Automotive Digital-to-Analog Converters 1,826

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC60502DRXR

Texas Instruments

Digital to Analog converter

Automotive

No Lead

10

SON

Square

Plastic/Epoxy

5.5 V

Yes

1

12

5 µs

0.0244 %

Serial

5 V

Small Outline

5 µs

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold/Silver

Dual

S-PDSO-N10

2

e4

30 s

260 °C (500 °F)

0 V

Binary

DAC7678SPW

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

83 kHz

1

12

10 µs

2 mA

0.0244 %

Serial

3.6 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G16

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary, 2's Complement Binary

DAC7678SPWR

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

83 kHz

1

12

10 µs

2 mA

0.0244 %

Serial

3.6 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G16

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary, 2's Complement Binary

DAC7678SRGET

Texas Instruments

Digital to Analog converter

Automotive

No Lead

24

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

83 kHz

1

12

10 µs

6 μA

0.0244 %

Serial

3.6 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC24,.16SQ,20

Other Converters

7 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N24

3

0.039 in (1 mm)

0.157 in (4 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary, 2's Complement Binary

LTC2633HTS8-LO8#TRMPBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.4 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2635HMSE-LMO8#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

3.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635HMSE-LZ8#PBF

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

3.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635HUD-LMI8#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2635HUD-LMX12#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2636HDE-LZ12#PBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2666HUH-12#TRPBF

Analog Devices

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

1

CMOS

12

0.0076 %

Serial

15 V

-15 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-N32

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

0.197 in (5 mm)

Binary

MAX5825AWP+T

Analog Devices

Digital to Analog converter

Automotive

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

12

2.5 mA

0.0244 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

Other Converters

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.089 in (2.255 mm)

No

e2

30 s

260 °C (500 °F)

0 V

0.099 in (2.505 mm)

Binary

MCP4716A2T-E/MAY

Microchip Technology

Digital to Analog converter

Automotive

No Lead

6

HVSON

Square

Plastic/Epoxy

Yes

1

TS 16949

10

400 μA

0.354 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

TSSOP6,.08

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N6

1

0.035 in (0.9 mm)

0.079 in (2 mm)

e4

40 s

260 °C (500 °F)

0.079 in (2 mm)

Binary

MCP47A1T-A0E/LT

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

TS 16949

6

220 μA

1.56 %

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

Other Converters

15 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G6

0.043 in (1.1 mm)

0.049 in (1.25 mm)

No

e3

0 V

0.079 in (2 mm)

Binary

MCP47CVB21-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

12

620 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB22-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

12

720 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47FVB11A0-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

500 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A0T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A1T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A2-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A2T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A3-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

10

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB12A3T-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

700 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB21A1-E/ST

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

TS 16949

12

500 μA

0.1465 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.047 in (1.2 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.173 in (4.4 mm)

Binary

MCP47FVB28-E/MQ

Microchip Technology

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

Plastic/Epoxy

Yes

1

12

3 mA

0.146484375 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

7.8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N20

0.039 in (1 mm)

0.197 in (5 mm)

0.197 in (5 mm)

Binary

MCP48FVB11T-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

Yes

1

TS 16949

10

1.7 mA

0.0488 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP10,.19,20

7.8 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G10

2

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

40 s

260 °C (500 °F)

0.118 in (3 mm)

Binary

TLV5638QDR

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.1 V

Yes

233 kHz

1

CMOS

12

7 µs

5.4 mA

0.1465 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

AD5318ARU-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

1.8 mA

0.3906 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

Other Converters

7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

.001 V

0.197 in (5 mm)

Binary

AD5424YRUZ-REEL

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

CMOS

8

60 ns

5 μA

0.0977 %

Parallel, 8 Bits

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

30 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

40 s

260 °C (500 °F)

.4 V

0.197 in (5 mm)

Binary

AD5453YRM

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

CMOS

14

110 ns

10 μA

0.0122 %

Serial

3.5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

16 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

240 °C (464 °F)

0.118 in (3 mm)

Binary

AD5570WRSZ-REEL

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

14 V

Yes

1

BICMOS

16

16 µs

5 mA

0.0031 %

Serial

12 V

±12/±15 V

-12 V

Small Outline, Shrink Pitch

SSOP16,.3

Other Converters

12 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

-14 V

0.244 in (6.2 mm)

Binary

AD5601BKSZ-500RL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

10 µs

0.1953 %

Serial

5 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G6

1

0.043 in (1.1 mm)

0.049 in (1.25 mm)

No

e4

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD5602YKSZ-1REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

10 µs

100 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Very Thin Profile, Shrink Pitch

TSSOP6,.08

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e4

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD5602YKSZ-2REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

10 µs

100 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Very Thin Profile, Shrink Pitch

TSSOP6,.08

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e4

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD5672RBCPZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HQCCN

Square

5 V

Yes

1

12

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD5672RBRUZ

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

12

0.0244 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD5676BCPZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5.5 V

Yes

1

16

0.0046 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5676RACPZ-RL

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5 V

Yes

1

16

0.0122 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

DAC101C085CIMMX/NOPB

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

180 kHz

1

CMOS

10

6 µs

152 μA

0.1953 %

Serial

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Other Converters

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC43401DSGRQ1

Texas Instruments

Digital to Analog converter

Automotive

No Lead

8

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

22 kHz

1

AEC-Q100

8

0.3906 %

Serial

18 V

Small Outline, Heat Sink/Slug

LCC8,.08SQ,20

10 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N8

2

0.031 in (0.8 mm)

0.079 in (2 mm)

e4

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

DAC5578SPWR

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

Yes

83 kHz

1

8

10 µs

1.4 mA

0.097 %

Serial

5 V

3/5 V

Small Outline

TSSOP16,.25

Other Converters

7 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Dual

R-PDSO-G16

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

260 °C (500 °F)

0.197 in (5 mm)

Binary

DAC60504BRTER

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

11 V

Yes

1

12

2 µs

0.0244 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N16

2

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC60508MCRTET

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N16

2

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC60508ZRTER

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

6 mA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N16

2

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC70508MYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

14

5 µs

6 mA

0.0061 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC70508MYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

14

5 µs

6 mA

0.0061 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC70508ZRTER

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

14

5 µs

6 mA

0.0061 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N16

2

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC70508ZYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

14

5 µs

6 mA

0.0061 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.