18 Digital-to-Analog Converters 462

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MX7541AJ/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

Yes

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

Uncased Chip

DIE OR CHIP

Other Converters

600 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

1

No

e0

Binary, Offset Binary

MX7541AJN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

Binary, Offset Binary

MX7541AJP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

18

QCCJ

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

X-PQCC-J18

1

0.18 in (4.57 mm)

0.39 in (9.9 mm)

No

e0

0.39 in (9.905 mm)

Binary, Offset Binary

MX7521SQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

In-Line

DIP18,.3

500 ns

3.937 in (100 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.96 in (24.38 mm)

Binary, Offset Binary

MX7541AJP+

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

18

QCCJ

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

X-PQCC-J18

1

0.18 in (4.57 mm)

0.39 in (9.9 mm)

No

e3

250 °C (482 °F)

0.39 in (9.905 mm)

Binary, Offset Binary

MX7521JQ

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

In-Line

DIP18,.3

500 ns

3.937 in (100 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.96 in (24.38 mm)

Binary, Offset Binary

MX7541JN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

0.02441 %

Serial

15 V

In-Line

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T18

1

No

e0

Binary

MX7521KN+

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T18

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

0.9 in (22.86 mm)

Binary, Offset Binary

MX7521TQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.1 %

Parallel, Word

15 V

In-Line

DIP18,.3

500 ns

3.937 in (100 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.96 in (24.38 mm)

Binary, Offset Binary

MX7530JC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

Yes

1

CMOS

10

2 mA

0.2 %

Parallel, Word

15 V

15 V

Uncased Chip

DIE OR CHIP

Other Converters

500 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

Binary, Offset Binary

AD7531KCWN

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.1 %

15 V

15 V

Small Outline

SOP18,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G18

No

e0

Binary, Offset Binary

MX7520JC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

Yes

1

CMOS

10

2 mA

0.2 %

Parallel, Word

15 V

15 V

Uncased Chip

DIE OR CHIP

Other Converters

500 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

Binary, Offset Binary

MAX509BC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

5 V

Yes

4

8

10 mA

0.037 %

Serial

5 V

5/±5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

6 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

1

No

e0

-5 V

Binary

MX7531JC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

Yes

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

Uncased Chip

500 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

Binary, Offset Binary

MX7224C/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

Yes

1

CMOS

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

2 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

Offset Binary

MX7224LN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

2 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.9 in (22.86 mm)

Offset Binary

MX7224KCWN

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

8

5 µs

6 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Small Outline

SOP18,.4

Other Converters

2 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0 V

0.455 in (11.55 mm)

Offset Binary

MX7541AJCWN

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

Binary, Offset Binary

MX7521SD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

In-Line

DIP18,.3

500 ns

3.937 in (100 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T18

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e4

0.96 in (24.38 mm)

Binary, Offset Binary

MX7541JCWN+

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

2 mA

0.0244 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

Binary, Offset Binary

AD7531KQ

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.1 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

e0

Binary, Offset Binary

MX7541AAD

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-CDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7521UD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MX7541AKN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

Binary, Offset Binary

MX7541AJC/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

Yes

1

CMOS

12

2 mA

0.024 %

Parallel, Word

15 V

15 V

Uncased Chip

DIE OR CHIP

Other Converters

600 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

Binary, Offset Binary

MX7541KCWN-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

2 mA

0.0122 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

Binary, Offset Binary

MX7541AAQ

Maxim Integrated

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7531KN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.1 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

Binary, Offset Binary

MX7521KN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.1 %

Parallel, Word

15 V

In-Line

DIP18,.3

500 ns

3.937 in (100 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

Binary, Offset Binary

MX7521TD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.1 %

Parallel, Word

15 V

In-Line

DIP18,.3

500 ns

3.937 in (100 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T18

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e4

0.96 in (24.38 mm)

Binary, Offset Binary

MX7541AJP+T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

18

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.024 %

Parallel, Word

15 V

15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin

Quad

S-PQCC-J18

1

No

e3

Binary, Offset Binary

MX7541AKCWN

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

Binary, Offset Binary

MX7541JEWN-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

12

Parallel, Word

15 V

Small Outline

1 µs

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G18

Binary, Offset Binary

AD7541AJCWN

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.024 %

15 V

15 V

Small Outline

SOP18,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G18

No

e0

Binary, Offset Binary

MX7531JCWN

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

500 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

Binary, Offset Binary

MX7521LN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.05 %

Parallel, Word

15 V

In-Line

DIP18,.3

500 ns

3.937 in (100 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

Binary, Offset Binary

MX7541AJEWN

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

600 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.455 in (11.55 mm)

Binary, Offset Binary

MX7224K/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

10 V

Yes

1

CMOS

8

5 µs

6 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Uncased Chip

DIE OR CHIP

Other Converters

2 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

1

No

e0

0 V

Offset Binary

MX7521JCWN+T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

500 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.455 in (11.55 mm)

Binary, Offset Binary

MX7224KCWN-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

8

5 µs

6 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Small Outline

SOP18,.4

Other Converters

2 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0 V

0.455 in (11.55 mm)

Offset Binary

MX7521JCWN+

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

500 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

Binary, Offset Binary

MX7541AKP-T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

18

QCCJ

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

X-PQCC-J18

1

0.18 in (4.57 mm)

0.39 in (9.9 mm)

No

e0

0.39 in (9.905 mm)

Binary, Offset Binary

MX7541ASD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MX7530J/D

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

Yes

1

CMOS

10

0.2 %

Parallel, Word

15 V

Uncased Chip

500 ns

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

1

No

e0

Binary, Offset Binary

MX7541ATQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

600 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

20 s

240 °C (464 °F)

Binary, Offset Binary

MX7224UQ

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

2 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Offset Binary

MX7531LN+

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

500 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T18

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

0.9 in (22.86 mm)

Binary, Offset Binary

MX7521JCWN-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

500 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.