Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
135 kHz |
1 |
BICMOS |
16 |
0.0031 % |
5 V |
Offset Binary |
3/5,5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
4.7 µs |
R-PDSO-G20 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0.256 in (6.5 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
12 |
Yes |
2.048 V |
94.4 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP16,.25 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-2.048 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
7.5 µs |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0.193 in (4.9 mm) |
|||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.55 V |
1 |
CMOS |
8 |
0.1953 % |
3 V |
Binary |
3/3.3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
35 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2.5 V |
400 kHz |
1 |
BICMOS |
10 |
0.0488 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
1.024 V |
50 MHz |
1 |
CMOS |
8 |
0.1953 % |
5.5 V |
Binary, 2's Complement Binary |
3/5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.024 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
55 µs |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.03 in (26.16 mm) |
||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
135 kHz |
1 |
BICMOS |
16 |
0.0061 % |
5 V |
Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
4.7 µs |
R-PDSO-G20 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.256 in (6.5 mm) |
||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5 V |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary, Offset Binary, Complementary Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T28 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.45 in (36.83 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
100 |
HTFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1.625 V |
125 MHz |
2 |
12 |
0.0488 % |
1.8 V |
Binary, Offset Binary, 2's Complement Binary |
1.8 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G100 |
3 |
0.047 in (1.2 mm) |
0.551 in (14 mm) |
No |
e0 |
0.551 in (14 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
1.525 V |
250 kHz |
1 |
12 |
0.0122 % |
3 V |
Binary, 2's Complement Binary |
3/3.3 V |
Small Outline, Shrink Pitch |
SSOP24,.24 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-1.525 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
4.1 µs |
R-PDSO-G24 |
1 |
0.068 in (1.73 mm) |
0.154 in (3.9 mm) |
No |
e0 |
245 °C (473 °F) |
0.341 in (8.65 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
32 |
LQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.2 V |
1 |
BICMOS |
3.3 V |
2's Complement Binary |
3/5 V |
Flatpack, Low Profile |
QFP32,.35SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
-2.2 V |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G32 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
68 |
HVQCCN |
Square |
1 |
Yes |
1.375 V |
170 MHz |
1 |
10 |
0.1465 % |
1.8 V |
Binary, Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC68,.4SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1.1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-XQCC-N68 |
1 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
No |
e0 |
0.394 in (10 mm) |
||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Ceramic, Glass-Sealed |
4 |
No |
5.25 V |
1 |
CMOS |
8 |
5 V |
Complementary Offset Binary |
In-Line |
DIP24(UNSPEC) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin/Lead |
Track |
Dual |
2.8 µs |
1 |
No |
e0 |
|||||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1.75 V |
38.4 kHz |
1 |
BICMOS |
16 |
0.003 % |
3 V |
Binary, Offset Binary |
3/5 V |
Small Outline |
SOP16,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-1 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
R-PDSO-G16 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.406 in (10.3 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.5 V |
1 MHz |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary |
5,GND/-5 V |
-5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
875 ns |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
245 °C (473 °F) |
0.504 in (12.8 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3.6 V |
400 kHz |
1 |
8 |
3.3 V |
Binary |
3/±3 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-3.6 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
2.3 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.504 in (12.8 mm) |
|||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
2 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
Small Outline |
SOP16,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
5.6 µs |
R-PDSO-G16 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
245 °C (473 °F) |
0.406 in (10.3 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
10 V |
110 kHz |
1 |
12 |
0.0122 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Track |
Dual |
11 µs |
R-PDSO-G28 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
0.402 in (10.2 mm) |
|||||||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
135 kHz |
1 |
BICMOS |
16 |
0.0031 % |
5 V |
Offset Binary |
3/5,5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
4.7 µs |
R-PDSO-G20 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.256 in (6.5 mm) |
||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Other |
Gull Wing |
80 |
QFP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
0 mV |
750 MHz |
1 |
CMOS |
8 |
1.2 A |
0.5859 % |
Binary |
-5.2 V |
-5.2 V |
Flatpack |
QFP80,.7X.9,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Tin Lead |
Quad |
R-PQFP-G80 |
0.134 in (3.4 mm) |
0.551 in (14 mm) |
No |
e0 |
0.787 in (20 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
135 kHz |
1 |
BICMOS |
14 |
0.0061 % |
5 V |
Offset Binary |
3/5,5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
4.7 µs |
R-PDSO-G20 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0.256 in (6.5 mm) |
|||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
20 |
HVQCCN |
Square |
1 |
Yes |
3.6 V |
1.6 MHz |
1 |
CMOS |
18 |
0.0008 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-XQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
4.096 V |
165 kHz |
1 |
BICMOS |
16 |
0.0031 % |
5 V |
Binary |
3/5,5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
4.7 µs |
R-PDSO-G20 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e3 |
0.256 in (6.5 mm) |
||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
8 |
No |
2.5 V |
100 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary |
5,-12/-15 V |
-12 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2.5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-GDIP-T40 |
1 |
0.232 in (5.89 mm) |
0.6 in (15.24 mm) |
No |
e0 |
245 °C (473 °F) |
2.05 in (52.07 mm) |
||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.5 V |
1 |
CMOS |
10 |
0.05 % |
5 V |
Binary |
5,-12/-15 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
8.57 µs |
R-PDIP-T24 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
1.203 in (30.545 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
Small Outline |
SOP16,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Dual |
5.6 µs |
R-PDSO-G16 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0.406 in (10.3 mm) |
||||||||||||
Maxim Integrated |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
2 |
No |
1.5 V |
1.25 MHz |
1 |
14 |
0.06 % |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP16,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-1.5 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Dual |
20 ms |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.755 in (19.175 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
1 |
CMOS |
10 |
0.05 % |
5 V |
Binary |
5,-12/-15 V |
-12 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Dual |
5.2 µs |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
68 |
HVQCCN |
Square |
1 |
Yes |
1.51 V |
125 MHz |
1 |
12 |
0.061 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC68,.4SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1.3 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-XQCC-N68 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
No |
e3 |
0.394 in (10 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
Binary, Offset Binary |
5,-12/-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
8.13 µs |
R-GDIP-T24 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3.3 V |
1 |
Bipolar |
4 |
1 % |
5 V |
9's Complement Binary Coded Decimal |
9 V |
-5 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
2.8 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
245 °C (473 °F) |
2.05 in (52.075 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
-1.024 V |
60 MHz |
1 |
12 |
3.3 V |
Offset Binary |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1.024 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
245 °C (473 °F) |
0.276 in (7 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
2 |
Yes |
5 V |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary |
5,-12 V |
-12 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Quad |
10.4 µs |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
0.453 in (11.505 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2.46 V |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Offset Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
15 µs |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.965 mm) |
No |
e0 |
0.353 in (8.965 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
5 |
Yes |
5 V |
1 |
BICMOS |
10 |
0.0977 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-5 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
1.1 ms |
R-PDSO-G16 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e0 |
0.244 in (6.2 mm) |
|||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
4.096 V |
75 kHz |
1 |
CMOS |
12 |
2 mA |
0.0122 % |
5 V |
Binary |
5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
8.5 µs |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.369 in (9.375 mm) |
|||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.525 V |
400 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP24,.24 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-2.525 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
4 µs |
R-PDSO-G24 |
1 |
0.068 in (1.73 mm) |
0.154 in (3.9 mm) |
No |
e0 |
245 °C (473 °F) |
0.341 in (8.65 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
135 kHz |
1 |
BICMOS |
16 |
0.0031 % |
5 V |
Offset Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
4.7 µs |
R-PDSO-G28 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0.382 in (9.7 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter |
Industrial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
16 |
Yes |
2.65 V |
300 kHz |
1 |
BICMOS |
10 |
0.0977 % |
5 V |
2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP24,.24 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-500 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
R-PDSO-G24 |
1 |
0.069 in (1.75 mm) |
0.153 in (3.89 mm) |
No |
e0 |
0.34 in (8.64 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5,-12/-15 V |
-15 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
5.6 µs |
R-PDIP-T8 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0.369 in (9.375 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.048 V |
133 kHz |
1 |
CMOS |
12 |
2.5 mA |
0.0183 % |
5 V |
Binary, 2's Complement Binary |
5/±5 V |
-5 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-2.048 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-PDSO-G20 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e0 |
245 °C (473 °F) |
0.283 in (7.2 mm) |
||||||||||
|
Maxim Integrated |
Analog To Digital Converter |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
0.05 % |
9 V |
Binary |
9 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
e3 |
30 s |
260 °C (500 °F) |
2.05 in (52.075 mm) |
|||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
8 |
Yes |
2.5 V |
100 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary |
5,-12/-15 V |
-12 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
10 µs |
S-PQCC-J44 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e3 |
0.653 in (16.585 mm) |
|||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
2 |
Yes |
3.65 V |
416 kHz |
1 |
BICMOS |
8 |
0.0781 % |
1.6 V |
Binary, 2's Complement Binary |
1.8/3.3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.12,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
1.8 µs |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
5 V |
1 |
12 |
15 V |
Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
0.232 in (5.89 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
22 |
DIE |
Rectangular |
1 |
Yes |
5 V |
1 |
CMOS |
12 |
5 V |
Binary |
±5,15 V |
-5 V |
Uncased Chip |
DIE OR CHIP |
Analog to Digital Converters |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Upper |
150 µs |
R-XUUC-N22 |
1 |
No |
e0 |
||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3.3 V |
1 |
Bipolar |
4 |
1 % |
5 V |
9's Complement Binary Coded Decimal |
9 V |
-5 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
2.8 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
245 °C (473 °F) |
2.05 in (52.075 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
8 |
Yes |
2.5 V |
100 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary |
5,-12/-15 V |
-12 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
10 µs |
S-PQCC-J44 |
1 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e0 |
0.653 in (16.585 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.