Commercial Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD664JNZ-UNI

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

13 V

No

4

BICMOS

12

10 µs

19 mA

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

0 V

1.472 in (37.4 mm)

Binary

AD7545AKRZ

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

2 mA

0.01 %

Parallel, Word

5 V

5/15 V

Small Outline

SOP20,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

Binary, 2's Complement Binary

LTC2631CTS8-HM10#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

10

0.0977 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2654CGN-H12#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Small Outline, Shrink Pitch

4.6 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.192 in (4.88 mm)

Binary

LTC1821ACGW#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

36

SSOP

Rectangular

Plastic/Epoxy

12.6 V

Yes

1

16

0.0015 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

2 µs

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G36

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

-12.6 V

0.606 in (15.4 mm)

Binary, Offset Binary

5962-01-229-8852

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

12

0.012 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

No

Complementary Binary, Complementary Offset Binary

AD664JN-BIPZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

13 V

No

4

BICMOS

12

19 mA

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-13 V

1.472 in (37.4 mm)

Binary

LTC2635CUD-LZ8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC2631ACTS8-LM8#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

0 V

0.114 in (2.9 mm)

Binary

LTC2631CTS8-LM8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

8

0.1953 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

3.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC1591-1CG

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

14

0.0061 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

-10 V

0.402 in (10.2 mm)

Binary

ADDAC80-CBI-I

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

0.0122 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

LTC1659CS8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

12

0.1343 %

Serial

3 V

Small Outline

14 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.9025 mm)

Binary

DAC06EX

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

Bipolar

10

0.2 %

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Binary

LTC2656CFE-L12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

HTSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

4.2 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

LTC1660CGN

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.494 V

Yes

8

10

0.2441 %

Serial

3 V

Small Outline, Shrink Pitch

30 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

1

0.068 in (1.727 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.8895 mm)

Binary

DAC08EQ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

8

0 ns

7.8 mA

0.19 %

Parallel, 8 Bits

15 V

±15 V

-15 V

In-Line

DIP16,.3

Other Converters

85 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

0.75 in (19.05 mm)

Binary

AD667JN/+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

Bipolar

12

4 µs

25 mA

0.0183 %

Parallel, Word

12 V

±12/±15 V

-12 V

In-Line

DIP28,.6

Other Converters

3 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.445 in (36.705 mm)

Binary, Offset Binary, 2's Complement Binary

LTC2635CUD-LMO10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

PMADV453KN40

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

8

250 mA

0.4 %

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T40

No

e0

Binary

LTC2611CDD-1#TR

Analog Devices

Digital to Analog converter

Commercial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

14

0.0977 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

S-PDSO-N10

1

0.031 in (0.8 mm)

0.118 in (3 mm)

No

e0

0 V

0.118 in (3 mm)

Binary

LTC2704CGW-14

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

44

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

4

14

0.0061 %

Serial

5 V

Small Outline, Shrink Pitch

9 µs

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G44

1

0.094 in (2.39 mm)

0.295 in (7.5 mm)

No

e0

-10 V

0.702 in (17.83 mm)

Binary

LTC2636CMS-HMI10#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

8

CMOS

10

0.0977 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

4.3 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.159 in (4.039 mm)

Binary

AD7840JN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

3 V

No

1

BICMOS

14

4 µs

14 mA

0.0122 %

Serial, Parallel, Word

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-3 V

1.2 in (30.48 mm)

2's Complement Binary

LTC2631ACTS8-HM12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

4.6 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2619CGN

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

14

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

9 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0 V

0.193 in (4.8895 mm)

Binary

LTC2631ACTS8-LM12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2635CMSE-LZ8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

8

0.1953 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

3.5 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

LTC7545ALG

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

12

0.0122 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

AD7118KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

6

2 mA

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J20

No

e0

Binary

AD7538KRZ-REEL

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

14

2 µs

4 mA

0.006 %

Parallel, Word

12/15,-0.3 V

Small Outline

SOP24,.4

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

0.606 in (15.4 mm)

Binary

5962-01-152-5221

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

10

0.05 %

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T28

No

Binary

LTC1428CS8-50

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

Yes

1

8

225 μA

Serial

3.3 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

0.193 in (4.9 mm)

Binary

LTC2635CUD-LMO10#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

4.1 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

ADDAC80-CCD-V

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

0.0122 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary Coded Decimal

PM7541AHP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

No

e0

Binary, Offset Binary

AD7545ALPZ

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

1 µs

0.012 %

Parallel, Word

5 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e3

260 °C (500 °F)

0.353 in (8.9662 mm)

Binary, 2's Complement Binary

ADV473KP80-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

68

QCCJ

Square

Plastic/Epoxy

Yes

3

CMOS

8

13 ns

250 mA

0.391 %

Parallel, 8 Bits

5 V

5 V

Chip Carrier

LDCC68,1.0SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J68

0.175 in (4.45 mm)

0.954 in (24.2316 mm)

No

e0

0.954 in (24.2316 mm)

Binary

AD558KN/+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

8

3 µs

25 mA

0.1 %

5/15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T16

e0

Binary

LTC2631ACTS8-LZ12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

4.1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC2615CGN#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

9 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

LTC1446LCN8#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2.54 V

No

2

CMOS

12

0.1221 %

Serial

3 V

In-Line

14 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T8

1

0.15 in (3.809 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

2.46 V

Binary

AD9712JN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

3 V

No

1

Bipolar

12

170 mA

0.0977 %

Parallel, Word

5 V

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

30 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-1.2 V

1.472 in (37.4 mm)

Binary

DAC08HPZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

18 V

No

1

8

0 ns

0.1 %

Parallel, 8 Bits

15 V

-15 V

In-Line

85 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

-10 V

0.793 in (20.13 mm)

Binary

LTC2630CSC6-HZ8#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

8

0.1953 %

Serial

5 V

Small Outline, Very Thin Profile, Shrink Pitch

3.7 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.049 in (1.25 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

LTC2632CTS8-HI12#TRMPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

8

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

700 μA

0.061 %

Parallel, Word

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.1

4.9 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0 V

0.114 in (2.9 mm)

Binary

LTC1665CN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5.478 V

No

8

CMOS

8

0.3906 %

Serial

5 V

In-Line

30 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T16

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary

LTC2609CGN#TRPBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0977 %

Serial

5 V

Small Outline, Shrink Pitch

10 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.193 in (4.8895 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.