Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
5.5 V |
Yes |
4 |
12 |
6 mA |
0.0366 % |
Serial |
5 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16(UNSPEC) |
Other Converters |
5 µs |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
1 |
0.035 in (0.9 mm) |
0.157 in (4 mm) |
No |
e3 |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 |
12 |
0.0488 % |
Parallel, Word |
5 V |
Chip Carrier |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQCC-N20 |
No |
e4 |
Binary, 2's Complement Binary |
|||||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2.482 V |
Yes |
1 |
AEC-Q100 |
Serial |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
With programmable PLL |
e3 |
30 s |
260 °C (500 °F) |
-2.482 V |
0.276 in (7 mm) |
Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
44 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 V |
Yes |
1 |
BIMOS |
12 |
19 mA |
0.012 % |
Parallel, Word |
15 V |
-15 V |
Chip Carrier |
10 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N44 |
0.1 in (2.54 mm) |
0.651 in (16.545 mm) |
No |
-10 V |
0.651 in (16.545 mm) |
Binary |
|||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
CMOS |
8 |
Parallel, 8 Bits |
Chip Carrier |
180 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
Binary |
|||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
0.0244 % |
Serial |
3 V |
Grid Array, Very Thin Profile, Fine Pitch |
2.5 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.026 in (0.65 mm) |
0.103 in (2.605 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.103 in (2.605 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
CMOS |
16 |
150 μA |
0.0031 % |
Serial |
5 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.12SQ,20 |
Other Converters |
1 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
S-XQCC-N16 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
2 µs |
2.5 mA |
0.0122 % |
Parallel, 4 Bits |
5 V |
Chip Carrier |
250 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
e3 |
260 °C (500 °F) |
0.353 in (8.9662 mm) |
Binary, Offset Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
12 |
2 µs |
2 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
74 |
LBGA |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
14 |
0.0488 % |
Serial |
5 V |
Grid Array, Low Profile |
0.039 in (1 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B74 |
0.067 in (1.7 mm) |
0.472 in (12 mm) |
No |
e0 |
-10 V |
0.472 in (12 mm) |
Binary |
|||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
8 µs |
0.0244 % |
Parallel, Word |
5 V |
3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Other Converters |
6 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
0.063 in (1.6 mm) |
0.551 in (14 mm) |
No |
e0 |
240 °C (464 °F) |
0 V |
0.551 in (14 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.2 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
40 |
VQCCN |
Square |
5.499 V |
Yes |
1 |
CMOS |
12 |
10 µs |
1.65 mA |
0.3906 % |
Parallel, Word |
3 V |
3/5 V |
Chip Carrier, Very Thin Profile |
LCC40,.24SQ,20 |
Other Converters |
8 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N40 |
3 |
0.039 in (1 mm) |
0.236 in (6 mm) |
No |
e0 |
240 °C (464 °F) |
.001 V |
0.236 in (6 mm) |
Binary |
|||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
100 |
LFBGA |
Square |
Plastic/Epoxy |
3.6 V |
Yes |
1 |
CMOS |
14 |
10 µs |
0.0244 % |
Serial |
3 V |
3/3.3,3/5 V |
Grid Array, Low Profile, Fine Pitch |
BGA100,12X12,32 |
Other Converters |
8 µs |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead Silver |
Bottom |
S-PBGA-B100 |
3 |
0.055 in (1.4 mm) |
0.394 in (10 mm) |
No |
e0 |
240 °C (464 °F) |
0 V |
0.394 in (10 mm) |
Binary |
|||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5.499 V |
Yes |
1 |
CMOS |
12 |
400 μA |
0.1953 % |
Serial |
3 V |
2.5/5.5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSOP10,.5 |
Other Converters |
8 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
30 s |
240 °C (464 °F) |
.001 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
3.8 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
20 |
HVQCCN |
Square |
5 V |
Yes |
1 |
12 |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N20 |
3 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
49 |
VFBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
14 |
0.0397 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
13 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B49 |
1 |
0.026 in (0.66 mm) |
0.159 in (4.04 mm) |
260 °C (500 °F) |
0.159 in (4.04 mm) |
Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
5 V |
Yes |
1 |
CMOS |
12 |
160 ns |
5 μA |
0.0244 % |
Serial |
3.3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
90 ns |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
30 s |
240 °C (464 °F) |
.4 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
14 |
0.0977 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
9 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
12 |
0.061 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.8 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
4.1 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
5.5 V |
Yes |
1 |
12 |
8 µs |
475 μA |
0.0244 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
3 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
260 °C (500 °F) |
0 V |
0.354 in (9 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
12 |
0.061 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.8 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1.4 V |
Yes |
1 |
CMOS |
8 |
0.3906 % |
Parallel, 8 Bits |
5 V |
Flatpack, Low Profile, Fine Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
3 |
0.067 in (1.7 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-1 V |
0.276 in (7 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
0.061 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
5 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3 |
CMOS |
10 |
125 mA |
0.195 % |
Parallel, 8 Bits |
5 V |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.5862 mm) |
No |
e3 |
260 °C (500 °F) |
0.653 in (16.5862 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
4 V |
Yes |
1 |
CMOS |
12 |
2.6 mA |
0.4 % |
Serial |
5 V |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
800 ns |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
30 s |
240 °C (464 °F) |
0 V |
0.118 in (3 mm) |
2's Complement Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
2 |
CMOS |
38535Q/M;38534H;883B |
8 |
Parallel, 8 Bits |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
180 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
20 |
HVQCCN |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
4 |
CMOS |
16 |
0.0061 % |
Serial |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
9.1 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
8 |
CMOS |
8 |
22 mA |
Parallel, 8 Bits |
15 V |
-5 V |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
0.45 in (11.43 mm) |
Binary |
|||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
5.5 V |
Yes |
1 |
CMOS |
12 |
7 µs |
2.25 mA |
0.0244 % |
Serial |
5 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.16SQ,25 |
Other Converters |
2.5 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
J Bend |
28 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
2 V |
Yes |
1 |
Bipolar |
12 |
170 mA |
0.024 % |
Parallel, Word |
5 V |
5,-5.2 V |
-5.2 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
27 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
0.171 in (4.34 mm) |
0.45 in (11.43 mm) |
No |
e0 |
-1.2 V |
0.45 in (11.43 mm) |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
74 |
LBGA |
Square |
Plastic/Epoxy |
14.5 V |
Yes |
1 |
14 |
0.39 % |
Serial |
10 V |
Grid Array, Low Profile |
22 µs |
0.039 in (1 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B74 |
3 |
0.067 in (1.7 mm) |
0.472 in (12 mm) |
No |
e0 |
240 °C (464 °F) |
-14.5 V |
0.472 in (12 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
4.3 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
8 |
0.1953 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
3.5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
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Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
2 µs |
2 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
80 |
HTFQFP |
Square |
Plastic/Epoxy |
1.25 V |
Yes |
1 |
CMOS |
12 |
0.0366 % |
Serial |
3.3 V |
3.3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP80,.55SQ |
Other Converters |
11 ms |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G80 |
3 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
With programmable PLL |
e0 |
240 °C (464 °F) |
-1 V |
0.472 in (12 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
10 |
HVSSON |
Square |
5.499 V |
Yes |
1 |
CMOS |
8 |
8 µs |
900 μA |
0.3906 % |
Serial |
3 V |
3/5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile, Shrink Pitch |
SOLCC10,.11,20 |
Other Converters |
6 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-XDSO-N10 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
.001 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
8 |
10 μA |
0.1953 % |
Serial |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Other Converters |
30 ns |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G10 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
8 |
VSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
14 |
0.0244 % |
Serial |
3 V |
Small Outline, Very Thin Profile |
8 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Dual |
S-PDSO-N8 |
0.033 in (0.85 mm) |
0.118 in (3 mm) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
CMOS |
12 |
150 μA |
0.0244 % |
Serial |
5 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.12SQ,20 |
Other Converters |
1 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
S-XQCC-N16 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
4.5 µs |
1.16 mA |
0.0244 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.11,20 |
3 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-N10 |
3 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
BICMOS |
12 |
10 µs |
15 mA |
0.024 % |
12/15,GND/-12/-15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J28 |
No |
e0 |
Binary, Offset Binary |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
No Lead |
64 |
Square |
Yes |
16 |
Chip Carrier |
Quad |
S-XQCC-N64 |
No |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
4.3 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
Bipolar |
38535Q/M;38534H;883B |
10 |
290 mA |
0.1465 % |
Parallel, Word |
5 V |
-5.2 V |
-5.2 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
10 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
10 |
0.0977 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
4.3 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
0 V |
0.118 in (3 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.