VFBGA Digital-to-Analog Converters 77

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC80508ZCYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC80508ZYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

AD9162BBCAZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

DAC80508MYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

AD9164BBCAZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9162BBCAZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

DAC60508ZYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

6 mA

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

AK4377AECB

Asahi Kasei Microdevices

Digital to Analog converter

Industrial

Ball

36

VFBGA

Rectangular

Plastic/Epoxy

Yes

1

32

30 mA

Serial

1.8 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,16

0.016 in (0.4 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B36

0.022 in (0.565 mm)

0.101 in (2.56 mm)

0.108 in (2.74 mm)

Binary

AD5398ABCBZ-REEL7

Analog Devices

Digital to Analog converter

Other

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

1 mA

0.3906 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Tin Silver Copper

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.48 V

0.067 in (1.69 mm)

Binary

DAC70508ZYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

14

5 µs

6 mA

0.0061 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

AD9164BBCAZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

260 °C (500 °F)

0.433 in (11 mm)

2's Complement

AD5766BCBZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

10 V

Yes

1

16

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

16 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B49

1

0.026 in (0.65 mm)

0.156 in (3.96 mm)

e1

-10 V

0.156 in (3.96 mm)

Binary

AD5821BCBZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

4 mA

0.3906 %

Serial

3.6 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.6 V

0.067 in (1.69 mm)

Binary

AD5398BCBZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Ball

9

VFBGA

Rectangular

5.5 V

Yes

1

CMOS

10

4 mA

0.3906 %

Serial

5 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-XBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.6 V

0.067 in (1.69 mm)

Binary

DAC60508ZCYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

AD5821ABCBZ-REEL7

Analog Devices

Digital to Analog converter

Other

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

1 mA

0.3906 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Matte Tin

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e3

.48 V

0.067 in (1.69 mm)

Binary

AD5767BCBZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

Yes

1

12

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

10 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B49

1

0.026 in (0.65 mm)

0.156 in (3.96 mm)

e1

0.156 in (3.96 mm)

Binary

AD5821BCBZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

4 mA

0.3906 %

Serial

3.6 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.6 V

0.067 in (1.69 mm)

Binary

DAC60508ZCYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

MAX5825AWP+T

Analog Devices

Digital to Analog converter

Automotive

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

12

2.5 mA

0.0244 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

Other Converters

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.089 in (2.255 mm)

No

e2

30 s

260 °C (500 °F)

0 V

0.099 in (2.505 mm)

Binary

AD5669RBCBZ-1-R5

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

DAC70508MYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

14

5 µs

6 mA

0.0061 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC70508MYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

14

5 µs

6 mA

0.0061 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC70508ZYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

14

5 µs

6 mA

0.0061 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC80508MCYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

ADAU1850BCBZRL

Analog Devices

Digital to Analog converter

Ball

28

VFBGA

Rectangular

Yes

1

24

Serial

1.8 V

Grid Array, Very Thin Profile, Fine Pitch

BGA28,4X7,16

0.016 in (0.4 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-XBGA-B28

0.022 in (0.57 mm)

0.069 in (1.757 mm)

0.116 in (2.957 mm)

Binary

AD9161BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

11

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD5668BCBZ-1-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

2.25 mA

0.0244 %

Serial

5 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

Other Converters

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

No

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD9162BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

0.315 in (8 mm)

2's Complement

DAC80508MCYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC60508MYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

6 mA

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC53204YBHR

Texas Instruments

Digital to Analog converter

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

250 kHz

1

10

0.12207 %

Serial

2.7 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

20 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.016 in (0.4 mm)

0.068 in (1.7175 mm)

e1

260 °C (500 °F)

0 V

0.068 in (1.7175 mm)

Binary

TLV5610IYER

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

2.9 V

Yes

1

CMOS

12

7 µs

21 mA

0.1465 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B20

0.028 in (0.715 mm)

0.075 in (1.91 mm)

No

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

DAC80508ZYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC60508ZYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

6 mA

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC80508ZCYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

TLV5608IYE

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

2.9 V

Yes

1

CMOS

10

7 µs

21 mA

0.1953 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B20

0.028 in (0.715 mm)

0.075 in (1.91 mm)

No

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

TLV320DAC23IGQE

Texas Instruments

Digital to Analog converter

Industrial

Ball

80

VFBGA

Square

Plastic/Epoxy

Yes

1

32

Serial

3.3 V

1.5/3.3,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA80,9X9,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B80

0.039 in (1 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

Binary

DAC60508MYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

6 mA

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC60508MCYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC60508MCYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC80508MYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

TLV320DAC23IGQER

Texas Instruments

Digital to Analog converter

Industrial

Ball

80

VFBGA

Square

Plastic/Epoxy

Yes

1

32

Serial

3.3 V

1.5/3.3,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA80,9X9,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B80

0.039 in (1 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

Binary

TLV320DAC23GQE

Texas Instruments

Digital to Analog converter

Commercial

Ball

80

VFBGA

Square

Plastic/Epoxy

Yes

1

32

8 mA

Serial

3.3 V

1.5/3.3,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA80,9X9,20

Other Converters

0.02 in (0.5 mm)

70 °C (158 °F)

-10 °C (14 °F)

Tin Lead

Bottom

S-PBGA-B80

2A

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

20 s

235 °C (455 °F)

0.197 in (5 mm)

Binary

TLV5610IYE

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

2.9 V

Yes

1

CMOS

12

7 µs

21 mA

0.1465 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B20

0.028 in (0.715 mm)

0.075 in (1.91 mm)

No

e1

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

TLV5608IYER

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

2.9 V

Yes

1

CMOS

10

7 µs

21 mA

0.1953 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B20

0.028 in (0.715 mm)

0.075 in (1.91 mm)

No

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

TLV320DAC23GQER

Texas Instruments

Digital to Analog converter

Commercial

Ball

80

VFBGA

Square

Plastic/Epoxy

Yes

1

32

Serial

3.3 V

1.5/3.3,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA80,9X9,20

Other Converters

0.02 in (0.5 mm)

70 °C (158 °F)

-10 °C (14 °F)

Bottom

S-PBGA-B80

0.039 in (1 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

Binary

AD9162BBCARL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

20 s

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.