Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
14 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
48 kHz |
1 |
8 |
10 µs |
2 mA |
0.3906 % |
Serial |
5 V |
5 V |
Small Outline |
SOP14,.25 |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G14 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.905 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.341 in (8.65 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
0.0977 % |
Parallel, Word |
5 V |
Small Outline, Shrink Pitch |
14 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.323 in (8.2 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Ball |
170 |
LFBGA |
Rectangular |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
16 |
0.0061 % |
Serial, Parallel, Word |
1.86 V |
Grid Array, Low Profile, Fine Pitch |
2.2 ns |
0.031 in (0.8 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B170 |
3 |
0.067 in (1.69 mm) |
0.354 in (9 mm) |
e1 |
-1 V |
0.591 in (15 mm) |
2's Complement Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
5 V |
Yes |
1 |
CMOS |
16 |
1.035 A |
0.0977 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
8.7 ms |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-N32 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e3 |
-5 V |
0.197 in (5 mm) |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
12.5 V |
Yes |
2 |
CMOS |
12 |
10 mA |
0.0244 % |
Serial |
15 V |
±12/±15 V |
-15 V |
Small Outline |
SOP16,.4 |
Other Converters |
2.5 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
-12.5 V |
0.406 in (10.3 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
12.5 V |
Yes |
2 |
CMOS |
12 |
10 mA |
0.0244 % |
Serial |
15 V |
±12/±15 V |
-15 V |
Small Outline |
SOP16,.4 |
Other Converters |
2.5 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G16 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-12.5 V |
0.406 in (10.3 mm) |
Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
16 |
9 µs |
0.0122 % |
Parallel, Word |
15 V |
5,±15 V |
-15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
7 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
5 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e3 |
260 °C (500 °F) |
-10 V |
0.453 in (11.505 mm) |
Binary, Offset Binary |
|||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
14 |
SOP |
Rectangular |
Plastic/Epoxy |
7 V |
Yes |
48 kHz |
1 |
CMOS |
8 |
10 µs |
2 mA |
0.3906 % |
Serial |
5 V |
5 V |
Small Outline |
SOP14,.25 |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G14 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.905 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.341 in (8.65 mm) |
Binary |
|||||||||||||
Texas Instruments |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
12 |
4 µs |
0.0122 % |
Parallel, Word |
15 V |
±12/±15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Dual |
R-CDIP-T24 |
0.175 in (4.45 mm) |
0.62 in (15.75 mm) |
No |
-10 V |
1.2 in (30.48 mm) |
Complementary Binary, Complementary 2's Complement, Complementary Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
16 |
0.0061 % |
Serial |
5 V |
Small Outline |
1 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-10 V |
0.193 in (4.9 mm) |
Binary, Offset Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
Yes |
4 |
CMOS |
16 |
0.0977 % |
Serial |
3 V |
Small Outline, Shrink Pitch |
10 µs |
0.025 in (0.635 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
No |
e0 |
0.193 in (4.8895 mm) |
Binary |
||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
18 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
15 V |
Small Outline |
SOP18,.4 |
Other Converters |
600 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G18 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
0.455 in (11.55 mm) |
Binary, Offset Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
12 |
0.0122 % |
Serial |
3 V |
Small Outline |
1 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
12 |
HVSON |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
12 |
0.0977 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
7 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
2 |
BICMOS |
8 |
5 mA |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
2 |
BICMOS |
8 |
5 mA |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
8 |
500 ns |
2 mA |
0.1953 % |
Parallel, 8 Bits |
5 V |
5/15 V |
Small Outline |
SOP16,.25 |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.406 in (10.3 mm) |
Binary, Offset Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
8 |
500 ns |
2 mA |
0.1953 % |
Parallel, 8 Bits |
5 V |
5/15 V |
Small Outline |
SOP16,.25 |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G16 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.406 in (10.3 mm) |
Binary, Offset Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
4.5 V |
Yes |
1 |
CMOS |
16 |
1.1 mA |
0.0031 % |
Serial |
3 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
2 mA |
0.012 % |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T18 |
e0 |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
18 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
2 mA |
0.012 % |
Parallel, Word |
15 V |
15 V |
In-Line |
DIP18,.3 |
Other Converters |
600 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T18 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.885 in (22.479 mm) |
Binary, Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
2 |
12 |
700 μA |
0.1343 % |
Serial |
3 V |
Small Outline |
14 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
1 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
Binary, Offset Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
.4 V |
No |
6.6 MHz |
1 |
Bipolar |
8 |
150 ns |
22 mA |
0.39 % |
Parallel, 8 Bits |
5 V |
5,-15 V |
-15 V |
In-Line |
DIP16,.3 |
Other Converters |
150 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T16 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e3 |
-5 V |
0.856 in (21.755 mm) |
Binary |
||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
16 |
1.1 mA |
0.0244 % |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
16 |
1.1 mA |
0.0244 % |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
6.15 V |
Yes |
1 |
24 |
40 mA |
Serial |
5 V |
3.3,5 V |
Flatpack, Thin Profile, Fine Pitch |
QFP48,.35SQ,20 |
Other Converters |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-10 °C (14 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G48 |
2 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.276 in (7 mm) |
2's Complement Binary |
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Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
5.5 V |
No |
1 |
CMOS |
8 |
1.3 mA |
0.7812 % |
Serial |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
8 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.755 in (19.175 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
5.5 V |
No |
1 |
CMOS |
8 |
1.3 mA |
0.7812 % |
Serial |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
8 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.755 in (19.175 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
4.096 V |
No |
1 |
CMOS |
16 |
0.0305 % |
Serial |
5 V |
In-Line |
20 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T8 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
0.0977 % |
Serial |
5 V |
Small Outline, Shrink Pitch |
7 µs |
0.025 in (0.635 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.8895 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
18 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
15 V |
Small Outline |
SOP18,.4 |
Other Converters |
600 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G18 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
0.455 in (11.55 mm) |
Binary, Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
18 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
15 V |
Small Outline |
SOP18,.4 |
Other Converters |
600 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G18 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
0.455 in (11.55 mm) |
Binary, Offset Binary |
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|
Texas Instruments |
Digital to Analog converter |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
8 |
0.2 % |
Parallel, 8 Bits |
4.75 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
1 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.026 in (26.073 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
12 |
0.061 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
4.4 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
5 V |
Yes |
1 |
CMOS |
16 |
1.035 A |
0.0977 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
8.7 ms |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-N32 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e3 |
-5 V |
0.197 in (5 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
16 |
0.0061 % |
Serial |
15 V |
-15 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
20 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-N32 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e3 |
-10 V |
0.197 in (5 mm) |
Binary |
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Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
12.5 V |
No |
2 |
CMOS |
12 |
10 mA |
0.0122 % |
Serial |
15 V |
±12/±15 V |
-15 V |
In-Line |
DIP16,.3 |
Other Converters |
2.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
-12.5 V |
0.755 in (19.175 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
12.5 V |
No |
2 |
CMOS |
12 |
10 mA |
0.0122 % |
Serial |
15 V |
±12/±15 V |
-15 V |
In-Line |
DIP16,.3 |
Other Converters |
2.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-12.5 V |
0.755 in (19.175 mm) |
Binary |
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|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
14 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
48 kHz |
1 |
8 |
10 µs |
2 mA |
0.3906 % |
Serial |
3.3 V |
3.3 V |
Small Outline |
SOP14,.25 |
Other Converters |
10 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G14 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.905 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.341 in (8.65 mm) |
Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
14 |
0.0977 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
9 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
16 |
0.0015 % |
Serial |
3 V |
Small Outline |
1 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-2.5 V |
0.118 in (3 mm) |
Offset Binary |
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Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
4 |
CMOS |
8 |
10 mA |
Parallel, 8 Bits |
5 V |
5,GND/-5 V |
-5.5 V |
Small Outline |
SOP20,.4 |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
20 s |
245 °C (473 °F) |
-5.5 V |
0.504 in (12.8 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
4 |
CMOS |
8 |
10 mA |
Parallel, 8 Bits |
5 V |
5,GND/-5 V |
-5.5 V |
Small Outline |
SOP20,.4 |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-5.5 V |
0.504 in (12.8 mm) |
Binary |
|||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
2 |
BICMOS |
8 |
5 mA |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
2 |
BICMOS |
8 |
5 mA |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
6 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.193 in (4.9 mm) |
Binary |
||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
10 MHz |
1 |
CMOS |
8 |
100 ns |
2 mA |
0.1953 % |
Parallel, 8 Bits |
5 V |
5/15 V |
Small Outline |
SOP16,.3 |
Other Converters |
100 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G16 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-10 V |
0.402 in (10.2 mm) |
Binary, Offset Binary |
|||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
5.4 V |
Yes |
102 kHz |
1 |
CMOS |
10 |
20 ns |
1.35 mA |
0.1465 % |
Serial |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Other Converters |
3 µs |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold Silver |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0 V |
0.118 in (3 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.