Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
500 kHz |
1 |
12 |
5 µs |
1.8 mA |
0.0244 % |
Serial |
3 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Other Converters |
5 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N32 |
2 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary, 2's Complement Binary |
||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
12 |
5 µs |
1.8 mA |
0.0244 % |
Serial |
3 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N32 |
2 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary, 2's Complement Binary |
||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
9000 MHz |
1 |
14 |
1.758 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Other |
Flat |
52 |
HGQFF |
Square |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
3.9 V |
Yes |
400 MHz |
1 |
CMOS |
MIL-PRF-38535 Class V |
14 |
0.0281 % |
Parallel, Word |
3.3 V |
Flatpack, Heat Sink/Slug, Guard Ring |
12 ns |
115 °C (239 °F) |
-55 °C (-67 °F) |
Quad |
S-CQFP-F52 |
0.55 in (13.97 mm) |
Yes |
2.15 V |
0.55 in (13.97 mm) |
Binary |
|||||||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
25 V |
Yes |
1 |
CMOS |
8 |
0 ns |
500 μA |
0.195 % |
Parallel, 8 Bits |
15 V |
5/15 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
S-PQCC-J20 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
-25 V |
0.353 in (8.9662 mm) |
Offset Binary, Complementary Binary |
|||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
24 |
HVQCCN |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
16 |
1.5 mA |
0.0015 % |
Serial |
3 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.16SQ,20 |
Other Converters |
5 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N24 |
2 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary, 2's Complement Binary |
||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
20 |
HVQCCN |
Square |
Plastic/Epoxy |
2.828 V |
Yes |
1 |
CMOS |
16 |
10 mA |
Serial |
3.3 V |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.16SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N20 |
2 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-2.828 V |
0.157 in (4 mm) |
2's Complement Binary |
|||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Other |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
3.41 V |
Yes |
1 |
CMOS |
24 |
Serial |
5 V |
3.3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Other Converters |
400 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.276 in (7 mm) |
2's Complement Binary |
|||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
100 kHz |
1 |
16 |
10 µs |
1.3 mA |
0.0183 % |
Serial |
3.6 V |
3/5 V |
Small Outline |
TSSOP10,.19,20 |
Other Converters |
7 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Dual |
S-PDSO-G10 |
2 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
1.25 V |
Yes |
275 MHz |
2 |
CMOS |
12 |
90 mA |
0.0488 % |
Parallel, Word |
3.3 V |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Other Converters |
20 ns |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
2 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-1 V |
0.276 in (7 mm) |
Offset Binary |
||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
9000 MHz |
1 |
14 |
1.758 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
8.5 µs |
650 μA |
0.1953 % |
Serial |
3 V |
3/5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.11,20 |
Other Converters |
6 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||
Texas Instruments |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
8.5 µs |
0.1953 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
6 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
16 |
5 µs |
0.0031 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Other Converters |
233 ns |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
S-PQFP-G48 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
-10 V |
0.276 in (7 mm) |
Binary, Offset Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
250 kHz |
1 |
10 |
0.09765625 % |
Serial |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.12SQ,20 |
20 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e4 |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Gull Wing |
100 |
HTFQFP |
Square |
Plastic/Epoxy |
4.1 V |
Yes |
500 MHz |
1 |
CMOS |
16 |
55 mA |
0.018 % |
Serial, Parallel, Word |
3.3 V |
1.8,3.3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Other Converters |
12 ns |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G100 |
3 |
0.047 in (1.2 mm) |
0.551 in (14 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
2.5 V |
0.551 in (14 mm) |
2's Complement Binary |
||||||||||||||
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
8 |
VSSOP |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
14 |
110 ns |
10 μA |
0.0122 % |
Serial |
3.5 V |
3/5 V |
Small Outline, Very Thin Profile, Shrink Pitch |
TSSOP8,.1 |
Other Converters |
16 ns |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.063 in (1.6 mm) |
No |
e0 |
240 °C (464 °F) |
0.114 in (2.9 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.2 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
0.0977 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
10 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3 |
CMOS |
10 |
125 mA |
0.195 % |
Parallel, 8 Bits |
5 V |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.5862 mm) |
No |
e3 |
260 °C (500 °F) |
0.653 in (16.5862 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Pin/Peg |
44 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
CMOS |
16 |
3 mA |
0.0015 % |
Serial, Parallel, Word |
5 V |
5 V |
Grid Array |
PGA44,8X8 |
Other Converters |
6 µs |
0.1 in (2.54 mm) |
100 °C (212 °F) |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P44 |
0.25 in (6.35 mm) |
0.8 in (20.32 mm) |
No |
e0 |
-10 V |
0.8 in (20.32 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
108 |
BGA |
Square |
Plastic/Epoxy |
14.5 V |
Yes |
1 |
CMOS |
14 |
30 µs |
0.0183 % |
Serial, Parallel, Word |
12 V |
3/5,11.4/16.5 V |
-12 V |
Grid Array |
BGA108,12X12,40 |
Other Converters |
20 µs |
0.039 in (1 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B108 |
3 |
0.073 in (1.85 mm) |
0.512 in (13 mm) |
No |
e0 |
240 °C (464 °F) |
-1 V |
0.512 in (13 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
14 |
0.0977 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
9 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
16 |
0.0031 % |
Parallel, Word |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
2 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-10 V |
0.354 in (9 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.005 V |
Yes |
1 |
12 |
0.0244 % |
Serial |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
5 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
14 |
2 µs |
4 mA |
0.0061 % |
Parallel, Word |
12/15,GND/-0.3 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
0.453 in (11.5062 mm) |
Binary, Offset Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
52 |
LQFP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
14 |
10 µs |
0.0183 % |
Serial |
5 V |
3/5,5 V |
Flatpack, Low Profile |
QFP52,.47SQ |
Other Converters |
8 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G52 |
3 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
e0 |
240 °C (464 °F) |
0 V |
0.394 in (10 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
3.25 V |
Yes |
1 |
10 |
0.0186 % |
Serial, Parallel, Word |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
11.5 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N40 |
3 |
0.039 in (1 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.236 in (6 mm) |
Binary, 2's Complement Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
12 |
0.0244 % |
Parallel, Word |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
2 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-10 V |
0.354 in (9 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
0.0977 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
10 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e0 |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
8 |
13 ns |
200 mA |
0.391 % |
Parallel, 8 Bits |
5 V |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Other Converters |
13 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
0.18 in (4.57 mm) |
0.653 in (16.5862 mm) |
No |
e0 |
0.653 in (16.5862 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 |
12 |
2 mA |
0.1221 % |
Parallel, Word |
15 V |
15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
No |
e0 |
Binary, 2's Complement Binary |
||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
15.1 V |
Yes |
1 |
CMOS |
14 |
30 µs |
0.0061 % |
Serial |
15 V |
3/5,±12/±16.5 V |
-15 V |
Flatpack, Low Profile, Fine Pitch |
QFP64,.47SQ,20 |
Other Converters |
20 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G64 |
3 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
e3 |
260 °C (500 °F) |
-3.1 V |
0.394 in (10 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3 |
CMOS |
8 |
100 mA |
0.39 % |
5 V |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J44 |
No |
e0 |
Binary |
||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.2 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
1 µs |
2 mA |
0.012 % |
15 V |
15 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J20 |
No |
e0 |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
BICMOS |
12 |
2 µs |
2 mA |
0.0244 % |
Parallel, 8 Bits |
12 V |
12/15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
225 °C (437 °F) |
0.453 in (11.5062 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1.25 V |
Yes |
1 |
CMOS |
12 |
0.0366 % |
Parallel, Word |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
11 ns |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-1 V |
0.276 in (7 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3 |
CMOS |
8 |
125 mA |
0.3906 % |
Parallel, 8 Bits |
5 V |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
0.18 in (4.57 mm) |
0.653 in (16.5862 mm) |
No |
e0 |
0.653 in (16.5862 mm) |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.1 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
CMOS |
12 |
2 µs |
2 mA |
0.0122 % |
Parallel, Word |
12 V |
12/15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
9.9853 V |
Yes |
4 |
BICMOS |
MIL-STD-883 |
12 |
0.0366 % |
Parallel, Word |
15 V |
-15 V |
Chip Carrier |
6 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
Yes |
-9.9902 V |
0.45 in (11.43 mm) |
Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
2.56 V |
Yes |
1 |
Bipolar |
8 |
2 µs |
25 mA |
0.3906 % |
Parallel, 8 Bits |
5 V |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.565 mm) |
0.353 in (8.966 mm) |
No |
e0 |
225 °C (437 °F) |
0 V |
0.353 in (8.966 mm) |
Complementary Offset Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
BICMOS |
MIL-STD-883 Class B |
12 |
1.5 µs |
2 mA |
0.0244 % |
Parallel, 8 Bits |
15 V |
12/15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
5.005 V |
Yes |
1 |
CMOS |
16 |
8 µs |
1.3 mA |
0.0122 % |
Serial |
3 V |
2/5,3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.12SQ,20 |
Other Converters |
5 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
8 |
0 ns |
2 mA |
0.3906 % |
Parallel, 8 Bits |
5 V |
5/15 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.965 mm) |
No |
e3 |
260 °C (500 °F) |
0.353 in (8.965 mm) |
Binary, Offset Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
12 |
0.061 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
MIL-STD-883 |
12 |
0.0305 % |
Parallel, Word |
5 V |
-5.2 V |
Chip Carrier |
22 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.