18 Digital-to-Analog Converters 462

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD371SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary

AD7531KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

0.18 in (4.58 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

Binary

AD7224TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

8

5 µs

6 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary

5962-01-123-1912

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

500 ns

2 mA

0.2 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

AD371JD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

12

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

DIP18,.3

Other Converters

25 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T18

0.21 in (5.334 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.992 in (25.197 mm)

Binary

5962-8948102VC

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

Parallel, Word

In-Line

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7240KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

900 ns

2 mA

-0.0488 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

550 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

0.18 in (4.58 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

Binary

DAC-86CX

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

8

9.3 mA

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP18,.3

Other Converters

1 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

5962-8948101VA

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

Parallel, Word

In-Line

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

5962-01-151-7423

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

5962-8948103VA

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

10 V

No

1

CMOS

MIL-STD-883

12

0.0244 %

Parallel, Word

15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary

AD7541ATD

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7541ASQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

2 mA

0.024 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

PM7224EP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

8

5 µs

6 mA

0.2 %

12/15, GND/-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDIP-T18

No

e0

Binary

AD7541TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

1 µs

2 mA

0.0122 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.96 in (24.38 mm)

Binary, Offset Binary

AD7224LRZ-18

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

8

6 mA

0.1953 %

Parallel, 8 Bits

15 V

-5 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

0.455 in (11.55 mm)

Binary

DAC02N

Analog Devices

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

11.5 V

Yes

1

Bipolar

10

0.1 %

Parallel, Word

15 V

-15 V

Uncased Chip

2 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

Binary

LTC7541AJSW#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

Small Outline

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

Binary, Offset Binary

PM7541AAX

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

15 V

No

2

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, Offset Binary

5962-01-109-8730

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

Bipolar

10

0.3 %

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

AD7224KNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

8

20 µs

6 mA

0.391 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.885 in (22.479 mm)

Binary

AD371KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

12

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

DIP18,.3

Other Converters

25 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T18

0.21 in (5.334 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.992 in (25.197 mm)

Binary

5962-9090801MVX

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

0.3906 %

Parallel, 8 Bits

15 V

-5 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T18

Yes

Binary

PM7541ABX/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

DAC10GX

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

5.5 V

No

1

Bipolar

10

0 ns

15 mA

0.0977 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP18,.3

Other Converters

85 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5.5 V

Binary, Offset Binary

AD7240TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

900 ns

2 mA

-0.0488 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T18

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

Binary

AD7541AGTD

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7541AGCQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.006 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

PM7224FP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

12.5 V

No

1

CMOS

8

5 µs

6 mA

0.391 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.885 in (22.48 mm)

Binary

LTC7541AJN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

In-Line

600 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

PM7541BX

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

1

CMOS

12

1 µs

2 mA

0.024 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, Offset Binary

PM7224AX/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

8

5 µs

6 mA

0.2 %

12/15, GND/-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary

DAC10GSZ

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

10

0 ns

0.0977 %

Parallel, Word

15 V

-15 V

Small Outline

85 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

-5.5 V

0.455 in (11.55 mm)

Binary, Offset Binary

5962-01-406-7114

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

AD7541ATD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883 Class B

12

2 mA

0.0122 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T18

No

e0

Binary

AD7531JD

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

0.2 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T18

0.17 in (4.32 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

Binary

DAC210GX

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

Bipolar

11

12 mA

0.1 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP18,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

Binary

LTC7541ABSW#TR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

Small Outline

600 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

Binary, Offset Binary

LTC7541AJSW#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

Small Outline

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

Binary, Offset Binary

AD7521UQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

500 ns

2 mA

0.05 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

5962-8948104VA

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

10 V

No

1

CMOS

MIL-STD-883

12

0.0122 %

Parallel, Word

15 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary

PM7224FS

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

12.5 V

Yes

1

CMOS

8

5 µs

6 mA

0.391 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

Small Outline

SOP18,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G18

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0 V

0.455 in (11.55 mm)

Binary

5962-01-076-7378

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.1 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

5962-01-117-1821

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

PM7541AFX

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

2

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary, Offset Binary

LTC7541AJN#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

In-Line

600 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T18

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

Binary, Offset Binary

MX7521KCWN+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.1 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

500 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.455 in (11.55 mm)

Binary, Offset Binary

MX7531JCWN+T

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

500 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.455 in (11.55 mm)

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.