Automotive Digital-to-Analog Converters 1,826

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX5805BAUB+

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

410 μA

0.024 %

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G10

1

No

e3

30 s

260 °C (500 °F)

Offset Binary

MCP47CVB12-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

TS 16949

10

850 μA

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.035 in (0.9 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB22-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

12

720 μA

0.0244 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP4802T-E/MS

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

SOP

Square

Plastic/Epoxy

4.176 V

Yes

1

TS 16949

8

750 μA

0.39 %

Serial

5 V

3/5 V

Small Outline

SOP8,.19

Other Converters

4.5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

MCP4911-E/MC

Microchip Technology

Digital to Analog converter

Automotive

No Lead

8

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

10

350 μA

0.34179 %

Serial

5 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC8,.12,20

Other Converters

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N8

1

0.039 in (1 mm)

0.079 in (2 mm)

No

e3

40 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5444YRMZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

Yes

1

CMOS

12

110 ns

10 μA

0.0122 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

Other Converters

100 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

Binary

AD5582YRVZ-REEL

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

3 mA

0.0244 %

Parallel, Word

5 V

5/15/±5 V

-5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP48,.3,20

Other Converters

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G48

3

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e3

40 s

260 °C (500 °F)

0.492 in (12.5 mm)

Binary

AD5583YRVZ-REEL

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

10

3 mA

0.0977 %

Parallel, Word

5 V

5/15/±5 V

-5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP48,.3,20

Other Converters

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G48

3

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e3

40 s

260 °C (500 °F)

0.492 in (12.5 mm)

Binary

AD5675RBRUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

16

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

DAC108S085CIMT/NOPB

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

2.5 MHz

1

CMOS

10

6 µs

855 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

DAC5311IDCKR

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

83 kHz

1

8

10 µs

160 μA

0.0977 %

Serial

3 V

2/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G6

1

0.043 in (1.1 mm)

0.049 in (1.25 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

DAC5311IDCKRG4

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

83 kHz

1

8

10 µs

160 μA

0.0977 %

Serial

3 V

2/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

Other Converters

12 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Dual

R-PDSO-G6

1

0.043 in (1.1 mm)

0.049 in (1.25 mm)

No

e4

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

DAC7821IPWR

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

10 MHz

1

CMOS

12

200 ns

5 μA

0.0244 %

Parallel, Word

2.7 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

200 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G20

2

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0.256 in (6.5 mm)

Binary

DAC7821IPWRG4

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

200 ns

5 μA

0.0244 %

Parallel, Word

2.7 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G20

2

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0.256 in (6.5 mm)

Binary

LTC2633HTS8-HZ12#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

MCP47CMB02-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB02T-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G10

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB11-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

10

620 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB12-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

10

720 μA

0.0244 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47FVB12A1-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP4802-E/P

Microchip Technology

Digital to Analog converter

Automotive

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

4.176 V

No

1

TS 16949

8

750 μA

0.39 %

Serial

5 V

3/5 V

In-Line

DIP8,.3

Other Converters

4.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0 V

0.365 in (9.271 mm)

Binary

MCP4921T-E/MCVAO

Microchip Technology

Digital to Analog converter

Automotive

No Lead

8

HVSON

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

AEC-Q100

12

350 μA

0.2929 %

Serial

5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC8,.12,20

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N8

0.039 in (1 mm)

0.079 in (2 mm)

e3

0 V

0.118 in (3 mm)

Binary

AD5065ARUZ

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

16

13 µs

2.7 mA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

Other Converters

10.7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G14

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5328BRUZ-REEL

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

12

10 µs

1.8 mA

0.293 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

.001 V

0.197 in (5 mm)

Binary

AD5621ACPZ-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

6

HVSON

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

10 µs

100 μA

0.1465 %

Serial

3 V

3/5 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC6,.1,25

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N6

1

0.031 in (0.8 mm)

0.079 in (2 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5662ARJZ-2REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

10 µs

250 μA

0.0488 %

Serial

3 V

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSSOP8,.1

Other Converters

8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e3

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

DAC8562TDGSR

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

100 kHz

1

16

7 µs

Serial

5.5 V

Small Outline, Thin Profile, Shrink Pitch

7 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC8563TDGSR

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

100 kHz

1

16

7 µs

Serial

5.5 V

Small Outline, Thin Profile, Shrink Pitch

7 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC8568IDPW

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

100 kHz

1

16

10 µs

1.6 mA

0.0183 %

Serial

3.6 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Dual

R-PDSO-G16

2

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC2635HMSE-HMI12#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635HMSE-LMI12#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

4.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2664HUH-16#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0061 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

-10 V

0.197 in (5 mm)

Binary

MCP47CMB11-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

10

620 μA

0.0244 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB11-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

12

620 μA

0.0244 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB01-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

8

620 μA

0.0391 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47FEB22A0T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.46 V

Yes

1

TS 16949

12

700 μA

0.1464 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

.01 V

0.173 in (4.4 mm)

Binary

MCP47FVB22A0-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB22A0T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB22A1-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB22A1T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB22A2-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB22A2T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB22A3-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB22A3T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP4822T-E/SN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

4.176 V

Yes

1

TS 16949

12

750 μA

0.293 %

Serial

5 V

3/5 V

Small Outline

SOP8,.23

Other Converters

4.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

AD5065ARUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

14

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

16

13 µs

2.7 mA

0.0061 %

Serial

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP14,.25

Other Converters

10.7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G14

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5673RBCPZ-2

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

12

8 µs

4.2 mA

0.02441 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5673RBCPZ-2-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

12

8 µs

4.2 mA

0.02441 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.