18 Digital-to-Analog Converters 462

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC7541AJUG4

Texas Instruments

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDSO-G18

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e4

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

Binary

TL5602CN

Texas Instruments

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

5.015 V

No

1

Bipolar

8

75 mA

0.2 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

4.985 V

0.885 in (22.48 mm)

Binary

TL5602

Texas Instruments

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

8

0 ns

75 mA

0.2 %

Parallel, 8 Bits

5 V

In-Line

33 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Offset Binary

AD371S0

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

12

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

25 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T18

0.21 in (5.334 mm)

0.3 in (7.62 mm)

No

0 V

0.992 in (25.197 mm)

Binary

DAC8228GBC

Analog Devices

Digital to Analog converter

No Lead

18

DIE

5 V

Yes

1

CMOS

8

0.391 %

Parallel, 8 Bits

12 V

Uncased Chip

2 µs

Tin Lead

Upper

X-XUUC-N18

No

e0

0 V

Binary

DAC06BX

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

Bipolar

10

0.3 %

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary

AD7521JD

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.2 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

DAC210N

Analog Devices

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

10 V

Yes

1

Bipolar

11

0.05 %

Parallel, Word

15 V

-15 V

Uncased Chip

1.5 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

-10 V

Binary

DAC-89N

Analog Devices

Digital to Analog converter

Other

No Lead

18

DIE

Rectangular

18 V

Yes

1

8

12 mA

Parallel, Word

15 V

-15 V

Uncased Chip

500 ns

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

-5 V

Signed Binary

AD7541AKR-REEL

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.455 in (11.55 mm)

Binary, Offset Binary

5962-01-208-2360

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

DAC210EX

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

Bipolar

11

12 mA

0.05 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP18,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary

PM7541BX/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

5962-01-168-7578

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

DAC02CCX

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

11.5 V

No

1

Bipolar

10

10 mA

0.2 %

Parallel, Word

15 V

-15 V

In-Line

2 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

10 V

Binary

5962-01-309-9723

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

AD7224KN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

8

20 µs

6 mA

0.391 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.885 in (22.479 mm)

Binary

5962-8948101VB

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

Parallel, Word

In-Line

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

PM7541HP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T18

No

e0

Binary, Offset Binary

AD370JD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

12

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

DIP18,.3

Other Converters

25 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T18

0.21 in (5.334 mm)

0.3 in (7.62 mm)

No

e0

-10 V

0.992 in (25.197 mm)

Binary

AD7541AGTD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7531KD

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T18

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

Binary

DAC10GSZ-REEL

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

Bipolar

10

0 ns

15 mA

0.0977 %

Parallel, Word

15 V

±15 V

-15 V

Small Outline

SOP18,.4

Other Converters

85 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

-5.5 V

0.455 in (11.55 mm)

Binary, Offset Binary

DAC-89EX

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

8

12 mA

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Signed Binary

A0370S0/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

12

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

25 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T18

0.21 in (5.334 mm)

0.3 in (7.62 mm)

No

-10 V

0.992 in (25.197 mm)

Binary

DAC10G

Analog Devices

Digital to Analog converter

No Lead

18

DIE

Rectangular

18 V

Yes

1

10

15 mA

0.098 %

Parallel, Word

15 V

-15 V

Uncased Chip

85 ns

Tin Lead

Upper

R-XUUC-N18

No

e0

-18 V

Binary, Offset Binary

AD7224UQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

BICMOS

8

20 µs

6 mA

0.195 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

5962-01-086-1670

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

0.2 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T18

No

Binary, Offset Binary

PM7541AGP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

15 V

No

2

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.885 in (22.48 mm)

Binary, Offset Binary

LTC7541AKSW

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

Small Outline

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

20 s

235 °C (455 °F)

0.455 in (11.55 mm)

Binary, Offset Binary

DAC888EX

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

Bipolar

8

0 ns

0.1 %

Parallel, 8 Bits

5 V

5,-12 V

-12 V

In-Line

DIP18,.3

Other Converters

300 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

DAC8228BC

Analog Devices

Digital to Analog converter

No Lead

18

DIE

Rectangular

15 V

Yes

1

8

5 µs

7 mA

0.391 %

Parallel, 8 Bits

15 V

Uncased Chip

2 µs

Tin Lead

Upper

R-XUUC-N18

No

e0

0 V

Binary

AD7541TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883 Class B

12

1 µs

2 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T18

No

e0

Binary, Offset Binary

DAC331B-12-1

Analog Devices

Digital to Analog converter

Military

Pin/Peg

18

DIP

Rectangular

Metal

No

1

Bipolar

38535Q/M;38534H;883B

12

3 µs

1 mA

0.012 %

Parallel, Word

5 V

5 V

In-Line

DIP18,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-P18

0.234 in (5.9436 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

DAC210FX

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

Bipolar

11

12 mA

0.05 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP18,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary

AD7224UQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

BICMOS

MIL-STD-883 Class B

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

5962-01-130-2429

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

500 ns

2 mA

0.2 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

DAC10GPZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

1

10

0.0977 %

Parallel, Word

15 V

-15 V

In-Line

85 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

-5.5 V

0.885 in (22.48 mm)

Binary, Offset Binary

AD7521UQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.05 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7541TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883 Class B

12

1 µs

2 mA

0.0122 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

1 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.96 in (24.38 mm)

Binary

LTC7541AKSW#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

Small Outline

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

Binary, Offset Binary

LTC7541AKN#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

In-Line

600 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T18

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

Binary, Offset Binary

DAC06FX

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

Bipolar

10

0.3 %

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary

PM7224FX

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

12.5 V

No

1

CMOS

8

5 µs

6 mA

0.391 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary

AD7224LR-18REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

8

6 mA

0.1953 %

Parallel, 8 Bits

15 V

-5 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.455 in (11.55 mm)

Binary

5962-01-346-7328

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

DAC10NBC

Analog Devices

Digital to Analog converter

Other

No Lead

18

DIE

Rectangular

10 V

Yes

1

Bipolar

10

15 mA

0.0488 %

Parallel, Word

15 V

±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

85 ns

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

-5 V

Binary, Offset Binary

5962-01-201-2469

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.