VFBGA Digital-to-Analog Converters 77

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD5664RBCBZ-3-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.066 in (1.665 mm)

e1

30 s

260 °C (500 °F)

0.088 in (2.245 mm)

Binary

AD9164BBCARL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

AD5665RBCBZ-1-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

1.16 mA

0.0244 %

Serial

5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.066 in (1.665 mm)

No

e1

30 s

260 °C (500 °F)

0 V

0.088 in (2.245 mm)

Binary

AD5668BCBZ-3-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD9164BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

260 °C (500 °F)

0.315 in (8 mm)

2's Complement

AD9162BBCA

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

20 s

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

AD5629RBCBZ-1-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

7 µs

2.5 mA

0.0244 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

Other Converters

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

No

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD5821ABCBZ-REEL

Analog Devices

Digital to Analog converter

Other

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

1 mA

0.3906 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Matte Tin

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e3

.48 V

0.067 in (1.69 mm)

Binary

AD5398ABCBZ-REEL

Analog Devices

Digital to Analog converter

Other

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

1 mA

0.3906 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Matte Tin

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e3

.48 V

0.067 in (1.69 mm)

Binary

AD9164BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

260 °C (500 °F)

0.315 in (8 mm)

2's Complement

AD9162BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

0.315 in (8 mm)

2's Complement

AD9163BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

CMOS

16

100 mA

0.004 %

Serial

2.5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA169,13X13,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9163BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

CMOS

16

100 mA

0.004 %

Serial

2.5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA169,13X13,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9164BBCA

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

AD5669RBCBZ-1-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

2.5 mA

0.0244 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

Other Converters

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

No

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD5592RBCBZ-RL7

Analog Devices

Digital to Analog Converter 12 bit

Ball

16

VFBGA

Square

Plastic/Epoxy

5 V

Yes

1

12

2.7 mA

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.64 mm)

0.077 in (1.96 mm)

e1

30 s

260 °C (500 °F)

0 V

0.077 in (1.96 mm)

Binary

AD9161BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

11

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD5628BCBZ-1-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

7 µs

2.25 mA

0.0244 %

Serial

5 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

Other Converters

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

No

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD5668BCBZ-1-500R7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

3.6 V

Yes

1

CMOS

16

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD5770RBCBZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

Yes

1

14

0.0397 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

13 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B49

1

0.026 in (0.66 mm)

0.159 in (4.04 mm)

260 °C (500 °F)

0.159 in (4.04 mm)

Binary

AD5592RBCBZ-1-RL7

Analog Devices

Digital to Analog Converter 12 bit

Ball

16

VFBGA

Square

Plastic/Epoxy

5 V

Yes

1

12

2.7 mA

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.64 mm)

0.077 in (1.96 mm)

e1

30 s

260 °C (500 °F)

0 V

0.077 in (1.96 mm)

Binary

MAX5112GWX+T

Analog Devices

Digital to Analog converter

Automotive

Ball

36

VFBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

600 μA

0.0488 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.121 in (3.065 mm)

e1

30 s

260 °C (500 °F)

0 V

0.121 in (3.065 mm)

Binary

MAX5113GWX+T

Analog Devices

Digital to Analog converter

Industrial

Ball

36

VFBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

600 μA

0.0061 %

Serial

3 V

-5.2 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.121 in (3.065 mm)

e1

30 s

260 °C (500 °F)

0 V

0.121 in (3.065 mm)

Binary

MAX5832GWX+T

Analog Devices

Digital to Analog converter

Ball

36

VFBGA

Square

Plastic/Epoxy

3.3 V

Yes

1

BICMOS

14

600 μA

0.06103 %

Serial

3 V

-5.25 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B36

0.027 in (0.69 mm)

0.121 in (3.065 mm)

-3.75 V

0.121 in (3.065 mm)

Binary

MAX5113GWX+

Analog Devices

Digital to Analog converter

Industrial

Ball

36

VFBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

600 μA

0.0061 %

Serial

3 V

-5.2 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.121 in (3.065 mm)

e1

30 s

260 °C (500 °F)

0 V

0.121 in (3.065 mm)

Binary

MAX5824AWP+T

Analog Devices

Digital to Analog converter

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

10

2.5 mA

0.0488 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.099 in (2.505 mm)

0 V

0.1 in (2.55 mm)

Binary

MAX5823AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

8

2.5 mA

0.09765 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

2.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.089 in (2.255 mm)

e2

30 s

260 °C (500 °F)

0 V

0.099 in (2.505 mm)

Binary

MAX5823AWP+T

Analog Devices

Digital to Analog converter

Automotive

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

8

2.5 mA

0.09765 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

2.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.089 in (2.255 mm)

e2

30 s

260 °C (500 °F)

0 V

0.099 in (2.505 mm)

Binary

MAX5112GWX+TG074

Maxim Integrated

Digital to Analog converter

Ball

36

VFBGA

Square

Plastic/Epoxy

3.2 V

Yes

1

BIMOS

14

600 μA

0.0488 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.121 in (3.065 mm)

e1

30 s

260 °C (500 °F)

0 V

0.121 in (3.065 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.