Commercial Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC2630ACSC6-LM8#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.3906 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

0 V

0.079 in (2 mm)

Binary

ADDAC1136J

Analog Devices

Digital to Analog converter

Commercial

Pin/Peg

72

Rectangular

10 V

No

1

16

0.0015 %

Parallel, Word

15 V

-15 V

Microelectronic Assembly

250 µs

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDMA-P72

No

e0

-10 V

Complementary Binary, Complementary Offset Binary

LTC2635CUD-HMO10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.3 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

0 V

0.118 in (3 mm)

Binary

LTC2632CTS8-LI8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

600 μA

0.1953 %

Parallel, 8 Bits

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

3.5 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD7544GKN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

Binary

AD1851R-J

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

3.12 V

Yes

1

BICMOS

16

15 mA

Serial

5 V

±5 V

-5 V

Small Outline

SOP16,.4

Other Converters

1.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

-2.88 V

0.406 in (10.3 mm)

2's Complement Binary

AD7228KN/+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

8

BICMOS

8

7 µs

20 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

e0

Binary

LTC1658CS8

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0488 %

Serial

3 V

Small Outline

12 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0 V

0.193 in (4.9 mm)

Binary

LTC7541AKN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

In-Line

600 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

LTC2640CTS8-HZ10#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC1669-8CMS8

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

10

0.2441 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

30 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

Binary

LTC1663ES5#TRM

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

5

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

10

0.293 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

30 µs

0.037 in (0.95 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G5

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e0

0 V

0.114 in (2.9 mm)

Binary

LTC1458LCSW#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.245 V

Yes

4

CMOS

12

0.1099 %

Serial

5 V

Small Outline

14 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.642 mm)

0.295 in (7.5 mm)

No

e0

1.195 V

0.704 in (17.89 mm)

Binary

LTC2631CTS8-HZ12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

12

0.061 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.6 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC1426CS8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

2

6

100 μA

0.0781 %

Serial

5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

0 V

0.193 in (4.9 mm)

Binary

LTC2612CMS8

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

9 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

AD75004KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

4

BICMOS

12

4 µs

30 mA

0.0183 %

Parallel, 8 Bits

12 V

±12 V

-12 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

-5 V

0.453 in (11.5062 mm)

Binary

LTC2632ACTS8-LX12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

600 μA

0.036 %

Parallel, Word

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

4.4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2633CTS8-LI10#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2637CMS-LMI10#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

10

0.0977 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

4.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

LTC7541AJSW

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

2 mA

0.0244 %

Parallel, Word

15 V

Small Outline

600 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

Binary, Offset Binary

PM7224GP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

12.5 V

No

1

CMOS

8

5 µs

6 mA

0.195 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.885 in (22.48 mm)

Binary

LTC1662CMS8#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.494 V

Yes

1

CMOS

10

0.3906 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

750 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

Binary

AD7545AKPZ

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e3

260 °C (500 °F)

0.353 in (8.9662 mm)

Binary, 2's Complement Binary

LTC2636CDE-LMI12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD7846JP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

9 µs

0.0244 %

Parallel, Word

15 V

5,±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

7 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

5

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.505 mm)

Binary, Offset Binary

LTC2640CTS8-HZ8#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

8

0.1953 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

3.7 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

PMADV7122KP80

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

10

125 mA

0.2 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J44

No

e0

Binary

LTC1657LCGN#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

16

0.0183 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

20 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.39 in (9.9 mm)

Binary

LTC2637CDE-LMI8#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

14

HVSON

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

3.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-N14

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC2630CSC6-LZ12#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

12

0.0488 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD7845KRZ-REEL

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

12

5 µs

0.0183 %

Parallel, Word

15 V

-15 V

Small Outline

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.606 in (15.4 mm)

Binary, Offset Binary

LTC1454CS#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

4.145 V

Yes

2

CMOS

12

1.25 mA

0.1099 %

Serial

5 V

Small Outline

14 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.39 in (9.9 mm)

Binary

LTC2637CMS-HMI10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

4.3 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

LTC2755CUP-12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

10 V

Yes

1

12

0.0244 %

Parallel, Word

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.354 in (9 mm)

Binary

LTC2632CTS8-HZ8#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

700 μA

0.1953 %

Parallel, 8 Bits

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

3.9 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2640CTS8-LM8#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC1589CG

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

14

0.0061 %

Serial

5 V

Small Outline, Shrink Pitch

2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.209 in (5.3 mm)

No

e0

-10 V

0.244 in (6.2 mm)

Binary

LTC2634CMSE-LMI12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

4.2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

5962-01-426-1602

Analog Devices

Digital to Analog converter

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

220 mA

0.39 %

5 V

5 V

Chip Carrier

LDCC44,.7SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J44

No

LTC2609CGN-1#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

10 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

AD569KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

6 µs

13 mA

0.024 %

Parallel, Word

12 V

±12 V

-12 V

Chip Carrier

LDCC28,.5SQ

Other Converters

4 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

-5 V

0.453 in (11.5062 mm)

Binary

LTC2631ACTS8-HZ12#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.6 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2630ACSC6-LM12#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC2630CSC6-LZ8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

8

0.1953 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC1446LCS8#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2.54 V

Yes

2

CMOS

12

0.1221 %

Serial

3 V

Small Outline

14 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

2.46 V

0.193 in (4.9 mm)

Binary

LTC2640CTS8-HZ12#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.061 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.6 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC1663-8CMS8#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.2441 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

30 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.