Commercial Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7845KNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

12

5 µs

10 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T24

0.19 in (4.82 mm)

0.3 in (7.62 mm)

No

e3

-10 V

1.227 in (31.165 mm)

Binary, Offset Binary

LTC1657LCGN#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

16

0.0183 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

20 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

e0

0 V

0.39 in (9.9 mm)

Binary

AD558KNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

2.56 V

No

1

Bipolar

8

3 µs

25 mA

0.0977 %

Parallel, 8 Bits

5 V

5/15 V

In-Line

DIP16,.3

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0 V

0.793 in (20.13 mm)

Complementary Offset Binary

LTC2633ACTS8-HI12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.7 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2640CTS8-HM10#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

HDS-0820

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

.512 V

No

1

Bipolar

8

0.0977 %

Parallel, 8 Bits

15 V

-15 V

In-Line

DIP24,.6

Other Converters

45 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.215 in (5.457 mm)

0.6 in (15.24 mm)

No

e0

-.512 V

1.295 in (32.89 mm)

Binary, Offset Binary

LTC1596-1BCN#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

16

0.0031 %

Serial

5 V

In-Line

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

-10 V

Binary, Offset Binary

LTC1821-1ACGW#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

36

SSOP

Rectangular

Plastic/Epoxy

12.6 V

Yes

1

16

0.0015 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

2 µs

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G36

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-12.6 V

0.606 in (15.4 mm)

Binary, Offset Binary

LTC2615CGN-1#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

9 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.8895 mm)

Binary

LTC2634CUD-HMI10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

10

0.0977 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.2 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC1663-8CMS8#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.2441 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

30 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC1650CS#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

16

0.0244 %

Serial

5 V

-5 V

Small Outline

4 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

-4.096 V

0.39 in (9.9 mm)

Binary

ADDAC80Z-CCD-I

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

0.0122 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary Coded Decimal

LTC1669CS5#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

5

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

10

0.2441 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

30 µs

0.037 in (0.95 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G5

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD7247JP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

BICMOS

12

10 µs

15 mA

0.024 %

12/15,GND/-12/-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

Binary, Offset Binary

LTC2637CMS-HMX12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

12

0.061 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

LTC2656BCUFD-L16#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

0.0061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

8.9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC2637CMS-LMX12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

8

CMOS

12

0.061 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

4.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

AD394JM

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Metal

10 V

No

4

CMOS

12

15 µs

28 mA

0.0732 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-MDIP-T28

0.205 in (5.21 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.57 in (39.88 mm)

Binary

ADDAC80NZ-CBI-V

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

4 µs

0.012 %

±12/±15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T24

No

e3

Complementary Binary, Complementary Offset Binary

LTC2635CMSE-LMO12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

4.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2655CGN-L12#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

4

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Shrink Pitch

2.4 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

AD558KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

2.56 V

Yes

1

Bipolar

8

3 µs

25 mA

0.0977 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.966 mm)

No

e0

225 °C (437 °F)

0 V

0.353 in (8.966 mm)

Complementary Offset Binary

LTC2633ACTS8-HZ12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.7 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD7527LN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

Binary

AD394KD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

15 µs

28 mA

0.012 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Offset Binary

AD1851R-J-REEL7

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

3.12 V

Yes

1

BICMOS

16

Serial

5 V

-5 V

Small Outline

1.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

-2.88 V

0.406 in (10.3 mm)

2's Complement Binary

LTC1663CMS8#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.2441 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

30 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

20 s

235 °C (455 °F)

0 V

0.118 in (3 mm)

Binary

LTC1663-2CS5#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

5

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.2441 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

30 µs

0.037 in (0.95 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G5

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e0

0 V

0.114 in (2.9 mm)

Binary

LTC1329ACS8-50#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

8

150 μA

Serial

3.3 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

Binary

LTC2631ACTS8-HM12#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.6 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

AD7247KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

BICMOS

12

10 µs

15 mA

0.012 %

12/15,GND/-12/-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

Binary, Offset Binary

LTC2633ACTS8-LI12#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.5 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

DAC8221BIHP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

0.0244 %

Parallel, Word

5 V

In-Line

450 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

Offset Binary

AD7545AKR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

2 mA

0.01 %

Parallel, Word

5 V

5/15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

30 s

240 °C (464 °F)

0.504 in (12.8 mm)

Binary, 2's Complement Binary

LTC2629CGN#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

7 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.8895 mm)

Binary

LTC1450CN#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

0.0977 %

Parallel, Word

5 V

In-Line

14 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T24

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

Binary

LTC2642CMS-14#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.0061 %

Serial

3 V

Small Outline

1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

-2.5 V

0.118 in (3 mm)

Offset Binary

LTC1450LCG#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

0.0977 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

14 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.323 in (8.2 mm)

Binary

LTC2644CMS-L10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

12

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

6 mA

0.0977 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP12,.19

7.4 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G12

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

LTC2635CUD-LMI12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.061 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC1669CS5#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

5

VSSOP

Rectangular

Plastic/Epoxy

Yes

1

10

0.2441 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

30 µs

0.037 in (0.95 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G5

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

Binary

AD7545ALP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

225 °C (437 °F)

0.353 in (8.9662 mm)

Binary, 2's Complement Binary

LTC1596BCSW#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0031 %

Serial

5 V

Small Outline

1 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.104 in (2.642 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.405 in (10.2995 mm)

Binary, Offset Binary

LTC1663ES5

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

5

VSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.293 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

30 µs

0.037 in (0.95 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G5

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e0

0 V

0.114 in (2.9 mm)

Binary

LTC2657BCUFD-H16#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

16

0.0061 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

9.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

DAC08BICS

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

8

0.039 %

Parallel, 8 Bits

15 V

-15 V

Small Outline

85 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G16

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0.39 in (9.9 mm)

Complementary Binary

AD767KPZ

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

Bipolar

12

4 µs

23 mA

0.0122 %

Serial

15 V

±12/±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

3 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e3

260 °C (500 °F)

-10 V

0.453 in (11.506 mm)

Binary, Offset Binary, 2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.