Square Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7543SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

38535Q/M;38534H;883B

12

2 µs

0.024 %

Serial

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

350 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD9739BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

238 mA

Serial, Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary

AD9746BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

CMOS

14

Parallel, Word

1.8 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.39SQ,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N72

3

0.039 in (1 mm)

0.394 in (10 mm)

No

e3

260 °C (500 °F)

-1 V

0.394 in (10 mm)

Binary, 2's Complement Binary

AD7524KP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

8

0 ns

2 mA

0.0977 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

500 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

225 °C (437 °F)

0.353 in (8.9662 mm)

Binary

AD5311BRM

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

225 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

7 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

LTC2634IUD-HZ8#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

8

0.1953 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2634CMSE-LMX8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

3.3 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635HMSE-HMO10#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

4.3 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

LTC2757ACLX#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

18

0.0004 %

Parallel, Word

3 V

Flatpack, Low Profile, Fine Pitch

2.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.276 in (7 mm)

Binary

AD5304ARM

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

8 µs

900 μA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

.001 V

0.118 in (3 mm)

Binary

AD9712BAP

Analog Devices

Digital to Analog converter

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

Bipolar

12

183 mA

0.0488 %

Parallel, Word

-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Other Converters

27 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

Binary

5962-87763023C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

BICMOS

12

2 mA

Parallel, 8 Bits

Chip Carrier

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e4

0.45 in (11.43 mm)

Binary, Offset Binary

LTC1663-8IMS8

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.2441 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

30 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

AD9177BBPZRL

Analog Devices

Digital to Analog converter

Ball

324

HFBGA

Square

Plastic/Epoxy

Yes

4

16

301 mA

0.012207 %

Serial

2 V

Grid Array, Heat Sink/Slug, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

120 °C (248 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

3

0.068 in (1.72 mm)

0.591 in (15 mm)

260 °C (500 °F)

0.591 in (15 mm)

Binary

5962-89481032X

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

10 V

Yes

1

CMOS

MIL-STD-883

12

0.0244 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQCC-N20

No

Binary

AD5373BCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

15.1 V

Yes

1

CMOS

14

30 µs

0.0061 %

Serial

15 V

3/5,±10/±15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Other Converters

20 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-3.1 V

0.354 in (9 mm)

Binary

AD5744CSU-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

32

QFP

Square

Plastic/Epoxy

Yes

4

CMOS

14

10 µs

3.75 mA

0.006 %

3/5,±12/±15 V

Flatpack

TQFP32,.35SQ,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G32

1

No

e0

Offset Binary, 2's Complement Binary

AD5623RACPZ-5REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

4.5 µs

1 mA

0.3906 %

Serial

5 V

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.11,20

Other Converters

3 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.033 in (0.85 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5380BST-3

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

3.6 V

Yes

1

CMOS

14

10 µs

0.0244 %

Parallel, Word

3 V

3/3.3,3/5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Other Converters

8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G100

3

0.063 in (1.6 mm)

0.551 in (14 mm)

No

e0

240 °C (464 °F)

0 V

0.551 in (14 mm)

Binary

DAC-8412PC

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

20 µs

0.012 %

Parallel, Word

15 V

-15 V

Chip Carrier

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

-10 V

0.453 in (11.505 mm)

Binary

LTC2753CUK-12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

12

0.0244 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.276 in (7 mm)

Binary

AD7245ATE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

1

CMOS

MIL-STD-883 Class B

12

10 µs

12 mA

0.0183 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

10 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-5 V

0.45 in (11.43 mm)

Binary

AD7549SE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 µs

5 mA

0.0244 %

Parallel, 4 Bits

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

AD7547AE

Analog Devices

Digital to Analog converter

Industrial

No Lead

28

QCCN

Square

Ceramic

Yes

2

BICMOS

12

1.5 µs

2 mA

0.024 %

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

Binary

AD7533KPZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

10

0.1 %

Parallel, Word

15 V

Chip Carrier

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQCC-J20

0.18 in (4.57 mm)

0.353 in (8.965 mm)

0.353 in (8.965 mm)

Binary, Offset Binary

LTC2635HUD-HMI8#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

0.1953 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.9 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635CMSE-HMO8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

8

0.1953 %

Serial

5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

3.9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

AD9119BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

11

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

1.5 V

0.472 in (12 mm)

Binary

AD9742ACPZRL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

32

VQCCN

Square

1.25 V

Yes

1

CMOS

12

0.061 %

Parallel, Word

3.3 V

3.3 V

Chip Carrier, Very Thin Profile

LCC32,.2SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.197 in (5 mm)

Binary, 2's Complement Binary

LTC2635HUD-LMO12#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5660BCPZ-3500RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5516ABCZ-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.0122 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-2.5 V

0.472 in (12 mm)

Binary

LTC2634HMSE-HMI12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

4.8 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5675RACPZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5 V

Yes

1

16

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD7835BS

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

8.192 V

Yes

4

CMOS

14

15 mA

0.006 %

Serial

15 V

5,±15 V

-15 V

Flatpack

QFP44,.57SQ,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G44

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e0

-8.192 V

0.394 in (10 mm)

Binary

ADV101KP50

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

100 mA

0.3906 %

Parallel, 8 Bits

5 V

5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.5862 mm)

No

e0

0.653 in (16.5862 mm)

Binary

AD7224KPZ

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

BICMOS

8

20 µs

6 mA

0.391 %

Parallel, 8 Bits

15 V

-5 V

Chip Carrier

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.173 in (4.39 mm)

0.352 in (8.93 mm)

No

e3

260 °C (500 °F)

0.352 in (8.93 mm)

Binary

AD7547KP/883B

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

MIL-STD-883 Class B

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

12 V

Chip Carrier

LDCC28,.5SQ

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.506 mm)

0.453 in (11.506 mm)

Binary

AD5516ABC-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

14

32 µs

0.0122 %

Serial

5 V

±4.75/±13.2,3/5,5 V

Grid Array, Low Profile

BGA74,11X11,40

Other Converters

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-10 V

0.472 in (12 mm)

Binary

AD9781BCPZRL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

14

Parallel, Word

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N72

0.039 in (1 mm)

0.394 in (10 mm)

No

-1 V

0.394 in (10 mm)

Binary

AD767KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCN

Square

Plastic/Epoxy

10 V

Yes

1

12

4 µs

0.0122 %

Parallel, Word

15 V

-15 V

Chip Carrier

LCC28,.45SQ

3 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.178 in (4.51 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.506 mm)

Binary, Offset Binary

AD7537JP

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

BICMOS

12

2 µs

2 mA

0.0244 %

Parallel, 8 Bits

12 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

30 s

225 °C (437 °F)

0.453 in (11.5062 mm)

Binary

5962-87789012A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

Bipolar

38535Q/M;38534H;883B

8

5 µs

25 mA

0.29 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

Yes

e0

0 V

0.35 in (8.89 mm)

Binary

AD5392BCP-3-REEL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

3.6 V

Yes

1

CMOS

14

10 µs

0.0244 %

Serial

3 V

3.3,3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Other Converters

8 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e0

240 °C (464 °F)

0 V

0.354 in (9 mm)

Binary

AD9772ASTRL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1.25 V

Yes

1

CMOS

14

Parallel, Word

3 V

3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Other Converters

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G48

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

-1 V

0.276 in (7 mm)

Binary

AD5668BCPZ-1500RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

16

HVQCCN

Square

5.5 V

Yes

1

CMOS

16

7 µs

2.25 mA

0.0244 %

Serial

5 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.16SQ,25

Other Converters

2.5 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N16

3

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

5962-87763013A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

BICMOS

12

2 mA

Parallel, 8 Bits

Chip Carrier

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary, Offset Binary

LTC2635HUD-HMI8#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

8

0.1953 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.9 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.