Commercial Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7528KFN

Texas Instruments

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 V

Yes

1

CMOS

8

0 ns

500 μA

0.195 %

Parallel, 8 Bits

15 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J20

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

-25 V

0.353 in (8.9662 mm)

Offset Binary, Complementary Binary

UCC5950J

Texas Instruments

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

BICMOS

10

2.5 µs

5 mA

0.1953 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

1.4 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

2's Complement Binary

DAC56P

Texas Instruments

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

3.34 V

No

1

16

0.012 %

Serial

5 V

±5 V

-5 V

In-Line

DIP16,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

-3.34 V

0.76 in (19.305 mm)

2's Complement Binary

DAC715PKG4

Texas Instruments

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

16

10 µs

0.0031 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.3

Other Converters

6 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T28

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

0 V

1.405 in (35.69 mm)

2's Complement Binary

DAC7741YL/2KG4

Texas Instruments

Digital to Analog converter

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

10 V

Yes

1

16

5 µs

0.0031 %

Parallel, Word

15 V

5,±15 V

-15 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Other Converters

233 ns

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQFP-G48

0.063 in (1.6 mm)

0.276 in (7 mm)

No

-10 V

0.276 in (7 mm)

Binary, Offset Binary

LTC2606CDD-1#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

10 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

ADV7122KPZ30

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

10

125 mA

0.195 %

Parallel, 8 Bits

5 V

5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.5862 mm)

No

e3

260 °C (500 °F)

0.653 in (16.5862 mm)

Binary

LTC2611CDD-1#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD7535KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

14

2 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

0.453 in (11.5062 mm)

Binary, Offset Binary

LTC1660CGN#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

Yes

8

10

0.2441 %

Serial

3 V

Small Outline, Shrink Pitch

30 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

e0

0.193 in (4.9 mm)

Binary

LTC2630ACSC6-LZ12#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD569JN/+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

16

6 µs

26 mA

0.04 %

12 V

±12 V

-12 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

e0

Binary, Offset Binary

LTC1657CGN#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

16

0.0183 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

20 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.39 in (9.9 mm)

Binary

AD664KNZ-BIP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

13 V

No

4

BICMOS

12

10 µs

19 mA

0.0183 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

-13 V

1.472 in (37.4 mm)

Binary

LTC2636CDE-LMX12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

DAC01CY

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

14

DIP

Rectangular

Ceramic, Glass-Sealed

11.89 V

No

1

Bipolar

6

3 µs

9.3 mA

0.391 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP14,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T14

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-11.89 V

0.765 in (19.43 mm)

Binary, 2's Complement Binary, 1's Complement Binary, Complementary Offset Binary

AD7245JN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

12

10 µs

12 mA

0.0244 %

Parallel, Word

12 V

12/15,GND/-12/-15 V

-12 V

In-Line

DIP24,.3

Other Converters

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.19 in (4.82 mm)

0.3 in (7.62 mm)

No

e0

-5 V

1.227 in (31.165 mm)

Binary

LTC2640CTS8-HM10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

PMADV7120KP50

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

100 mA

0.39 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

Binary

PM7541AHPC

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

2 mA

0.012 %

15 V

15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J20

No

e0

Binary, Offset Binary

ADV101KP80

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

125 mA

0.3906 %

Parallel, 8 Bits

5 V

5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

0.18 in (4.57 mm)

0.653 in (16.5862 mm)

No

e0

0.653 in (16.5862 mm)

Binary

LTC2654CGN-H12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Small Outline, Shrink Pitch

4.6 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.192 in (4.88 mm)

Binary

LTC1458LCG#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

4.145 V

Yes

4

CMOS

12

0.1099 %

Serial

3 V

Small Outline, Shrink Pitch

14 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

4.045 V

0.402 in (10.2 mm)

Binary

AD7527GLN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

Binary

AD557JP-REEL7

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

2.56 V

Yes

1

Bipolar

8

2 µs

25 mA

0.3906 %

Parallel, 8 Bits

5 V

5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.565 mm)

0.353 in (8.966 mm)

No

e0

225 °C (437 °F)

0 V

0.353 in (8.966 mm)

Complementary Offset Binary

LTC2630ACSC6-LM10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.9 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

0.039 in (1 mm)

0.049 in (1.25 mm)

e3

0 V

0.079 in (2 mm)

Binary

LTC2631CTS8-LZ8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

8

0.1953 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

DAC210N

Analog Devices

Digital to Analog converter

Commercial

No Lead

18

DIE

Rectangular

10 V

Yes

1

Bipolar

11

0.05 %

Parallel, Word

15 V

-15 V

Uncased Chip

1.5 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

-10 V

Binary

5962-01-262-9444

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

8

3 µs

25 mA

0.1 %

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T16

No

Binary

AD664KN-UNIZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

13 V

No

4

BICMOS

12

19 mA

0.0183 %

Parallel, Word

15 V

-15 V

In-Line

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

0 V

1.472 in (37.4 mm)

Binary

LTC7545AKSW

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

12

1 µs

2 mA

0.0122 %

Parallel, Word

15 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0 V

0.504 in (12.8 mm)

Binary, Offset Binary

AD9713JN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

3 V

No

1

Bipolar

12

175 mA

0.0977 %

Parallel, Word

5 V

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

30 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-1.2 V

1.472 in (37.4 mm)

Binary

LTC2629CGN-1

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

12

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

7 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.8895 mm)

Binary

LTC2636CMS-LMI10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

AD7544JN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

Binary

LTC2630CSC6-LZ12#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

12

0.0488 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC2636CMS-HZ10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

4.3 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

AD7538KNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

14

2 µs

4 mA

0.006 %

Parallel, Word

12/15,-0.3 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.2 in (30.48 mm)

Binary

AD7545JP

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2 mA

0.0488 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

225 °C (437 °F)

0.353 in (8.9662 mm)

Binary

DAC08CQ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

8

0 ns

7.8 mA

0.39 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

85 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

0.75 in (19.05 mm)

Binary

LTC2753ACUK-16#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

16

0.0015 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.276 in (7 mm)

Binary

LTC1664CGN

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.2441 %

Serial

3 V

Small Outline, Shrink Pitch

19 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0 V

0.193 in (4.9 mm)

Binary

LTC2637CMS-LMI8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

3.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

AD7541AKR-REEL

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

15 V

Small Outline

SOP18,.4

Other Converters

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.455 in (11.55 mm)

Binary, Offset Binary

LTC2635CMSE-LMO10#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

4.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC1599BCG#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0031 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.323 in (8.2 mm)

Binary

PMADV478KP80

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

200 mA

0.39 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

Binary

LTC1821-1BCGW#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

36

SSOP

Rectangular

Plastic/Epoxy

12.6 V

Yes

1

16

0.0031 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

2 µs

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G36

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-12.6 V

0.606 in (15.4 mm)

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.